https://nanyte.com/photoresists/su-8-2007 · last updated 2026-09-13
- Manufacturer
- Kayaku Advanced Materials
- Tone
- negative
- Chemistry
- Epoxy (SU-8 type)
- Thickness
- 6.7–12.4 µm
- Developer
- SU-8 Developer; ethyl lactate or diacetone alcohol may also be used
- Applications
- MEMS structural · High aspect ratio · Electroplating / molding
Cross-checked — two independent extractions agree on the spin curve and the single-value figures.
- Substrate
- Resist
- Exposed
Spin coating
Data points
| Series | rpm | µm | Published dose |
|---|---|---|---|
| SU-8 2007 | 1000 | 12 | 110–140 mJ/cm² · 6–15 µm row |
| 1500 | 10 | 110–140 mJ/cm² · 6–15 µm row | |
| 2000 | 8.3 | 110–140 mJ/cm² · 6–15 µm row | |
| 2500 | 7.4 | 110–140 mJ/cm² · 6–15 µm row | |
| 3000 | 6.9 | 110–140 mJ/cm² · 6–15 µm row | |
| 3500 | 6.7 | 110–140 mJ/cm² · 6–15 µm row |
Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool. Series digitized from a published figure are approximate (±10 %).
Published dose is the datasheet’s own thickness bracket, quoted as printed — the full table and its citation are in the exposure section. A thickness the table does not cover shows nothing, and a thickness within 10 % of a bracket edge shows every bracket it could fall in.
read from figure — the grey triangle markers legended 'SU-8 2007' on Figure 1b 'SU-8 2000 Thickness vs. Spin Speed', p.2 of the SU-8 2000, 2000.5-2015 Technical Data Sheet, ver. 1, August 2020. Six of its seven plotted markers at 500 rpm steps; no numeric table accompanies the chart. Marker centres located against the 5 µm axis ticks of the embedded chart image. The 4000 rpm marker is left out; see the spin notes.
- The markers run from 12.4 µm at 1000 rpm to 6.7 µm at 3500 rpm.
- The chart's seventh marker, at 4000 rpm, sits higher than the 3500 rpm one, at about 7.2 µm — a film cannot get thicker as the wafer spins faster, so that point is not carried; treat the grade as bottoming out near 7 µm.
- Kayaku's recommended program for the series: dispense 1 ml of resist per inch (25 mm) of substrate diameter, spread at 500 rpm for 5-10 s at 100 rpm/s, then spin at 2000 rpm for 30 s at 300 rpm/s, choosing the final speed from the spin chart.
- Remove the edge bead with EBR PG so the mask can seat in close contact.
- Adhesion
- HMDS not required — 'Adhesion promoters are typically not required.' Clean and dry the substrate first — piranha (H2SO4 and H2O2) with a DI rinse, or RIE or an oxygen barrel asher.
Soft bake
- Soft bake
- 95 °C · hotplate
- Notes
- Times are set by film thickness: 6-15 µm → 2-3 min at 95 °C. Use a level hotplate — convection ovens are not recommended because a skin can form and trap solvent.
SOURCE: Table 2 'Soft Bake Times', p.3 of the SU-8 2000, 2000.5-2015 Technical Data Sheet, ver. 1, August 2020
Exposure dose
SU-8 2007's dose is published against film thickness, not as a single number. Read the row for the film you coat and run a dose array around it.
- As published
- Dose follows the film you spin, not the grade name: 6-15 µm films take 110-140 mJ/cm². On glass and most metals multiply by 1.5-2.
- Post-exposure bake
- 95 °C · hotplate
| Film thickness | Dose |
|---|---|
| 0.5–2 µm | 60–180 mJ/cm² |
| 3–5 µm | 90–105 mJ/cm² |
| 6–15 µm | 110–140 mJ/cm² |
| 16–25 µm | 140–150 mJ/cm² |
| 26–40 µm | 150–160 mJ/cm² |
SOURCE: SU-8 2000 2000.5-2015 Technical Data Sheet
Table 3 'Exposure Dose', p.3 of the SU-8 2000, 2000.5-2015 Technical Data Sheet, ver. 1, August 2020 — indexed by film thickness and shared by the six grades that sheet covers; no wavelength is attached to the table.
Development
- Developer
- SU-8 Developer; ethyl lactate or diacetone alcohol may also be used
- Method
- immersion, spray or spray-puddle
- Rinse
- Spray and wash the developed image with fresh SU-8 developer for about 10 s, then air-dry with filtered pressurised air or nitrogen.
- Developer family
- Solvent
Not published for this resist: Dilution, Time — characterize on-tool.
SOURCE: SU-8 2000 2000.5-2015 Technical Data Sheet
Development section and Table 6 'Development Times for SU-8 Developer', p.4 of the SU-8 2000, 2000.5-2015 Technical Data Sheet, ver. 1, August 2020
Hard bake, etch & strip
- Hard bake
- 150–250 °C · 5–30 min
- Descum
- Not published — characterize on-tool
- Etch resistance
- Not characterised as an etch mask.
- Stripper
- Minimally cross-linked SU-8 2000 swells and lifts off in Remover PG at 50-80 °C for 30-90 min; with a 30-100 nm OmniCoat underlayer the lift-off is clean.
- Storage
- Store upright in tightly closed containers in a cool, dry place away from direct sunlight, light, acids, heat and ignition sources, at 4-21 °C (40-70 °F).
SOURCE: Hard bake (cure) section, p.5 of the SU-8 2000, 2000.5-2015 Technical Data Sheet, ver. 1, August 2020
Where it's used
Practical notes from the datasheet
SU-8 2007 covers roughly 7-12 µm, and its whole range sits inside a single row of the sheet's process tables, which makes it simple to set up: soft bake 2-3 minutes at 95 °C, expose 110-140 mJ/cm² on silicon, post-bake 3-4 minutes, and develop 2-3 minutes in SU-8 Developer. That is the practical case for it over SU-8 2010, whose thicker coats push into the next row. The published spin chart has one inconsistent marker — its 4000 rpm point reads thicker than 3500 rpm — so do not expect to thin this grade much below 7 µm by spinning harder. The cured epoxy is permanent and hard to strip; plan OmniCoat if it must be removed.
Grades in this family
Other grades in the SU-8 2000 series line differ mainly in coating thickness:
Sources & disclaimer
- Kayaku Advanced Materials — SU-8 2007 datasheet (SU-8 2000, 2000.5-2015 Technical Data Sheet, ver. 1, August 2020) · accessed 2026-09-10
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-09-13.