https://nanyte.com/photoresists/su-8-2075 · last updated 2026-09-13
- Manufacturer
- Kayaku Advanced Materials
- Tone
- negative
- Chemistry
- Epoxy (SU-8 type)
- Thickness
- 59–239 µm
- Developer
- SU-8 Developer; ethyl lactate or diacetone alcohol may also be used
- Applications
- MEMS structural · High aspect ratio · Electroplating / molding
Cross-checked — two independent extractions agree on the spin curve and the single-value figures.
- Substrate
- Resist
- Exposed
Spin coating
Data points
| Series | rpm | µm | Published dose |
|---|---|---|---|
| SU-8 2075 | 1000 | 239 | — |
| 2000 | 110 | 215–240 mJ/cm² · 85–110 µm row 240–260 mJ/cm² · 115–150 µm row within 10 % of a bracket edge | |
| 3000 | 76 | 150–215 mJ/cm² · 45–80 µm row within 10 % of a bracket edge | |
| 4000 | 59 | 150–215 mJ/cm² · 45–80 µm row |
Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool. Series digitized from a published figure are approximate (±10 %).
Published dose is the datasheet’s own thickness bracket, quoted as printed — the full table and its citation are in the exposure section. A thickness the table does not cover shows nothing, and a thickness within 10 % of a bracket edge shows every bracket it could fall in.
read from figure — the round markers legended 'SU-8 2075' on Figure 1 'SU-8 2000 Thickness vs. Spin Speed', p.2 of the SU-8 2000, 2025-2075 Technical Data Sheet, August 2020. Four plotted markers at 1000, 2000, 3000 and 4000 rpm; no numeric table accompanies the chart. Marker centres located against the 20 µm axis ticks of the embedded chart image; values are reads to about ±1 µm.
- 239 µm at 1000 rpm, 110 µm at 2000, 76 µm at 3000 and 59 µm at 4000.
- The 1000 rpm point is thicker than the sheet's largest process row (160-225 µm), so bake, dose and develop at that speed are an extrapolation.
- Kayaku's recommended program for the series: dispense 1 ml of resist per inch (25 mm) of substrate diameter, spread at 500 rpm for 5-10 s at 100 rpm/s, then spin at 2000 rpm for 30 s at 300 rpm/s, choosing the final speed from the spin chart.
- Remove the edge bead with EBR PG so the mask can seat in close contact.
- Adhesion
- HMDS not required — 'Adhesion promoters are typically not required.' Clean and dry the substrate first — piranha (H2SO4 and H2O2) with a DI rinse, or RIE or an oxygen barrel asher.
Soft bake
- Soft bake
- 95 °C · hotplate
- Notes
- Times are set by film thickness, at 65 °C and then at 95 °C: 45-80 µm → 0-3 min at 65 °C then 6-9 min at 95 °C; 85-110 µm → 5 then 10-20 min; 115-150 µm → 5 then 20-30 min; 160-225 µm → 7 then 30-45 min. Use a level hotplate — convection ovens are not recommended because a skin can form and trap solvent.
SOURCE: Table 2 'Soft Bake Times', p.3 of the SU-8 2000, 2025-2075 Technical Data Sheet, August 2020
Exposure dose
SU-8 2075's dose is published against film thickness, not as a single number. Read the row for the film you coat and run a dose array around it.
- As published
- Dose follows the film you spin, not the grade name: 45-80 µm films take 150-215 mJ/cm², 85-110 µm 215-240, 115-150 µm 240-260 and 160-225 µm 260-350 mJ/cm².
- Post-exposure bake
- 95 °C · hotplate
| Film thickness | Dose |
|---|---|
| 25–40 µm | 150–160 mJ/cm² |
| 45–80 µm | 150–215 mJ/cm² |
| 85–110 µm | 215–240 mJ/cm² |
| 115–150 µm | 240–260 mJ/cm² |
| 160–225 µm | 260–350 mJ/cm² |
SOURCE: SU-8 2000 2025-2075 Technical Data Sheet
Table 3 'Exposure Dose', p.3 of the SU-8 2000, 2025-2075 Technical Data Sheet, August 2020 — indexed by film thickness and shared by the four grades that sheet covers; no wavelength is attached to the table.
Development
- Developer
- SU-8 Developer; ethyl lactate or diacetone alcohol may also be used
- Method
- immersion, spray or spray-puddle
- Rinse
- Spray and wash with fresh SU-8 developer for about 10 s, and again for another 10 s if needed, then air-dry with filtered pressurised air or nitrogen.
- Developer family
- Solvent
Not published for this resist: Dilution, Time — characterize on-tool.
SOURCE: SU-8 2000 2025-2075 Technical Data Sheet
Development section and Table 6 'Development Times for SU-8 Developer', p.4 of the SU-8 2000, 2025-2075 Technical Data Sheet, August 2020
Hard bake, etch & strip
- Hard bake
- 150–250 °C · 5–30 min
- Descum
- Not published — characterize on-tool
- Etch resistance
- Not characterised as an etch mask.
- Stripper
- Minimally cross-linked SU-8 2000 swells and lifts off in Remover PG at 50-80 °C for 30-90 min; with a 30-100 nm OmniCoat underlayer the lift-off is clean.
- Storage
- Store upright in tightly closed containers in a cool, dry place away from direct sunlight, light, acids, heat and ignition sources, at 4-21 °C (40-70 °F).
SOURCE: Hard bake (cure) section, p.5 of the SU-8 2000, 2025-2075 Technical Data Sheet, August 2020
Where it's used
Practical notes from the datasheet
SU-8 2075 is the most viscous grade on this sheet (22,000 cSt, 73.45 % solids) and makes the tallest single coats in it, from about 60 µm at 4000 rpm to beyond 200 µm at the slow end. Everything scales with that height. A 100 µm film bakes 5 minutes at 65 °C and 10-20 minutes at 95 °C, takes 215-240 mJ/cm², post-bakes 2-5 minutes at 65 °C and 8-10 minutes at 95 °C and develops for 7-10 minutes; a 200 µm film needs 30-45 minutes of soft bake, up to 350 mJ/cm² and around a quarter of an hour in developer with strong agitation. If surface cracks appear after development, the sheet anneals them with a couple of minutes at 150 °C. The cured structure is permanent — use OmniCoat underneath if it has to be released.
Grades in this family
Other grades in the SU-8 2000 series line differ mainly in coating thickness:
Sources & disclaimer
- Kayaku Advanced Materials — SU-8 2075 datasheet (SU-8 2000, 2025-2075 Technical Data Sheet, August 2020) · accessed 2026-09-10
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-09-13.