https://nanyte.com/photoresists/ma-p-1275 · last updated 2026-09-13
- Manufacturer
- micro resist technology GmbH
- Tone
- positive
- Chemistry
- DNQ-novolak
- Thickness
- 7.5–40 µm
- Exposure dose
- 150 mJ/cm²
- Applications
- Electroplating / molding · Etch mask
Cross-checked — two independent extractions agree on the spin curve and the single-value figures.
- Substrate
- Resist
- Exposed
Spin coating
Data points
| Series | rpm | µm |
|---|---|---|
| ma-P 1275, 60 s spin time | 250 | 40 |
| 350 | 30 | |
| 500 | 20 |
Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool.
transcribed from the Film thicknesses table, p.2 of the ma-P 1200 series product sheet (ls.24.02.01) — the three ma-P 1275 entries tabulated at a 60 s spin time. The 7.5 µm entry is at 30 s and is kept out of this series.
- The thick regime is tabulated at one spin time, so it forms a genuine series: 40 µm at 250 rpm, 30 µm at 350 and 20 µm at 500, all for 60 s.
- The fourth entry, 7.5 µm at 3000 rpm, uses a 30 s spin and is left out of that series rather than joined to it, since changing spin time and speed together would not describe one curve.
- The sheet also plots the grade as a smooth line from 250 to 3000 rpm, with no markers or numeric table.
- The thick films are spun at 250-500 rpm, so check thickness across the first wafers.
- Adhesion
- HMDS not required — Not addressed in this product sheet.
Soft bake
- Soft bake
- Not published — characterize on-tool
Exposure dose
The manufacturer publishes 150 mJ/cm². Dose scales with film thickness and depends on your optics, so treat it as a starting point and run a dose array.
- As published
- 150 mJ/cm² is the published broadband dose, metered at 365 nm, for a 7.5 µm ma-P 1275 film; no dose is published for the 20-40 µm coatings.
Not published for this resist: Dose at 365 nm, Dose at 405 nm — characterize on-tool.
SOURCE: Technical data table, p.1 of the ma-P 1200 series product sheet (ls.24.02.01), ma-P 1275 column
Development
Not published for this resist: Developer, Dilution, Time, Method, Rinse — characterize on-tool.
SOURCE: Unique features / Characteristics, p.1-2 of the ma-P 1200 series product sheet (ls.24.02.01)
Hard bake, etch & strip
- Etch resistance
- "High dry and wet etch resistance" and "High stability in acid and alkaline plating baths" (Characteristics, p.2).
Not published for this resist: Hard bake, Descum, Stripper, Storage — characterize on-tool.
Where it's used
Practical notes from the datasheet
ma-P 1275 is the grade micro resist technology designed specifically for electroplating structures in microsystems work, and the second page of the sheet is given over to it. It covers 7.5 µm at 3000 rpm and 20-40 µm at 250-500 rpm, is sold for high stability in acid and alkaline plating baths, and reaches sidewall angles up to 87° on a mask aligner with broadband exposure. It is also suitable for pattern reflow: the sheet shows 60 µm-diameter pillars reflowed at 140 °C into lens shapes, and a lens array transferred into OrmoComp by UV moulding. The honest gap is exposure — the only published dose, 150 mJ/cm², belongs to the 7.5 µm film, so every thicker coating needs its dose established on-tool, and at 20-40 µm that will be substantially higher. No softbake, developer product or develop time is published.
Grades in this family
Other grades in the ma-P 1200 series line differ mainly in coating thickness:
Sources & disclaimer
- micro resist technology GmbH — ma-P 1275 datasheet (ls.24.02.01 (printed on both pages)) · accessed 2026-09-10
- https://kayakuam.com/products/ma-p-1200/ — kayakuam.com states 'ma-P 1200 is a positive tone DNQ/novolac based resist series'; the basis for classifying the ma-P 1200 grades as dnq-novolak.
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-09-13.