https://nanyte.com/photoresists/ma-p-1205 · last updated 2026-09-13
- Manufacturer
- micro resist technology GmbH
- Tone
- positive
- Chemistry
- DNQ-novolak
- Thickness
- 0.5 µm
- Exposure dose
- 35 mJ/cm²
- Applications
- Etch mask · Electroplating / molding
- Substrate
- Resist
- Exposed
Spin coating
The manufacturer does not publish a spin curve for ma-P 1205.
- One tabulated point, not a sweep: the technical data table gives ma-P 1205 as 0.5 µm at 3000 rpm for 30 s, the single condition every grade in the series is listed at, and one anchor is not a curve.
- The sheet also plots film thickness against spin speed from 1000 to 6000 rpm for all six grades, but as smooth lines with no markers and no numeric table, so no values are published from it.
- Accel, dispense volume and edge-bead removal are not published.
- Adhesion
- HMDS not required — Not addressed in this product sheet.
Soft bake
- Soft bake
- Not published — characterize on-tool
Exposure dose
The manufacturer publishes 35 mJ/cm². Dose scales with film thickness and depends on your optics, so treat it as a starting point and run a dose array.
- As published
- 35 mJ/cm² is the published dose for ma-P 1205, measured under broadband exposure with the meter reading the 365 nm line rather than specified as a monochromatic i-line dose.
Not published for this resist: Dose at 365 nm, Dose at 405 nm — characterize on-tool.
SOURCE: Technical data table, p.1 of the ma-P 1200 series product sheet (ls.24.02.01), ma-P 1205 column
Development
Not published for this resist: Developer, Dilution, Time, Method, Rinse — characterize on-tool.
SOURCE: Unique features / Characteristics, p.1-2 of the ma-P 1200 series product sheet (ls.24.02.01)
Hard bake, etch & strip
- Etch resistance
- "High pattern stability in wet etch processes and acid and alkaline plating baths" and "Highly stable in dry etch processes e.g. CHF3, CF4, SF6" (Unique features, p.1).
Not published for this resist: Hard bake, Descum, Stripper, Storage — characterize on-tool.
Where it's used
Practical notes from the datasheet
ma-P 1205 is the thinnest of micro resist technology's standard ma-P 1200 positive resists, coating half a micron at 3000 rpm for 30 s. The sheet's own example shows it holding 1 µm lines on 3 µm spaces at that thickness. Its dose, 35 mJ/cm² under broadband exposure metered at 365 nm, is the lowest in the series, shared only with ma-P 1210. Like the rest of the line it is sold for high pattern stability in wet etches and in acid and alkaline plating baths, for dry etching in CHF3, CF4 or SF6, and for easy removal; the listed applications are etch masks for Si, SiO2, semiconductors and metals, electroplating moulds and ion-implantation masks. The series develops in aqueous alkali. The sheet publishes no softbake, developer product or develop time, so those have to be set on-tool.
Grades in this family
Other grades in the ma-P 1200 series line differ mainly in coating thickness:
Sources & disclaimer
- micro resist technology GmbH — ma-P 1205 datasheet (ls.24.02.01 (printed on both pages)) · accessed 2026-09-10
- https://kayakuam.com/products/ma-p-1200/ — kayakuam.com states 'ma-P 1200 is a positive tone DNQ/novolac based resist series'; the basis for classifying the ma-P 1200 grades as dnq-novolak.
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-09-13.