https://nanyte.com/photoresists/kmpr-1005 · last updated 2026-07-26
- Manufacturer
- Kayaku Microchem (MicroChem)
- Tone
- negative
- Chemistry
- Epoxy (SU-8 type)
- Thickness
- 5.1–9.7 µm
- Developer
- 2.38% TMAH (0.26N) aqueous alkaline developer (primary); SU-8 Developer (solvent-based) is also usable as an alternative
- Applications
- High aspect ratio · MEMS structural · Electroplating / molding · Etch mask
- Substrate
- Resist
- Exposed
Spin coating
Data points
| Series | rpm | µm | Published dose |
|---|---|---|---|
| KMPR 1005 | 1000 | 9.7 | 235–335 mJ/cm² · 5–11 µm row |
| 2000 | 7.0 | 235–335 mJ/cm² · 5–11 µm row | |
| 3000 | 5.8 | 235–335 mJ/cm² · 5–11 µm row | |
| 4000 | 5.1 | 235–335 mJ/cm² · 5–11 µm row within 10 % of a bracket edge | |
| KMPR 1005 (23°C Japan & Asia) | 1000 | 9.4 | 235–335 mJ/cm² · 5–11 µm row |
| 2000 | 7.4 | 235–335 mJ/cm² · 5–11 µm row | |
| 3000 | 6.2 | 235–335 mJ/cm² · 5–11 µm row | |
| 4000 | 5.8 | 235–335 mJ/cm² · 5–11 µm row |
Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool. Series digitized from a published figure are approximate (±10 %).
Published dose is the datasheet’s own thickness bracket, quoted as printed — the full table and its citation are in the exposure section. A thickness the table does not cover shows nothing, and a thickness within 10 % of a bracket edge shows every bracket it could fall in.
KMPR 1005: read from Figure 1 "Spin speed vs. Thickness for KMPR® 1000 resists (21°C US & EU)", p.2 of the Kayaku Microchem/MicroChem "KMPR 1000 Chemically Amplified Negative Photoresist" datasheet (Ver. 4.2) — one family document covering all four viscosities. The chart plots four curves (1050/filled square, 1025/filled diamond, 1010/filled circle, 1005/open square), each with 4 markers at 1000/2000/3000/4000 rpm. KMPR 1005 is the open-square (white fill, black stroke), lowest-thickness-at-every-rpm curve — consistent with its legend position (listed last) and Table 1's viscosity ordering (1005 = 95 cSt, the lowest of the four, so it coats thinnest at a given speed). No numeric table of these values is published, so this remains a figure read.
KMPR 1005 (23°C Japan & Asia): read from Figure 2 "Spin speed vs. Thickness for KMPR® 1000 resists (23°C Japan & Asia)", p.2 of the same Kayaku Microchem/MicroChem "KMPR 1000" datasheet (Ver. 4.2). KMPR 1005 is again the open-square, lowest-thickness curve. A figure read, as above — no numeric table accompanies this chart either.
- Recommended program: dispense 1 ml of resist per inch (25 mm) of substrate diameter
- spin at 500 rpm for 5-10 s at 100 rpm/s acceleration, then spin at the target speed for 30 s at 300 rpm/s acceleration.
- The document publishes TWO spin curves for the same four resists at two different ambient conditions: Figure 1 (21°C, US & EU) and Figure 2 (23°C, Japan & Asia) — the curves are not identical for KMPR 1005 either (e.g. ~9.7 µm at 1000 rpm on the US/EU curve vs. ~9.4 µm on the Japan/Asia curve), a reminder that spin results are sensitive to coat-bowl ambient temperature/humidity and should be recharacterized on-tool.
SOURCE: "Coat" / "Recommended Program", p.1, and Figures 1-2, p.2.
- Adhesion
- HMDS not required — "Adhesion promoters are typically not required." HMDS pretreatment (MCC Primer 80/20) is recommended "for applications that require electroplating" — and the document's own Plating process recipe lists HMDS as its first step.1
Soft bake
- Soft bake
- 100 °C · 5 min · hotplate
- Notes
- Recommended bake temperature is 100°C (95-105°C also usable, per text).
