https://nanyte.com/photoresists/su-8-2005 · last updated 2026-09-13
- Manufacturer
- Kayaku Advanced Materials
- Tone
- negative
- Chemistry
- Epoxy (SU-8 type)
- Thickness
- 4.6–7.8 µm
- Developer
- SU-8 Developer; ethyl lactate or diacetone alcohol may also be used
- Applications
- MEMS structural · High aspect ratio · Electroplating / molding
Cross-checked — two independent extractions agree on the spin curve and the single-value figures.
- Substrate
- Resist
- Exposed
Spin coating
Data points
| Series | rpm | µm | Published dose |
|---|---|---|---|
| SU-8 2005 | 1000 | 7.8 | 110–140 mJ/cm² · 6–15 µm row |
| 1500 | 6.4 | 110–140 mJ/cm² · 6–15 µm row within 10 % of a bracket edge | |
| 2000 | 5.8 | — | |
| 2500 | 5.3 | — | |
| 3000 | 5.1 | — | |
| 3500 | 4.7 | 90–105 mJ/cm² · 3–5 µm row within 10 % of a bracket edge | |
| 4000 | 4.6 | 90–105 mJ/cm² · 3–5 µm row within 10 % of a bracket edge |
Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool. Series digitized from a published figure are approximate (±10 %).
Published dose is the datasheet’s own thickness bracket, quoted as printed — the full table and its citation are in the exposure section. A thickness the table does not cover shows nothing, and a thickness within 10 % of a bracket edge shows every bracket it could fall in.
read from figure — the green round markers legended 'SU-8 2005' on Figure 1b 'SU-8 2000 Thickness vs. Spin Speed', p.2 of the SU-8 2000, 2000.5-2015 Technical Data Sheet, ver. 1, August 2020. Seven plotted markers at 500 rpm steps; no numeric table accompanies the chart. Marker centres located against the 5 µm axis ticks of the embedded chart image.
- From 7.8 µm at 1000 rpm the curve flattens quickly — above 2000 rpm every extra 500 rpm takes off only a few tenths of a micron, ending at 4.6 µm at 4000 rpm.
- Kayaku's recommended program for the series: dispense 1 ml of resist per inch (25 mm) of substrate diameter, spread at 500 rpm for 5-10 s at 100 rpm/s, then spin at 2000 rpm for 30 s at 300 rpm/s, choosing the final speed from the spin chart.
- Remove the edge bead with EBR PG so the mask can seat in close contact.
- Adhesion
- HMDS not required — 'Adhesion promoters are typically not required.' Clean and dry the substrate first — piranha (H2SO4 and H2O2) with a DI rinse, or RIE or an oxygen barrel asher.
Soft bake
- Soft bake
- 95 °C · hotplate
- Notes
- Times are set by film thickness: 3-5 µm → 2 min and 6-15 µm → 2-3 min at 95 °C. Use a level hotplate — convection ovens are not recommended because a skin can form and trap solvent.
SOURCE: Table 2 'Soft Bake Times', p.3 of the SU-8 2000, 2000.5-2015 Technical Data Sheet, ver. 1, August 2020
Exposure dose
SU-8 2005's dose is published against film thickness, not as a single number. Read the row for the film you coat and run a dose array around it.
- As published
- Dose follows the film you spin, not the grade name: 3-5 µm films take 90-105 mJ/cm² and 6-15 µm films 110-140 mJ/cm².
- Post-exposure bake
- 95 °C · hotplate
| Film thickness | Dose |
|---|---|
| 0.5–2 µm | 60–180 mJ/cm² |
| 3–5 µm | 90–105 mJ/cm² |
| 6–15 µm | 110–140 mJ/cm² |
| 16–25 µm | 140–150 mJ/cm² |
| 26–40 µm | 150–160 mJ/cm² |
SOURCE: SU-8 2000 2000.5-2015 Technical Data Sheet
Table 3 'Exposure Dose', p.3 of the SU-8 2000, 2000.5-2015 Technical Data Sheet, ver. 1, August 2020 — indexed by film thickness and shared by the six grades that sheet covers; no wavelength is attached to the table.
Development
- Developer
- SU-8 Developer; ethyl lactate or diacetone alcohol may also be used
- Method
- immersion, spray or spray-puddle
- Rinse
- Spray and wash the developed image with fresh SU-8 developer for about 10 s, then air-dry with filtered pressurised air or nitrogen.
- Developer family
- Solvent
Not published for this resist: Dilution, Time — characterize on-tool.
SOURCE: SU-8 2000 2000.5-2015 Technical Data Sheet
Development section and Table 6 'Development Times for SU-8 Developer', p.4 of the SU-8 2000, 2000.5-2015 Technical Data Sheet, ver. 1, August 2020
Hard bake, etch & strip
- Hard bake
- 150–250 °C · 5–30 min
- Descum
- Not published — characterize on-tool
- Etch resistance
- Not characterised as an etch mask.
- Stripper
- Minimally cross-linked SU-8 2000 swells and lifts off in Remover PG at 50-80 °C for 30-90 min; with a 30-100 nm OmniCoat underlayer the lift-off is clean.
- Storage
- Store upright in tightly closed containers in a cool, dry place away from direct sunlight, light, acids, heat and ignition sources, at 4-21 °C (40-70 °F).
SOURCE: Hard bake (cure) section, p.5 of the SU-8 2000, 2000.5-2015 Technical Data Sheet, ver. 1, August 2020
Where it's used
Practical notes from the datasheet
SU-8 2005 is the grade for permanent epoxy structures around five microns, thicker than SU-8 2002 can reach. Its curve is flat above about 2000 rpm, which makes the thickness forgiving of small speed errors but means spin speed is a weak lever; to go meaningfully thicker, step to SU-8 2007 or 2010 rather than slowing down. A 5 µm film straddles the sheet's 3-5 and 6-15 µm rows, so bake about 2 minutes at 95 °C, expose in the 90-140 mJ/cm² band on silicon and more on glass or metals, post-bake 2-4 minutes, and develop 1-3 minutes in SU-8 Developer. The cured film is permanent — use OmniCoat underneath if it has to be released.
Grades in this family
Other grades in the SU-8 2000 series line differ mainly in coating thickness:
Sources & disclaimer
- Kayaku Advanced Materials — SU-8 2005 datasheet (SU-8 2000, 2000.5-2015 Technical Data Sheet, ver. 1, August 2020) · accessed 2026-09-10
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-09-13.