https://nanyte.com/photoresists/lor-10a · last updated 2026-09-12
- Manufacturer
- MicroChem (MCC) — now Kayaku Advanced Materials
- Tone
- Not photoimageable (underlayer)
- Chemistry
- Ancillary (not photoimageable)
- Thickness
- 0.6–1.4 µm
- Exposure dose
- Not exposed — dissolves in developer
- Developer
- No specific commercial developer product is named for this grade; the datasheet states LOR/PMGI is compatible with both metal-ion-free (TMAH) and metal-ion-bearing developer chemistries.
- Applications
- Lift-off
Cross-checked — two independent extractions agree on the spin curve and the single-value figures.
- Substrate
- Underlayer
- Resist
- Exposed
Spin coating
Data points
| Series | rpm | µm |
|---|---|---|
| LOR 10A | 1000 | 1.4 |
| 1500 | 1.0 | |
| 2000 | 0.87 | |
| 2500 | 0.72 | |
| 3000 | 0.63 | |
| 3500 | 0.59 | |
| 4000 | 0.58 |
Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool. Series digitized from a published figure are approximate (±10 %).
read from figure — the green filled-triangle trace legended LOR 10A on the 'Thickness vs. Spin Speed - LOR A Thick Series' chart, p.5. Seven plotted markers at 500 rpm intervals; no numeric table accompanies the chart.
- From 14,300 Å at 1000 rpm the curve falls steeply to about 8,700 Å by 2000 rpm, then flattens hard — 3500 and 4000 rpm differ by only 100 Å.
- So the usable control range is really 1000-2500 rpm, and targeting much below 0.6 µm means dropping to LOR 7A or 5A rather than spinning faster.
- Coating parameters are published for the product line rather than per grade: 5 ml dispensed dynamically over 3-5 s onto a 150 mm wafer at 300-500 rpm, 10,000 rpm/s acceleration to a 3,000 rpm terminal speed, 45 s spin, with EBR PG for edge-bead and whisker removal.
- Adhesion
- HMDS not required — "Primers, such as HMDS, are typically not required" when LOR/PMGI is used as recommended; the datasheet describes excellent adhesion across semiconductor substrates.
Soft bake
- Soft bake
- Not published — characterize on-tool
- Notes
- The prebake dries the film and fixes its dissolution and undercut rate, and no grade-specific temperature or time is published.
SOURCE: "Soft-Bake/Prebake Process" section and Figures 5a-5b, Kayaku…
"Soft-Bake/Prebake Process" section and Figures 5a-5b, Kayaku "LOR and PMGI Resists" technical data sheet, Rev. D (August 2023)
Exposure
LOR 10A is not photoimageable. It is not exposed at all — it is coated beneath an imaged top resist and undercut laterally during development. See the development step below.
Development
- Developer
- No specific commercial developer product is named for this grade; the datasheet states LOR/PMGI is compatible with both metal-ion-free (TMAH) and metal-ion-bearing developer chemistries.
- Developer family
- TMAH or buffered alkaline
Not published for this resist: Dilution, Time, Method, Rinse — characterize on-tool.
SOURCE: Product description, the LOR/PMGI process-flow section and the…
Product description, the LOR/PMGI process-flow section and the product selection guide, Kayaku "LOR and PMGI Resists" technical data sheet, Rev. D (August 2023)
Hard bake, etch & strip
- Stripper
- Remover PG. EBR PG removes edge beads and whiskers and is also an effective spin-bowl cleaner and a rework solvent for unbaked wafers.
- Storage
- Store upright in original sealed containers in a dry area between 4 and 27 °C (40-80 °F), away from ignition sources, light, heat, oxidants, acids and reducers. Do not use after the expiration date.
Not published for this resist: Hard bake, Descum, Etch resistance — characterize on-tool.
Where it's used
Practical notes from the datasheet
LOR 10A is the thick end of the slow-dissolving A series, a PMGI-based sacrificial film spun beneath a conventional photoresist and never exposed. It is also the grade Kayaku leads the datasheet with: Figure 1 shows LOR 10A used under a high-temperature negative resist, which is the case the A series is built for — a slow underlayer whose undercut opens gradually and predictably, under an imaging resist whose own processing runs hot. Choosing 10A over the same-thickness 10B is not a thickness decision; both land around one micron. It is a decision to take the slower film, trading a wider undercut per unit develop time for a wider process window before the ledge runs too far under a feature. At 0.58-1.43 µm the film is thick enough for substantial metal stacks, and thick enough that prebake temperature and develop time both start to matter more than they do on the sub-micron A grades.
Grades in this family
Other grades in the LOR A series line differ mainly in coating thickness:
Sources & disclaimer
- MicroChem (MCC) — now Kayaku Advanced Materials — LOR 10A datasheet (Rev. D, August 2023 (printed in the footer of every page)) · accessed 2026-09-10
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-09-12.