SOURCE: Table 2 "Soft Bake Times" and "Soft Bake" section text, p.2
Exposure dose
KMPR 1005's dose is published against film thickness, not as a single number. Read the row for the film you coat and run a dose array around it.
- As published
- KMPR 1005 never leaves the table's first bin: its whole coating range sits inside 5–11 µm, dosed at 235–335 mJ/cm² on silicon. Glass and metals need 1.5× to 2× that.
- Post-exposure bake
- 100 °C · 2 min
| Film thickness | Dose |
|---|---|
| 5–11 µm | 235–335 mJ/cm² |
SOURCE: Microchem/MicroChem KMPR 1000 datasheet
Table 3 'Exposure Dose' of the Kayaku Microchem/MicroChem KMPR 1000 datasheet (Ver. 4.2). Only the 5-11 µm bin is carried here — it covers KMPR 1005's entire spin-curve thickness range. The table is not attributed to a specific wavelength.
Development
- Developer
- 2.38% TMAH (0.26N) aqueous alkaline developer (primary); SU-8 Developer (solvent-based) is also usable as an alternative
- Dilution
- 2.38% TMAH (0.26N), used at this standard concentration (not diluted from a stock in the document)
- Time
- 3 min
- Method
- immersion
- Rinse
- DI water, ~20 s spray rinse, then filtered air/N2 dry (TMAH path).
- Developer family
- TMAH or solvent
SOURCE: "Develop" and "Rinse and Dry" sections plus Table 5 (TMAH) and Table 6 (SU-8 developer), p.3
Hard bake, etch & strip
- Etch resistance
- Listed as a Feature: "Excellent dry etch resistance." Demonstrated in an application photo ("Etched Trenches", 10 µm features, 65 µm deep, credited to ULVAC) consistent with use as a DRIE (deep reactive ion etch) mask.2
- Stripper
- MicroChem Remover PG (NMP): heat bath to 80°C, immerse substrate 10-20 minutes (actual time depends on resist thickness and agitation, e.g. ultrasound).3
- Storage
- Store frozen, in tightly closed, upright containers, at 14°F (-10°C), away from light, heat, acids, and ignition sources.4
Not published for this resist: Hard bake, Descum — characterize on-tool.
SOURCE: "Plating" section note, p.3
Where it's used
Practical notes from the datasheet
KMPR 1005 is the lowest-viscosity, thinnest-coating grade in Kayaku Microchem/MicroChem's KMPR 1000 line (95 cSt / 45% solids, per Table 1) — the thin-film complement to kmpr-1050.json's thick-mold grade already in this library. Unlike the solvent-developed SU-8 2000 family, it is a chemically amplified epoxy resist designed to develop in aqueous TMAH — a meaningful process difference worth flagging for anyone assuming all thin epoxy negative resists behave like SU-8. Because its entire thickness range (~5.1-9.7 µm) sits inside the datasheet's first thickness bin (5-11 µm), the soft-bake, exposure-dose and TMAH-develop tables all resolve to a single unambiguous number for this grade — a notably cleaner situation than kmpr-1050, whose thick end runs past every published table. A distinctive storage gotcha carries over from the family datasheet: KMPR 1000 resists must be stored frozen (14°F/-10°C) and require a full 24-hour room-temperature thaw before use — treating it like a room-temperature-stable resist will produce inconsistent films. The resist strips cleanly with Remover PG when only lightly cross-linked; a fully electroformed/plated structure needs the stronger Remover PG → XP Remover K → XP Neutralizer K sequence.
Grades in this family
Other grades in the KMPR 1000 series line differ mainly in coating thickness:
| Grade | Thickness |
|---|---|
| KMPR 1005 (this page) | 5.1–9.7 µm |
| KMPR 1050 | 34–115 µm |
Sources & disclaimer
- Kayaku Microchem (MicroChem) — KMPR 1005 datasheet (Ver. 4.2 (printed in the footer of every page: "Ver. 4.2")) · accessed 2026-07-22
- "Substrate Preparation", p.1, and "Plating", p.3.
- "Features" list and application photos, p.1.
- "Removal" / "Process Recommendation" / "Plasma Removal", p.3.
- "Storage", p.4.
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-07-26.