https://nanyte.com/photoresists/kmpr-1010 · last updated 2026-09-12
- Manufacturer
- Kayaku Advanced Materials
- Tone
- negative
- Chemistry
- Epoxy (SU-8 type)
- Thickness
- 10–27 µm
- Developer
- 2.38 % TMAH (0.26 N) aqueous alkaline developer; SU-8 developer (solvent) may be used instead
- Applications
- High aspect ratio · MEMS structural · Electroplating / molding · Etch mask
Cross-checked — two independent extractions agree on the spin curve and the single-value figures.
- Substrate
- Resist
- Exposed
Spin coating
Data points
| Series | rpm | µm | Published dose |
|---|---|---|---|
| KMPR 1010 | 1000 | 27 | 500–645 mJ/cm² · 21–30 µm row |
| 2000 | 15 | 355–485 mJ/cm² · 12–20 µm row | |
| 3000 | 11 | 235–335 mJ/cm² · 5–11 µm row 355–485 mJ/cm² · 12–20 µm row within 10 % of a bracket edge | |
| 4000 | 10 | 235–335 mJ/cm² · 5–11 µm row |
Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool. Series digitized from a published figure are approximate (±10 %).
Published dose is the datasheet’s own thickness bracket, quoted as printed — the full table and its citation are in the exposure section. A thickness the table does not cover shows nothing, and a thickness within 10 % of a bracket edge shows every bracket it could fall in.
read from figure — the filled-circle trace legended KMPR 1010 on Figure 1, 'KMPR 1000 Thickness vs. Spin Speed', p.2. Four plotted markers; no numeric table accompanies the chart.
- Most of the range is spent in the first half of the sweep: 27 µm at 1000 rpm falls to 15 µm by 2000 rpm, then flattens to 11 and 10 µm at 3000 and 4000.
- So the thick end is where speed actually controls thickness, and anything under about 10 µm means dropping to KMPR 1005 rather than spinning faster.
- Table 1 puts this grade at 55 % solids and 600 cSt.
- The recommended program is a 500 rpm / 5-10 s spread at 100 rpm/s acceleration, then 30 s at the final speed at 300 rpm/s, dispensing 1 ml of resist per inch of substrate diameter.
- Adhesion
- HMDS recommended — Adhesion promoters are described as typically unnecessary; substrates should be clean and dry, ideally after a piranha clean and a de-ionized water rinse, or an O2 RIE/barrel-asher clean.
Soft bake
- Soft bake
- 100 °C (95–105 °C) · hotplate
- Notes
- 100 °C on a level hotplate is the recommended temperature, with 95-105 °C also usable.
SOURCE: Soft Bake section and Table 2, p.2 of the KMPR 1000 datasheet (Ver. 6, December 2019)
Exposure dose
KMPR 1010's dose is published against film thickness, not as a single number. Read the row for the film you coat and run a dose array around it.
- As published
- Dose is published against film thickness rather than against the grade, so it follows the coating: 235-335 mJ/cm² for a 5-11 µm film, 355-485 for 12-20 µm and 500-645 for 21-30 µm.
- Post-exposure bake
- 100 °C (95–105 °C) · hotplate
| Film thickness | Dose |
|---|---|
| 5–11 µm | 235–335 mJ/cm² |
| 12–20 µm | 355–485 mJ/cm² |
| 21–30 µm | 500–645 mJ/cm² |
SOURCE: KMPR 1000 datasheet
Table 3 'Exposure Dose' of the KMPR 1000 datasheet (Ver. 6). The three bins carried here are the ones this grade's thickness range crosses. The table is not attributed to a specific wavelength.
Development
- Developer
- 2.38 % TMAH (0.26 N) aqueous alkaline developer; SU-8 developer (solvent) may be used instead
- Method
- immersion, spray or spray-puddle
- Rinse
- After TMAH, spray rinse with de-ionized water for 20 s and blow dry with filtered air or nitrogen.
- Developer family
- TMAH or solvent
Not published for this resist: Dilution, Time — characterize on-tool.
SOURCE: Development and Rinse and Dry sections with Tables 6 and 7, p.3-4 of the KMPR 1000 datasheet (Ver. 6, December 2019)
Hard bake, etch & strip
- Hard bake
- Not published — characterize on-tool
- Descum
- RIE, 2 min at 100 W with 10 sccm O2 at 100 mTorr — quoted as step 3 of the datasheet's plating sequence.
- Etch resistance
- "Excellent dry etch resistance" (Features, p.1); the series is positioned for DRIE work, and the datasheet's own example shows 10 µm features etched to 65 µm deep.
- Stripper
- Remover PG (NMP) at 80 °C for 10-20 min by immersion, provided the film was never hard baked.
- Storage
- Store frozen at -10 °C (14 °F) in tightly closed upright containers, away from light, heat, acids and ignition sources.
Where it's used
Practical notes from the datasheet
KMPR 1010 is the step up from KMPR 1005 in Kayaku's chemically amplified epoxy negative series, coating 10 to 27 µm where 1005 stops near 9.5. The series is built for thick, vertical-walled masks that survive plating baths and dry etching and then come off again — which is the distinction from SU-8, whose cross-linked film is notoriously hard to strip. Almost every process number on this datasheet is keyed to film thickness rather than to the grade, so the grade choice really only decides which part of those tables you land in: across 10-27 µm that means a 5, 7 or 12 min soft bake, 235-645 mJ/cm², a 2 or 3 min post-exposure bake and 3-6 min in TMAH. Two things decide whether the result is usable. The post-exposure bake is not optional — it is where cross-linking happens, and the visible latent image after a minute on the hotplate is the built-in check that exposure was right. And hard baking is explicitly discouraged for plating work: an un-hard-baked film swells and lifts in Remover PG, while a baked one becomes much harder to strip.
Grades in this family
Other grades in the KMPR 1000 series line differ mainly in coating thickness:
Sources & disclaimer
- Kayaku Advanced Materials — KMPR 1010 datasheet (Ver. 6, December 2019 (printed in the footer of every page)) · accessed 2026-09-10
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-09-12.