https://nanyte.com/photoresists/lor-15b · last updated 2026-09-12
- Manufacturer
- MicroChem (MCC) — now Kayaku Advanced Materials
- Tone
- Not photoimageable (underlayer)
- Chemistry
- Ancillary (not photoimageable)
- Thickness
- 1–2.2 µm
- Exposure dose
- Not exposed — dissolves in developer
- Developer
- No specific commercial developer product is named for this grade; the datasheet states LOR/PMGI is compatible with both metal-ion-free (TMAH) and metal-ion-bearing developer chemistries.
- Applications
- Lift-off
Cross-checked — two independent extractions agree on the spin curve and the single-value figures.
- Substrate
- Underlayer
- