https://nanyte.com/photoresists/kmpr-1005 · last updated 2026-09-28
- Manufacturer
- Kayaku Microchem (MicroChem)
- Tone
- negative
- Chemistry
- Epoxy (SU-8 type)
- Thickness
- 4.5–9.5 µm
- Developer
- 2.38% TMAH (0.26N) aqueous alkaline developer (primary); SU-8 Developer (solvent-based) is also usable as an alternative
- Applications
- High aspect ratio · MEMS structural · Electroplating / molding · Etch mask
Cross-checked — the spin curve (where published) and the single-value figures were read twice, independently, from the datasheet, with any disagreement settled against it.
- Substrate
- Resist
- Exposed
Spin coating
Data points
| Series | rpm | µm | Published dose |
|---|---|---|---|
| KMPR 1005 | 1000 | 9.5 | 235–335 mJ/cm² · 5–11 µm row |
| 2000 | 6.5 | 235–335 mJ/cm² · 5–11 µm row | |
| 3000 | 5.0 | 235–335 mJ/cm² · 5–11 µm row within 10 % of a bracket edge | |
| 4000 | 4.5 | — |
Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool. Series digitized from a published figure are approximate (±10 %).
Published dose is the datasheet’s own thickness bracket, quoted as printed — the full table and its citation are in the exposure section. A thickness the table does not cover shows nothing, and a thickness within 10 % of a bracket edge shows every bracket it could fall in.
read from figure — the open-square trace legended KMPR 1005 on Figure 1, 'KMPR 1000 Thickness vs. Spin Speed', p.2, the lowest of the five traces. Four plotted markers; no numeric table accompanies the chart.
- The flattest trace on the chart: 9.5 µm at 1000 rpm falls to 6.5 µm by 2000 rpm and then barely moves, reaching 4.5 µm at 4000 rpm.
- Below about 5 µm the grade has nothing left to give, and the datasheet's own process tables start at 5 µm, so a thinner target is outside both the curve and the published bake and dose bins.
- The recommended program is a 500 rpm / 5-10 s spread at 100 rpm/s acceleration, then 30 s at the final speed at 300 rpm/s, dispensing 1 ml of resist per inch of substrate diameter.
- Adhesion
- HMDS not required — "Adhesion promoters are typically not required." For applications that require electroplating, the datasheet recommends pre-treating the substrate with HMDS Primer, and its Plating process lists HMDS as the first step.1
Soft bake
- Soft bake
- 100 °C · 5 min · hotplate
- Notes
- Recommended bake temperature is 100 °C, with 95-105 °C also usable. Time is published by thickness (Table 2): 5-11 µm → 5 min; 12-20 µm → 7 min; 21-30 µm → 12 min; 31-55 µm → 15 min; 56-80 µm → 20 min. KMPR 1005's trace on the spin chart (Figure 1) runs 4.5-9.5 µm, so nearly all of it sits in the 5-11 µm row: 5 min at 100 °C. The thinnest coat, about 4.5 µm at 4000 rpm, falls just under the table's 5 µm starting point, where no time is published. Use a level hotplate; convection ovens are not recommended, since a skin can form and trap solvent. A cool-down/re-heat 'wrinkle' check confirms the film is fully dry before exposure.
SOURCE: Table 2 "Soft Bake Times", "Soft Bake" section text and Figure 1, p.2
Exposure dose
KMPR 1005's dose is published against film thickness, not as a single number. Read the row for the film you coat and run a dose array around it.
- As published
- KMPR 1005 never leaves the table's first bin: its whole coating range sits inside 5–11 µm, dosed at 235–335 mJ/cm² on silicon. Glass and metals need 1.5× to 2× that.
- Post-exposure bake
- 100 °C · 2 min
| Film thickness | Dose |
|---|---|
| 5–11 µm | 235–335 mJ/cm² |
SOURCE: Microchem/MicroChem KMPR 1000 datasheet
Table 3 'Exposure Dose' of the Kayaku Microchem/MicroChem KMPR 1000 datasheet (Ver. 6, December 2019). Only the 5-11 µm bin is carried here — it covers nearly all of KMPR 1005's Figure 1 trace (4.5-9.5 µm, p.2); the thinnest coat, about 4.5 µm at 4000 rpm, is just under the table's 5 µm starting point, where no dose is published. The table is not attributed to a specific wavelength.
Development
- Developer
- 2.38% TMAH (0.26N) aqueous alkaline developer (primary); SU-8 Developer (solvent-based) is also usable as an alternative
- Dilution
- 2.38% TMAH (0.26N), used as supplied
- Time
- 3 min
- Method
- immersion
- Rinse
- DI water, ~20 s spray rinse, then filtered air/N2 dry (TMAH path). If the optional SU-8-developer alternative is used instead, rinse is ~10 s fresh developer spray then ~10 s IPA spray, per the SU-8-developer note.
- Developer family
- TMAH or solvent
SOURCE: "Development" section, p.3; Table 6 (TMAH), Table 7 (SU-8 developer) and "Rinse and Dry" section, p.4
Hard bake, etch & strip
- Hard bake
- Not published — characterize on-tool
- Descum
- RIE, 2 min at 100 W with 10 sccm O2 at 100 mTorr — quoted as step 3 of the datasheet's plating sequence.
