https://nanyte.com/photoresists/ma-p-1210 · last updated 2026-09-13
- Manufacturer
- micro resist technology GmbH
- Tone
- positive
- Chemistry
- DNQ-novolak
- Thickness
- 1 µm
- Exposure dose
- 35 mJ/cm²
- Applications
- Etch mask · Electroplating / molding
- Substrate
- Resist
- Exposed
Spin coating
The manufacturer does not publish a spin curve for ma-P 1210.
- One tabulated point, not a sweep: the technical data table gives ma-P 1210 as 1 µm at 3000 rpm for 30 s, the single condition every grade in the series is listed at, and one anchor is not a curve.
- The sheet also plots film thickness against spin speed from 1000 to 6000 rpm for all six grades, but as smooth lines with no markers and no numeric table, so no values are published from it.
- Accel, dispense volume and edge-bead removal are not published.
- Adhesion
- HMDS not required — Not addressed in this product sheet.
Soft bake
- Soft bake
- Not published — characterize on-tool
Exposure dose
The manufacturer publishes 35 mJ/cm². Dose scales with film thickness and depends on your optics, so treat it as a starting point and run a dose array.
- As published
- 35 mJ/cm² is the published dose for ma-P 1210, measured under broadband exposure with the meter reading the 365 nm line rather than specified as a monochromatic i-line dose.
Not published for this resist: Dose at 365 nm, Dose at 405 nm — characterize on-tool.
SOURCE: Technical data table, p.1 of the ma-P 1200 series product sheet (ls.24.02.01), ma-P 1210 column
Development
Not published for this resist: Developer, Dilution, Time, Method, Rinse — characterize on-tool.
SOURCE: Unique features / Characteristics, p.1-2 of the ma-P 1200 series product sheet (ls.24.02.01)
Hard bake, etch & strip
- Etch resistance
- "High pattern stability in wet etch processes and acid and alkaline plating baths" and "Highly stable in dry etch processes e.g. CHF3, CF4, SF6" (Unique features, p.1).
Not published for this resist: Hard bake, Descum, Stripper, Storage — characterize on-tool.
Where it's used
Practical notes from the datasheet
ma-P 1210 is the one-micron grade in micro resist technology's ma-P 1200 series, and the sheet's example is a fair statement of what it is for: 0.85 µm lines resolved in a 1 µm film on a mask aligner, an aspect ratio a little over 1:1. It shares the lowest dose in the series, 35 mJ/cm², with the half-micron 1205, so on paper doubling the film thickness adds nothing to the exposure dose. Like the rest of the line it is marketed as stable in wet and dry etch chemistries and in acid and alkaline plating baths, and it develops in aqueous alkali. No softbake, developer product or develop time is published, so those are on-tool parameters.
Grades in this family
Other grades in the ma-P 1200 series line differ mainly in coating thickness:
Sources & disclaimer
- micro resist technology GmbH — ma-P 1210 datasheet (ls.24.02.01 (printed on both pages)) · accessed 2026-09-10
- https://kayakuam.com/products/ma-p-1200/ — kayakuam.com states 'ma-P 1200 is a positive tone DNQ/novolac based resist series'; the basis for classifying the ma-P 1200 grades as dnq-novolak.
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-09-13.