https://nanyte.com/photoresists/ma-p-1275hv · last updated 2026-09-24
- Manufacturer
- micro resist technology GmbH
- Tone
- positive
- Chemistry
- DNQ-novolak
- Thickness
- 11–50 µm
- Applications
- Electroplating / molding · Etch mask
Cross-checked — two independent extractions agree on the spin curve and the single-value figures.
- Substrate
- Resist
- Exposed
Spin coating
Data points
| Series | rpm | µm |
|---|---|---|
| ma-P 1275 HV, 60 s spin time | 380 | 50 |
| 450 | 40 | |
| 600 | 30 | |
| 1000 | 20 |
Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool.
transcribed from the Film thicknesses table, p.2 of the ma-P 1200 series product sheet (ls.24.02.01) — the four ma-P 1275 HV entries tabulated at a 60 s spin time. The 11 µm entry is at 30 s and is kept out of this series.
- Four entries at a 60 s spin time form a real series: 50 µm at 380 rpm, 40 µm at 450, 30 µm at 600 and 20 µm at 1000.
- The fifth, 11 µm at 3000 rpm, uses a 30 s spin and is left out of it.
- The practical difference from standard ma-P 1275 is where the thicknesses land: HV reaches 20 µm at 1000 rpm where 1275 needs 500 rpm, and 40 µm at 450 rpm where 1275 needs 250.
- The sheet's smooth-line chart adds no numeric data.
- Adhesion
- Not addressed in this product sheet.
Soft bake
- Soft bake
- Not published — characterize on-tool
Exposure dose
No exposure dose is published for ma-P 1275 HV at any thickness. The sheet's example structures were all made on a mask aligner with broadband exposure, so a broadband dose matrix is the place to start. Run a dose array on your own tool to land the working dose.
Not published for this resist: Dose at 365 nm, Dose at 405 nm — characterize on-tool.
Development
Not published for this resist: Developer, Dilution, Time, Method, Rinse — characterize on-tool.
SOURCE: Unique features / Characteristics, p.1-2 of the ma-P 1200 series product sheet (ls.24.02.01)
Hard bake, etch & strip
- Etch resistance
- "High dry and wet etch resistance" and "High stability in acid and alkaline plating baths" (Characteristics, p.2).
Not published for this resist: Hard bake, Descum, Stripper, Storage — characterize on-tool.
Where it's used
Practical notes from the datasheet
ma-P 1275 HV is the high-viscosity sibling of ma-P 1275, sold for the same job — moulds for electroplated microstructures — but with a higher viscosity that reaches a given thickness at a higher spin speed. It covers 11 µm at 3000 rpm and 20-50 µm between 1000 and 380 rpm, where the standard grade needs 250-500 rpm for its thicker films and stops at 40 µm. The sheet shows it at 50 and 56 µm, and electroplated nickel structures up to 48 µm tall from it. It shares the series characteristics: high stability in plating baths, high dry and wet etch resistance, sidewalls up to 87° with broadband exposure, and suitability for reflow. What it lacks is any published exposure dose, so dose has to be found on-tool; the sheet also gives no softbake, developer product or develop time.
Grades in this family
Other grades in the ma-P 1200 series line differ mainly in coating thickness:
Troubleshooting
Common failure modes for ma-P 1275 HV, answered from the manufacturer's datasheet and application notes. These are starting points — your substrate, tooling and environment shift the specifics, so calibrate on-tool.
My ma-P 1275 HV coat has a thick bump in the centre, or scattered millimetre-size lumps. What went wrong?
MicroChemicals' trouble shooter covers both. A centimetre-wide bump where the resist landed often means it sat too long between dispense and spin start: solvent evaporates and a high-viscosity resist like ma-P 1275 HV stiffens and no longer thins out evenly. Start the spin promptly. Scattered lumps a millimetre or so across tend to be resist skin that dried in the dispense nozzle during a long idle or under strong exhaust and was flung onto the wafer; a small pre-dispense beside the substrate, a shorter idle, or reduced exhaust between dispenses prevents it.
