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AZ 1505 process recipe

AZ 1505 is the thinnest grade in Merck's AZ 1500 series of general-purpose positive-tone photoresists, spin-coating to roughly 0.65-1.6 µm and intended for wet-etch masking applications requiring strong substrate adhesion.

https://nanyte.com/photoresists/az-1505 · last updated 2026-07-12

At a glance
Manufacturer
Merck (AZ Electronic Materials)
Tone
positive
Chemistry
DNQ-novolak
Thickness
0.6–1.6 µm
Developer
AZ 300MIF, AZ 726MIF, AZ 917MIF, or AZ 400K
Applications
Etch mask · Electroplating / molding · General prototyping
Etch maskSuitable for

Cross-checked — two independent extractions agree.

01 / Coating

Spin coating

AZ 1505 is spin-coated to 0.6–1.6 µm. The curve below is redrawn from the manufacturer's published data — read your target thickness off the vertical axis and take the matching spin speed as a starting point.

Spin curve for AZ 1505: film thickness in µm against spin speed in rpm.0.000.501.01.52.01k2k3k4kSPIN SPEED (rpm)THICKNESS (µm)
Data points
AZ 1505 — film thickness (µm) by spin speed (rpm)
Seriesrpmµm
AZ 1505 as supplied5001.6
10001.1
15000.95
20000.85
25000.80
30000.65
35000.60
40000.60

Values are the manufacturer's starting points, not a guarantee; verify on your own tool. Characterize on-tool. Series digitized from a published figure were independently cross-checked by a second blind read; treat those values as approximate (±10 %).

read from figure, "SPIN CURVES (150mm Wafers)" chart, p.1 of AZ 1500 Series Technical Datasheet (Merck, Rev. 03/21); AZ 1505 identified by its blue diamond legend marker, distinct from AZ 1512 (magenta square), AZ 1518 (red triangle) and AZ 1529 (green circle) plotted on the same axes. ADJUDICATED 2026-07-12 (third pixel read, WL directive: figure over table): the 3000/3500 rpm points were the crawl-era eyeball read and disagreed ~17% with the independent cross-check extraction; a fresh PyMuPDF pixel read of the embedded chart raster (axis calibrated from the y-axis tick-label text centroids -- value0 row=251, value10 row=51, 20 px/unit -- and the x-axis tick-label centroids -- rpm0 x=74.3, 0.1048 px/rpm; marker centroid taken as the column of maximum vertical run-length within +-7 px of each expected rpm column, i.e. the diamond's widest point, not the connecting line) reads 3000 rpm = 0.65 um, 3500 rpm = 0.60 um, 4000 rpm = 0.60 um -- confirming the crawl-era raw read erred (too high) and the cross-check extraction was essentially correct; 4000 rpm was also nudged from 0.65 to 0.60 um (not itself flagged as a >15% mismatch) because leaving it unchanged made the curve non-monotonic against the corrected 3500 rpm point, and the fresh pixel read independently supports 0.60 um there too (same marker column height/position as 3500 rpm).

Redrawn from the manufacturer's published data — hover to read values between points, click to pin.

Datasheet does not state spin ramp/acceleration, dispense volume, or static vs dynamic dispense for the spin-curve chart. Spin coating is named as one of several compatible coating methods (spray and roller coating are also mentioned, p.6 COATING) but no method-specific parameters are published beyond that. No edge-bead-removal recipe is given, only that AZ EBR Solvent or AZ EBR 70/30 are the companion EBR products (p.2).

Adhesion
HMDS recommended — "Oxide forming substrates (Si, etc.) should be primed with HMDS (hexamethyl disilazane) or other suitable primer prior to coating AZ 1500. Contact your AZ products representative for detailed information on pre-treating with HMDS." Source: SUBSTRATE PREPARATION, p.6.
02 / Bake

Soft bake

Soft bake
Not published — characterize on-tool
Notes
Datasheet states soft bake temperature should be in the 90-110°C range (higher end improves adhesion to metals); bakes may be performed on hotplate or in a vented oven, but no single temperature, no time, and no specific method is given for AZ 1505.

SOURCE: TYPICAL PROCESS, p.1; PROCESS CONSIDERATIONS / SOFT BAKE, p.6

03 / Exposure

Exposure dose

The manufacturer does not publish a clearing dose for AZ 1505. Determine it with a dose array on your own tool.

As published
AZ 1500 series stated sensitive to exposure wavelengths 310-450 nm; 365-436 nm recommended (broadband exposure, no single wavelength or dose specified for the series in general).

Not published for this resist: Dose at 365 nm, Dose at 405 nm — characterize on-tool.

04 / Development

Development

Developer
AZ 300MIF, AZ 726MIF, AZ 917MIF, or AZ 400K
Dilution
AZ 400K used 1:4 for tank immersion; dilution of the MIF developers is not stated in this datasheet.
Time
60 s
Developer family
TMAH or buffered alkaline

Not published for this resist: Method, Rinse — characterize on-tool.

SOURCE: TYPICAL PROCESS, p.1; DEVELOPING, p.6

05 / Post-processing

Hard bake, etch & strip

Etch resistance
Marketed for "demanding wet etch applications" with "excellent substrate adhesion"; no quantitative etch rate or resistance data is published in this datasheet. Source: APPLICATION, p.1.
Stripper
AZ 300T, AZ 400T, or AZ Kwik Strip — removers designed for DNQ/novolac type photoresists. Strip times vary with thermal history; patterns processed above 140°C may cross-link and become harder to strip, and charred resist will not dissolve in solvent-based removers. Source: STRIPPING, p.7.

Not published for this resist: Hard bake, Descum, Storage — characterize on-tool.

SOURCE: HARD BAKE, p.6

06 / Applications

Where it's used

Etch maskElectroplating / moldingGeneral prototyping

AZ 1505 is the thinnest member of Merck's AZ 1500 series, a general-purpose positive DNQ/novolak-type resist family sold for demanding wet-etch masking where strong substrate adhesion matters (the datasheet's stripper guidance — removers "designed for DNQ/novolac type photoresists" — is the basis for this chemistry classification, since the document never states the chemistry as a standalone claim). Soft-bake, optional-PEB, and hard-bake temperatures are all given only as ranges (90-110°C, 105-115°C, 100-110°C respectively) rather than single set points, so a specific process must be optimized on-tool rather than read off this sheet verbatim. No exposure dose, PEB time, or storage/shelf-life data is published for AZ 1505 specifically — the only doses and resolution/depth-of-focus data in this datasheet were captured for the AZ 1512 and AZ 1518 grades, not AZ 1505. Develop is 60 s by puddle or immersion in a metal-ion-free (TMAH, e.g. AZ 300/726/917MIF) or inorganic (e.g. AZ 400K 1:4) developer, both explicitly supported. HMDS (or another suitable primer) is recommended ahead of coating on oxide-forming substrates such as silicon.

07 / Sources

Sources & disclaimer

Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-07-12.

Cite this recipe

NANYTE. "AZ 1505 process recipe." NANYTE Photoresist Library. https://nanyte.com/photoresists/az-1505. Accessed 2026-07-12.

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