https://nanyte.com/photoresists/ma-p-1275 · last updated 2026-09-28
- Manufacturer
- micro resist technology GmbH
- Tone
- positive
- Chemistry
- DNQ-novolak
- Thickness
- 7.5–40 µm
- Exposure dose
- 150 mJ/cm² (broadband, metered at 365 nm)
- Applications
- Electroplating / molding · Etch mask
Cross-checked — two independent extractions agree on the spin curve and the single-value figures.
- Substrate
- Resist
- Exposed
Spin coating
Data points
| Series | rpm | µm |
|---|---|---|
| ma-P 1275, 60 s spin time | 250 | 40 |
| 350 | 30 | |
| 500 | 20 |
Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool.
transcribed from the Film thicknesses table, p.2 of the ma-P 1200 series product sheet (ls.24.02.01) — the three ma-P 1275 entries tabulated at a 60 s spin time. The 7.5 µm entry is at 30 s and is kept out of this series.
- The thick regime is tabulated at one spin time, so it forms a genuine series: 40 µm at 250 rpm, 30 µm at 350 and 20 µm at 500, all for 60 s.
- The fourth entry, 7.5 µm at 3000 rpm, uses a 30 s spin and is left out of that series rather than joined to it, since changing spin time and speed together would not describe one curve.
- The sheet also plots the grade as a smooth line from 250 to 3000 rpm, with no markers or numeric table.
- The thick films are spun at 250-500 rpm, so check thickness across the first wafers.
- Adhesion
- Not addressed in this product sheet.
Soft bake
- Soft bake
- Not published — characterize on-tool
Exposure dose
The manufacturer publishes 150 mJ/cm² (broadband, metered at 365 nm). Dose scales with film thickness and depends on your optics, so treat it as a starting point and run a dose array.
- Dose at 405 nm
- Not published — characterize on-tool
- As published
- 150 mJ/cm² is the published broadband dose, metered at 365 nm, for a 7.5 µm ma-P 1275 film; no dose is published for the 20-40 µm coatings.
SOURCE: Technical data table, p.1 of the ma-P 1200 series product sheet (ls.24.02.01), ma-P 1275 column
Development
Not published for this resist: Developer, Dilution, Time, Method, Rinse — characterize on-tool.
SOURCE: Unique features / Characteristics, p.1-2 of the ma-P 1200 series product sheet (ls.24.02.01)
Hard bake, etch & strip
- Etch resistance
- "High dry and wet etch resistance" and "High stability in acid and alkaline plating baths" (Characteristics, p.2).
Not published for this resist: Hard bake, Descum, Stripper, Storage — characterize on-tool.
Where it's used
Practical notes from the datasheet
ma-P 1275 is the grade micro resist technology designed specifically for electroplating structures in microsystems work, and the second page of the sheet is given over to it. It covers 7.5 µm at 3000 rpm and 20-40 µm at 250-500 rpm, is sold for high stability in acid and alkaline plating baths, and reaches sidewall angles up to 87° on a mask aligner with broadband exposure. It is also suitable for pattern reflow: the sheet shows 60 µm-diameter pillars reflowed at 140 °C into lens shapes, and a lens array transferred into OrmoComp by UV moulding. The honest gap is exposure — the only published dose, 150 mJ/cm², belongs to the 7.5 µm film, so every thicker coating needs its dose established on-tool, and at 20-40 µm that will be substantially higher. No softbake, developer product or develop time is published.
Grades in this family
Other grades in the ma-P 1200 series line differ mainly in coating thickness:
Troubleshooting
Common failure modes for ma-P 1275, answered from the manufacturer's datasheet and application notes. These are starting points — your substrate, tooling and environment shift the specifics, so calibrate on-tool.
A fresh bottle of ma-P 1275 coats full of bubbles. How long should it stand?
