Skip to content
NANYTE

KMPR 1005 process recipe

KMPR 1005 is the thinnest grade of Kayaku Microchem/MicroChem's KMPR 1000 series, a chemically amplified, TMAH-developable, epoxy negative photoresist for thin (~5-10 µm) high-aspect-ratio MEMS, electroplating-mold, and DRIE-mask structures.

https://nanyte.com/photoresists/kmpr-1005 · last updated 2026-07-22

At a glance
Download PDF
Manufacturer
Kayaku Microchem (MicroChem)
Tone
negative
Chemistry
Epoxy (SU-8 type)
Thickness
5.1–9.7 µm
Developer
2.38% TMAH (0.26N) aqueous alkaline developer (primary); SU-8 Developer (solvent-based) is also usable as an alternative
Applications
High aspect ratio · MEMS structural · Electroplating / molding · Etch mask
Etch maskSuitable for
Coat5.1–9.7 µmSoftbake100 °C · 5 min · hotplateDevelop3 min
—01 / Coating

Spin coating

KMPR 1005 is spin-coated to 5.1–9.7 µm. The curve below is redrawn from the manufacturer's published data — read your target thickness off the vertical axis and take the matching spin speed as a starting point.

Spin curves for KMPR 1005: film thickness in µm against spin speed in rpm.0.005.01015201k2k3k4kSPIN SPEED (rpm)THICKNESS (µm)
Data points
KMPR 1005 — film thickness (µm) by spin speed (rpm)
Seriesrpmµm
KMPR 100510009.7
20007.0
30005.8
40005.1
KMPR 1005 (23°C Japan & Asia)10009.4
20007.4
30006.2
40005.8

Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool. Series digitized from a published figure are approximate (±10 %).

KMPR 1005: digitized from Figure 1 "Spin speed vs. Thickness for KMPR® 1000 resists (21°C US & EU)", p.2 of the Kayaku Microchem/MicroChem "KMPR 1000 Chemically Amplified Negative Photoresist" datasheet (Ver. 4.2 — the SAME datasheet PDF already on file as kmpr-1050.json's provenance; this is a single family document covering all four viscosities). The chart plots four curves (1050/filled square, 1025/filled diamond, 1010/filled circle, 1005/open square), each with 4 markers at 1000/2000/3000/4000 rpm. Points were extracted programmatically rather than eyeballed: each marker's vector-path bounding-box center was read directly from the PDF's embedded vector graphics (PyMuPDF page.get_drawings()), and the pixel-to-value scale was calibrated from the y-axis gridline tick-label pixel positions (10-110 µm, from the PDF text layer) and the x-axis rpm tick-label pixel positions (1000-5000 rpm, same source). The KMPR 1005 series was identified as the open-square (white fill, black stroke), lowest-thickness-at-every-rpm curve — consistent with its legend position (listed last) and Table 1's viscosity ordering (1005 = 95 cSt, the lowest of the four, so it should coat thinnest at a given speed). Still a figure read (a chart, not a numeric table) — no numeric table of these values is published — but this same digitization pipeline independently reproduced kmpr-1050.json's already-recorded 1050-series values (101/68/51/44 µm) to within 1%, cross-validating the pixel-to-value calibration used here.

KMPR 1005 (23°C Japan & Asia): digitized from Figure 2 "Spin speed vs. Thickness for KMPR® 1000 resists (23°C Japan & Asia)", p.2 of the same Kayaku Microchem/MicroChem "KMPR 1000" datasheet (Ver. 4.2). Same digitization method as the Figure 1 series above (vector-path marker centers + axis-tick pixel calibration, both read directly from the PDF). The KMPR 1005 series was again the open-square, lowest-thickness curve. This digitization reproduced kmpr-1050.json's already-recorded Figure-2 1050-series values (115/67/47/34 µm) to within 1%, the same cross-validation used for the Figure 1 series.

2 series redrawn from the manufacturer's published data — hover to read values between points, click to pin.

Recommended program: dispense 1 ml of resist per inch (25 mm) of substrate diameter; spin at 500 rpm for 5-10 s at 100 rpm/s acceleration, then spin at the target speed for 30 s at 300 rpm/s acceleration. The document publishes TWO spin curves for the same four resists at two different ambient conditions: Figure 1 (21°C, US & EU) and Figure 2 (23°C, Japan & Asia) — the curves are not identical for KMPR 1005 either (e.g. ~9.7 µm at 1000 rpm on the US/EU curve vs. ~9.4 µm on the Japan/Asia curve), a reminder that spin results are sensitive to coat-bowl ambient temperature/humidity and should be recharacterized on-tool. Both curves are captured above, digitized by extracting marker vector-path pixel positions and axis tick-label pixel positions directly from the PDF. Source: "Coat" / "Recommended Program", p.1, and Figures 1-2, p.2.

Adhesion
HMDS not required — "Adhesion promoters are typically not required." HMDS pretreatment (MCC Primer 80/20) is recommended "for applications that require electroplating" — and the document's own Plating process recipe lists HMDS as its first step. This guidance is stated generically for the KMPR 1000 family, not per-grade. Source: "Substrate Preparation", p.1, and "Plating", p.3.
—02 / Bake

Soft bake

Soft bake
100 °C · 5 min · hotplate
Notes
Recommended bake temperature is 100°C (95-105°C also usable, per text). Time is published as a THICKNESS-BINNED table (Table 2): 5-11 µm → 5 min; 12-20 µm → 7 min; 21-30 µm → 12 min; 31-55 µm → 15 min; 56-80 µm → 20 min. KMPR 1005's entire digitized thickness range (~5.1-9.7 µm across both spin charts) falls inside the first bin, so a single unambiguous time applies across the whole grade: 5 minutes at 100°C (unlike kmpr-1050, whose range spans multiple bins and its own thick end exceeds the table). Convection ovens are explicitly not recommended — a skin can form and trap solvent. A cool-down/re-heat 'wrinkle' check is described to confirm the film is fully dry before exposure.