SOURCE: MicroChemicals GmbH 'Photolithography Trouble Shooter'…
MicroChemicals GmbH 'Photolithography Trouble Shooter' application note — Bumps in the Resist Film after Spin-Coating? (resist clots; central superelevation), p.14; micro resist technology ma-P 1275 / 1275 HV sheet (ls.24.02.01) — subtitle 'Versatile high viscosity positive tone photoresists', p.2
How do I keep the edge bead down on 30–50 µm ma-P 1275 HV films?
Those thicknesses come from slow spins — 30 µm at 600 rpm, 40 µm at 450 and 50 µm at 380, each for 60 s — while MicroChemicals' trouble shooter notes that spinning a viscous resist fast is what normally suppresses the bead. Its other options: let the coated wafer rest level before the softbake, so the bead does not grow as heat lowers the viscosity on the hotplate; or raise the spin speed abruptly late in the coat to throw the bead off once the film is too dry to thin further, a profile found by trial. On round wafers, a solvent edge-bead rinse at about 500 rpm is the fallback.
SOURCE: micro resist technology ma-P 1275 / 1275 HV sheet…
micro resist technology ma-P 1275 / 1275 HV sheet (ls.24.02.01) — Film thicknesses table, p.2; MicroChemicals GmbH 'Photolithography Trouble Shooter' — Spin Coating: Edge Bead? (edge bead spin-off; delay between coating and softbake; circular substrates), p.2–3
A 40 µm ma-P 1275 HV film clears at the top but leaves resist at the bottom of the openings. Why?
MicroChemicals' trouble shooter explains it: DNQ positive resists need water back in the film after the softbake to develop at a reasonable rate, and it has to diffuse all the way down to the substrate. That rehydration takes about a minute for a 1 µm film but several hours for films beyond 30 µm, so a wafer exposed soon after baking develops well near the surface and slows lower down. Keep the room at a steady 40–50 % humidity during the wait; below about 40 % the development rate drops significantly. Underexposure gives a similar stall, so check both.
SOURCE: MicroChemicals GmbH 'Photolithography Trouble Shooter' —…
MicroChemicals GmbH 'Photolithography Trouble Shooter' — Development: Insufficient Development Rate, Sufficient Rehydration? p.6, and Sufficient Exposure Dose (thick resist films), p.7; micro resist technology ma-P 1275 / 1275 HV sheet (ls.24.02.01) — Film thicknesses table, p.2
ma-P 1275 HV cracks or blisters when I expose it at full lamp power. What should I change?
No exposure dose is published for ma-P 1275 HV at any thickness, so you will be running long exposures you had to find yourself. MicroChemicals' trouble shooter explains the failure: the nitrogen a DNQ resist releases on exposure has to escape before it builds up; in a thick film it diffuses out slowly, and at high intensity it forms bubbles or cracks the film through mechanical stress. Lower the intensity and expose longer, or split the dose into several steps with pauses. A softbake that left too much solvent, or weak adhesion, makes the bubbling worse.
SOURCE: micro resist technology ma-P 1200 series product sheet…
micro resist technology ma-P 1200 series product sheet (ls.24.02.01) — Technical data table (no ma-P 1275 HV column), p.1; MicroChemicals GmbH 'Photolithography Trouble Shooter' — Bubbles in Resist Film after Exposure (Exposure Intensity Too High?, Resist Film Thickness Too High?, Softbake Sufficient?, Sufficient Resist Adhesion?), p.14–15
Sources & disclaimer
- micro resist technology GmbH — ma-P 1275 HV datasheet (ls.24.02.01 (printed on both pages)) · accessed 2026-09-10
- https://kayakuam.com/products/ma-p-1200/ — kayakuam.com states 'ma-P 1200 is a positive tone DNQ/novolac based resist series'; the basis for classifying the ma-P 1200 grades as dnq-novolak.
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-09-24.