https://nanyte.com/photoresists/su-8-2035 · last updated 2026-09-13
- Manufacturer
- Kayaku Advanced Materials
- Tone
- negative
- Chemistry
- Epoxy (SU-8 type)
- Thickness
- 33–119 µm
- Developer
- SU-8 Developer; ethyl lactate or diacetone alcohol may also be used
- Applications
- MEMS structural · High aspect ratio · Electroplating / molding
Cross-checked — two independent extractions agree on the spin curve and the single-value figures.
- Substrate
- Resist
- Exposed
Spin coating
Data points
| Series | rpm | µm | Published dose |
|---|---|---|---|
| SU-8 2035 | 1000 | 119 | 215–240 mJ/cm² · 85–110 µm row 240–260 mJ/cm² · 115–150 µm row within 10 % of a bracket edge |
| 2000 | 58 | 150–215 mJ/cm² · 45–80 µm row | |
| 3000 | 44 | — | |
| 4000 | 33 | 150–160 mJ/cm² · 25–40 µm row |
Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool. Series digitized from a published figure are approximate (±10 %).
Published dose is the datasheet’s own thickness bracket, quoted as printed — the full table and its citation are in the exposure section. A thickness the table does not cover shows nothing, and a thickness within 10 % of a bracket edge shows every bracket it could fall in.
read from figure — the diamond markers legended 'SU-8 2035' on Figure 1 'SU-8 2000 Thickness vs. Spin Speed', p.2 of the SU-8 2000, 2025-2075 Technical Data Sheet, August 2020. Four plotted markers at 1000, 2000, 3000 and 4000 rpm; no numeric table accompanies the chart. Marker centres located against the 20 µm axis ticks of the embedded chart image; values are reads to about ±1 µm.
- 119 µm at 1000 rpm drops by half to 58 µm at 2000 rpm, then 44 µm at 3000 and 33 µm at 4000 — only four speeds are plotted, and the gap between 1000 and 2000 rpm is where thickness is most sensitive.
- Kayaku's recommended program for the series: dispense 1 ml of resist per inch (25 mm) of substrate diameter, spread at 500 rpm for 5-10 s at 100 rpm/s, then spin at 2000 rpm for 30 s at 300 rpm/s, choosing the final speed from the spin chart.
- Remove the edge bead with EBR PG so the mask can seat in close contact.
- Adhesion
- HMDS not required — 'Adhesion promoters are typically not required.' Clean and dry the substrate first — piranha (H2SO4 and H2O2) with a DI rinse, or RIE or an oxygen barrel asher.
Soft bake
- Soft bake
- 95 °C · hotplate
- Notes
- Times are set by film thickness, at 65 °C and then at 95 °C: 25-40 µm → 0-3 min at 65 °C then 5-6 min at 95 °C; 45-80 µm → 0-3 then 6-9 min; 85-110 µm → 5 then 10-20 min; 115-150 µm → 5 then 20-30 min. Use a level hotplate — convection ovens are not recommended because a skin can form and trap solvent.
SOURCE: Table 2 'Soft Bake Times', p.3 of the SU-8 2000, 2025-2075 Technical Data Sheet, August 2020
Exposure dose
SU-8 2035's dose is published against film thickness, not as a single number. Read the row for the film you coat and run a dose array around it.
- As published
- Dose follows the film you spin, not the grade name: 25-40 µm films take 150-160 mJ/cm², 45-80 µm 150-215, 85-110 µm 215-240 and 115-150 µm 240-260 mJ/cm².
- Post-exposure bake
- 95 °C · hotplate
| Film thickness | Dose |
|---|---|
| 25–40 µm | 150–160 mJ/cm² |
| 45–80 µm | 150–215 mJ/cm² |
| 85–110 µm | 215–240 mJ/cm² |
| 115–150 µm | 240–260 mJ/cm² |
| 160–225 µm | 260–350 mJ/cm² |
SOURCE: SU-8 2000 2025-2075 Technical Data Sheet
Table 3 'Exposure Dose', p.3 of the SU-8 2000, 2025-2075 Technical Data Sheet, August 2020 — indexed by film thickness and shared by the four grades that sheet covers; no wavelength is attached to the table.
Development
- Developer
- SU-8 Developer; ethyl lactate or diacetone alcohol may also be used
- Method
- immersion, spray or spray-puddle
- Rinse
- Spray and wash with fresh SU-8 developer for about 10 s, and again for another 10 s if needed, then air-dry with filtered pressurised air or nitrogen.
- Developer family
- Solvent
Not published for this resist: Dilution, Time — characterize on-tool.
SOURCE: SU-8 2000 2025-2075 Technical Data Sheet
Development section and Table 6 'Development Times for SU-8 Developer', p.4 of the SU-8 2000, 2025-2075 Technical Data Sheet, August 2020
Hard bake, etch & strip
- Hard bake
- 150–250 °C · 5–30 min
- Descum
- Not published — characterize on-tool
- Etch resistance
- Not characterised as an etch mask.
- Stripper
- Minimally cross-linked SU-8 2000 swells and lifts off in Remover PG at 50-80 °C for 30-90 min; with a 30-100 nm OmniCoat underlayer the lift-off is clean.
- Storage
- Store upright in tightly closed containers in a cool, dry place away from direct sunlight, light, acids, heat and ignition sources, at 4-21 °C (40-70 °F).
SOURCE: Hard bake (cure) section, p.5 of the SU-8 2000, 2025-2075 Technical Data Sheet, August 2020
Where it's used
Practical notes from the datasheet
SU-8 2035 (7000 cSt, 69.95 % solids) sits between SU-8 2025 and 2050, and reaches 40-60 µm in the flat part of its curve. Its practical sweet spot is 2000-3000 rpm, where the curve has flattened and the 45-80 µm process row applies: 0-3 minutes at 65 °C then 6-9 minutes at 95 °C, 150-215 mJ/cm², post-bake 6-7 minutes at 95 °C, preceded by 1-2 minutes at 65 °C that the sheet marks optional for stress reduction, and 5-7 minutes in SU-8 Developer with strong agitation. Below 2000 rpm the film climbs quickly towards 120 µm and every step of the process lengthens. If surface cracks appear after development, the sheet anneals them with a couple of minutes at 150 °C. The cured epoxy is permanent — use OmniCoat underneath if it must be released.
Grades in this family
Other grades in the SU-8 2000 series line differ mainly in coating thickness:
Sources & disclaimer
- Kayaku Advanced Materials — SU-8 2035 datasheet (SU-8 2000, 2025-2075 Technical Data Sheet, August 2020) · accessed 2026-09-10
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-09-13.