MicroChemicals' trouble shooter explains the source: over months the photoactive compound slowly releases nitrogen, which stays dissolved in the closed bottle and comes out as bubbles once it is opened; air stirred in by carrying or pouring adds more. In a viscosity as high as ma-P 1275's, which reaches 20–40 µm at 250–500 rpm, the bubbles rise slowly. Shake the closed bottle, then let it stand with the cap set on loosely so pressure can equalise. Most resists clear in an hour or two, but very viscous resists can need one to two days.
SOURCE: MicroChemicals GmbH 'Photolithography Trouble Shooter'…
MicroChemicals GmbH 'Photolithography Trouble Shooter' application note — Bubbles and Comet-Like Structures after Spin Coating? (air bubbles; nitrogen bubbles), p.2, and Resist Bottles Closed for A While?, p.13–14; micro resist technology ma-P 1275 / 1275 HV sheet (ls.24.02.01) — Film thicknesses table, p.2
What dose do I use for ma-P 1275 at 20–40 µm?
Not published. The one dose micro resist technology gives, 150 mJ/cm² broadband metered at 365 nm, belongs to the 7.5 µm film at 3000 rpm; the thicker coatings from the p.2 table have no dose. Do not carry 150 mJ/cm² up to a 30 µm film: MicroChemicals' trouble shooter notes that an underexposed thick film develops normally to some depth and then almost stops. Run a dose series at your actual thickness and check the bottom of the openings, not just the top. The sheet's examples were all made by mask-aligner broadband exposure.
SOURCE: micro resist technology ma-P 1200 series product sheet…
micro resist technology ma-P 1200 series product sheet (ls.24.02.01) — Technical data table, p.1, and ma-P 1275 / 1275 HV sheet — Film thicknesses table and figure note, p.2; MicroChemicals GmbH 'Photolithography Trouble Shooter' — Sufficient Exposure Dose in the Case of Positive Resists? (thick resist films), p.7
Bubbles form in exposed ma-P 1275 during a bake or in the plating bath. What's happening?
MicroChemicals' trouble shooter explains it: nitrogen released by the exposure is still in the film, and when the resist softens at higher temperature — a post-exposure bake, a warm plating bath — it gathers into bubbles. A delay between exposure and any heated step lets it diffuse out, and a thick film needs longer. The same note says a thick film also holds more solvent near the substrate after softbake, which can leach into the plating bath and upset it; a bake after development about 10 °C below the resist's softening point brings it down.
SOURCE: MicroChemicals GmbH 'Photolithography Trouble Shooter' —…
MicroChemicals GmbH 'Photolithography Trouble Shooter' — Bubbles in Resist Film after Thermal Processes (After Baking Steps of Exposed Photoresist?), p.15, and Electro-Plating: Bath Contamination by Remaining Solvent? (thick resist films), p.17
My ma-P 1275 plating mould walls slumped after a bake. How hot is too hot?
ma-P 1275 is sold as suitable for pattern reflow, and the sheet's reflow example — 60 µm-diameter pillars in a 30 µm film turned into lenses — is labelled 140 °C. So a post-develop bake or warm process step near that temperature can round the sidewalls, which the sheet rates at up to 87° for mask-aligner exposure. The sheet does not publish a softening point; if you need straight walls, keep hot steps well below the reflow example and test on a patterned wafer first. MicroChemicals' trouble shooter adds that heat from metal deposition or dry etching can soften the pattern the same way.
SOURCE: micro resist technology ma-P 1275 / 1275 HV sheet…
micro resist technology ma-P 1275 / 1275 HV sheet (ls.24.02.01) — Characteristics and '30 µm reflowed ma-P 1275, 60 µm diameter' SEM, p.2; MicroChemicals GmbH 'Photolithography Trouble Shooter' — Resist Softening and Rounding during Coating?, p.18, and Resist Rounding/Flowing?, p.16
Sources & disclaimer
- micro resist technology GmbH — ma-P 1275 datasheet (ls.24.02.01 (printed on both pages)) · accessed 2026-09-10
- https://kayakuam.com/products/ma-p-1200/ — kayakuam.com states 'ma-P 1200 is a positive tone DNQ/novolac based resist series'; the basis for classifying the ma-P 1200 grades as dnq-novolak.
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-09-28.