https://nanyte.com/photoresists/ma-p-1215 · last updated 2026-07-26
- Manufacturer
- micro resist technology GmbH
- Tone
- positive
- Chemistry
- DNQ-novolak
- Thickness
- 1.5 µm
- Exposure dose
- 45 mJ/cm²
- Applications
- Etch mask · Electroplating / molding
- Substrate
- Resist
- Exposed
Spin coating
The manufacturer does not publish a spin curve for ma-P 1215.
- The 'Positive Photoresist Series' table (p.1) lists ma-P 1205/1210/1215/1225/1240/1275 side by side, each with exactly one film-thickness value, all coated at the SAME condition: 3000 rpm, 30 s spin time.
- For ma-P 1215 that is 1.5 µm — a single anchor point, not a spin-speed sweep, so per protocol no curve is published (a one-point series is not a curve).
- A separate figure titled 'ma-P 1200 series — Spin curves, 30 s spin time' (p.1) plots film thickness vs. spin speed (1000–6000 rpm) for all six grades on one chart with a color-coded legend (ma-P 1275/1240/1225/1215/1210/1205, in that order, thickest to thinnest).
- That figure carries no numeric table — only axis tick labels (0–16 µm, 1000–6000 rpm) and the legend strings — so no per-grade values are published from it, and the tabulated anchor above is the only thickness figure with a number attached.
- No accel, dispense volume, edge-bead removal, or rehydration guidance is published anywhere in this document.
- The manufacturer's own feature list states 'No post exposure bake' for the whole ma-P 1200 series.
- Adhesion
- HMDS not required — Not mentioned in this document.
Soft bake
- Soft bake
- Not published — characterize on-tool
Exposure dose
The manufacturer publishes 45 mJ/cm². Dose scales with film thickness and depends on your optics, so treat it as a starting point and run a dose array.
- As published
- 45 mJ/cm² is the published dose for ma-P 1215, taken under broadband exposure with the meter set on the 365 nm line rather than as a monochromatic i-line spec.
Not published for this resist: Dose at 365 nm, Dose at 405 nm — characterize on-tool.
SOURCE: table "Positive Photoresist Series", p.1 of ma-P.pdf, ma-P 1215 column
Development
Not published for this resist: Developer, Dilution, Time, Method, Rinse — characterize on-tool.
SOURCE: bullet "Aqueous alkaline development", p.1 of ma-P.pdf
Hard bake, etch & strip
- Etch resistance
- Manufacturer states "Outstanding pattern stability in wet etch processes and acid and alkaline plating baths" and "Highly stable in dry etch processes e.g. CHF3, CF4, SF[x]" for the ma-P 1200 series (p.1).
Not published for this resist: Hard bake, Descum, Stripper, Storage — characterize on-tool.
Where it's used
Practical notes from the datasheet
ma-P 1215 is the 1.5 µm nominal-thickness member of micro resist technology's ma-P 1200 positive-tone series, a six-grade family (1205 through 1275) spanning 0.3–40 µm, all coated at the same 3000 rpm / 30 s condition per the family table. The manufacturer calls out "no post exposure bake" as a series-wide feature, which simplifies the process relative to resists that require a critical PEB step. Development is aqueous-alkaline, but this flyer names no specific developer product, dilution, or time — only a general process-flow diagram (coat, expose, develop) is shown. A multi-grade spin-speed curve (1000–6000 rpm, 30 s) is published for the whole family on one chart, but no numeric table accompanies it, so the tabulated 1.5 µm anchor is the only thickness figure with a number attached. The document also markets ma-P 1275 / ma-P 1275 HV as separate high-viscosity grades for electroplating molds up to 60 µm, but does not mention any 'ma-P 1275G' or grayscale variant. Chemistry classified as dnq-novolak from kayakuam.com's statement that ma-P 1200 is a 'positive tone DNQ/novolac based resist series'.
Sources & disclaimer
- micro resist technology GmbH — ma-P 1215 datasheet (20 June 2008) · accessed 2026-07-10
- https://kayakuam.com/products/ma-p-1200/ — kayakuam.com states 'ma-P 1200 is a positive tone DNQ/novolac based resist series'; the basis for classifying ma-P 1215 as dnq-novolak.
- Haus et al.. Robust Pressure Sensor in SOI Technology with Butterfly Wiring for Airfoil Integration. Sensors (2021). doi:10.3390/s21186140Uses ma-P 1215 as the lithographic mask through which 40% hydrofluoric acid opens the oxide to define boron doping windows, in an SOI piezoresistive pressure sensor built for airfoil integration.
- Xu et al.. Mapping enzyme catalysis with metabolic biosensing. Nature Communications (2021). doi:10.1038/s41467-021-27185-9Transfers sawtooth electrode patterns into a 2 um-thick ma-P 1215 layer over sputtered chromium, then wet-etches the chromium through the resist to build the electrodes of a droplet-microfluidic enzyme-screening chip.
- Zhang et al.. Linked optical and gene expression profiling of single cells at high-throughput. Genome Biology (2020). doi:10.1186/s13059-020-01958-9States a complete ma-P 1215 process for a chromium electrode mask: a 2 um coat, a 1 min bake at 95 C, a 3.5 min collimated UV exposure, then development and chromium etching.
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-07-26.