- Etch resistance
- Listed as a Feature: "Excellent dry etch resistance." Demonstrated in an application photo ("Etched Trenches", 10 µm features, 65 µm deep, credited to ULVAC) consistent with use as a DRIE (deep reactive ion etch) mask. No quantitative etch rate or selectivity numbers are published, and the photo is not attributed to a specific grade.2
- Stripper
- Remover PG (NMP): processed without a hard bake, KMPR 1000 swells, lifts and strips readily. Heat the bath to 80°C and immerse the substrate for 10-20 minutes; actual strip time depends on resist thickness and agitation (e.g. ultrasound). Recommended sequence: Remover PG 10 min @80°C → DI water rinse → plasma removal if required. Plasma removal: RIE 200 W, 80 sccm O2, 8 sccm CF4, 100 mTorr, 10°C.3
- Storage
- Store frozen, in tightly closed, upright containers, at 14°F (-10°C), away from light, heat, acids, and ignition sources. Shelf life is thirteen months from the date of manufacture at 14°F (-10°C), typically one to two months at room temperature. Defrost at room temperature for 24 hours before use.4
SOURCE: "Plating" section note, p.3
Where it's used
Practical notes from the datasheet
KMPR 1005 is the lowest-viscosity, thinnest-coating grade in Kayaku Microchem/MicroChem's KMPR 1000 line (95 cSt / 45% solids, per Table 1) — the thin-film complement to the thick-mold KMPR 1050 grade. Unlike the solvent-developed SU-8 2000 family, it is a chemically amplified epoxy resist designed to develop in aqueous TMAH — a meaningful process difference worth flagging for anyone assuming all thin epoxy negative resists behave like SU-8. Its spin-chart trace runs 4.5-9.5 µm, so almost all of it sits in the datasheet's first thickness row (5-11 µm), and the soft-bake, exposure-dose and TMAH-develop tables each give one number for this grade: 5 min soft bake, 235-335 mJ/cm² and 3 min in TMAH. Only the thinnest coat, about 4.5 µm at 4000 rpm, falls just below that row. A distinctive storage gotcha carries over from the family datasheet: KMPR 1000 resists must be stored frozen (14°F/-10°C) and require a full 24-hour room-temperature thaw before use — treating it like a room-temperature-stable resist will produce inconsistent films. Processed without a hard bake, it swells, lifts and strips in Remover PG at 80 °C in 10-20 minutes, followed by a DI water rinse and an O2/CF4 plasma clean-up if required.
Grades in this family
Other grades in the KMPR 1000 series line differ mainly in coating thickness:
Troubleshooting
Common failure modes for KMPR 1005, answered from the manufacturer's datasheet and application notes. These are starting points — your substrate, tooling and environment shift the specifics, so calibrate on-tool.
The pattern is already visible in my KMPR 1005 before it goes on the PEB hotplate. Is that a problem?
Yes — it means the film was overexposed. Kayaku's rule is that optimal exposure produces a visible latent image after the wafer is placed on the PEB hotplate and not before; an image before PEB indicates excessive exposure. The opposite failure is no image during or after PEB (it should show after 1 min), which means too little exposure, temperature or both. KMPR 1005 sits in the 5–11 µm row, 235–335 mJ/cm² on silicon, so run an exposure matrix inside that window.
SOURCE: KMPR 1000 Technical Data Sheet
Kayaku KMPR 1000 Technical Data Sheet, Ver. 6, Dec 2019 — Exposure note and Table 3 Exposure Dose, p.3; Post Exposure Bake note, p.3
Should KMPR 1005 be rinsed with IPA or water after developing?
It depends on the developer. KMPR 1000 is designed for 2.38 % TMAH (0.26 N): for a 5–11 µm KMPR 1005 film that is about 3 min immersion, then a 20 s DI water spray rinse and a dry with filtered air or nitrogen. SU-8 developer is a solvent alternative, about 2 min for this thickness, followed by a ~10 s fresh-developer spray and a ~10 s IPA spray. Times are approximate and depend on agitation.
SOURCE: Kayaku KMPR 1000 Technical Data Sheet, Ver. 6, Dec 2019 — Development, p.3; Tables 6–7 and Rinse and Dry, p.4
My KMPR 1005 has been sitting on the shelf at room temperature. Is it still good?
Check how long it has been out. KMPR 1000 is meant to be stored frozen at −10 °C (14 °F) in tightly closed, upright containers, away from light, heat, acids and ignition sources. Frozen, the shelf life is thirteen months from manufacture; at room temperature it is typically only one to two months. When you take a bottle out of the freezer, let it defrost at room temperature for 24 hours before use.
SOURCE: Kayaku KMPR 1000 Technical Data Sheet, Ver. 6, Dec 2019 — Storage, p.4
KMPR 1005 dose that works on silicon underexposes on my glass and metal wafers. How much should I add?
The published doses are for silicon (1X). Kayaku lists 1.5X for glass, Pyrex and ITO and 1.5–2X for silicon nitride, gold, aluminium, NiFe, copper, nickel and titanium. For KMPR 1005 the silicon baseline is the 5–11 µm row, 235–335 mJ/cm². The long-pass filter Kayaku recommends for vertical sidewalls (PL-360LP, which cuts UV below 350 nm) needs roughly 40 % more exposure time to reach the optimum dose.
SOURCE: KMPR 1000 Technical Data Sheet
Kayaku KMPR 1000 Technical Data Sheet, Ver. 6, Dec 2019 — Exposure, Table 3 Exposure Dose and Table 4 Exposure Doses for Substrates, p.3
Sources & disclaimer
- Kayaku Microchem (MicroChem) — KMPR 1005 datasheet (Ver. 6, December 2019 (printed in the footer of every page)) · accessed 2026-09-10
- "Substrate Preparation", pp.1–2, and "Plating", p.4.
- "Features" list and application photos, p.1.
- "Removal" / "Process Recommendation" / "Plasma Removal", p.4.
- "Storage", p.4.
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-09-28.