SOURCE: Table 2 "Soft Bake Times" and "Soft Bake" section text, p.2

—03 / Exposure

Exposure dose

The manufacturer does not publish a clearing dose for KMPR 1005. Determine it with a dose array on your own tool.

As published
"KMPR® 1000 is most commonly exposed with conventional UV (350-400 nm) radiation, although i-line (365 nm) is recommended. It may also be exposed with e-beam or x-ray radiation." (Processing Guidelines, p.1); the front-page banner separately calls the product a "KMPR®1000 i-Line photoresist." The dose table (Table 3) is not separately re-attributed to a specific wavelength beyond this general statement.
Post-exposure bake
100 °C · 2 min

Not published for this resist: Dose at 365 nm, Dose at 405 nm — characterize on-tool.

—04 / Development

Development

Developer
2.38% TMAH (0.26N) aqueous alkaline developer (primary); SU-8 Developer (solvent-based) is also usable as an alternative
Dilution
2.38% TMAH (0.26N), used at this standard concentration (not diluted from a stock in the document)
Time
3 min
Method
immersion
Rinse
DI water, ~20 s spray rinse, then filtered air/N2 dry (TMAH path). If the optional SU-8-developer alternative is used instead, rinse is ~10 s fresh developer spray then ~10 s IPA spray, per the SU-8-developer note.
Developer family
TMAH-based

SOURCE: "Develop" and "Rinse and Dry" sections plus Table 5 (TMAH) and Table 6 (SU-8 developer), p.3

—05 / Post-processing

Hard bake, etch & strip

Etch resistance
Listed as a Feature: "Excellent dry etch resistance." Demonstrated in an application photo ("Etched Trenches", 10 µm features, 65 µm deep, credited to ULVAC) consistent with use as a DRIE (deep reactive ion etch) mask. No quantitative etch rate or selectivity numbers are published, and the photo is not attributed to a specific grade. Source: "Features" list and application photos, p.1.
Stripper
MicroChem Remover PG (NMP): heat bath to 80°C, immerse substrate 10-20 minutes (actual time depends on resist thickness and agitation, e.g. ultrasound). For fully electroformed metal structures, a stronger sequence is given: Remover PG 10 min @80°C → DIW rinse → XP Remover K (epoxy stripping chemistry) 10 min @80°C → DIW rinse → XP Neutralizer K 3 min @25°C. Plasma removal: RIE 200 W, 80 sccm O2, 8 sccm CF4, 100 mTorr, 10°C. Source: "Removal" / "Process Recommendation" / "Plasma Removal", p.3.
Storage
Store frozen, in tightly closed, upright containers, at 14°F (-10°C), away from light, heat, acids, and ignition sources. Shelf life is twelve months at 14°F (-10°C), but typically only one to two months at room temperature. Defrost at room temperature for 24 hours before use. Source: "Storage", p.4.

Not published for this resist: Hard bake, Descum — characterize on-tool.

SOURCE: "Plating" section note, p.3

—06 / Applications

Where it's used

Practical notes from the datasheet

KMPR 1005 is the lowest-viscosity, thinnest-coating grade in Kayaku Microchem/MicroChem's KMPR 1000 line (95 cSt / 45% solids, per Table 1) — the thin-film complement to kmpr-1050.json's thick-mold grade already in this library. Unlike the solvent-developed SU-8 2000 family, it is a chemically amplified epoxy resist designed to develop in aqueous TMAH — a meaningful process difference worth flagging for anyone assuming all thin epoxy negative resists behave like SU-8. Because its entire digitized thickness range (~5.1-9.7 µm) sits inside the datasheet's first thickness bin (5-11 µm), the soft-bake, exposure-dose and TMAH-develop tables all resolve to a single unambiguous number for this grade — a notably cleaner situation than kmpr-1050, whose thick end runs past every published table. A distinctive storage gotcha carries over from the family datasheet: KMPR 1000 resists must be stored frozen (14°F/-10°C) and require a full 24-hour room-temperature thaw before use — treating it like a room-temperature-stable resist will produce inconsistent films. The resist strips cleanly with Remover PG when only lightly cross-linked; a fully electroformed/plated structure needs the stronger Remover PG → XP Remover K → XP Neutralizer K sequence.

—07 / Family

Grades in this family

Other grades in the KMPR 1000 series line differ mainly in coating thickness:

KMPR 1000 series — grade comparison
GradeThicknessExposure dose
KMPR 1005 (this page)5.1–9.7 µm—
KMPR 105034–115 µm—
—08 / Sources

Sources & disclaimer

Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-07-22.

Cite this recipe

NANYTE. "KMPR 1005 process recipe." NANYTE Photoresist Library. https://nanyte.com/photoresists/kmpr-1005. Accessed 2026-07-22.

Ready to run this process on your own tool?Talk to an engineer →

Expose it at 365 and 405 nm

NANYTE BEAM is a desktop maskless lithography system with software-selectable dual-wavelength exposure and 16-bit grayscale — no photomask, no mask cost, same-day iteration.

What is NANYTE BEAM?

Improve this recipe

Run this resist in your lab? Send us what actually works, or flag a value that's wrong. No account, no email needed — a handle and affiliation are optional and become your credit line. Every contribution is checked against published sources before it appears.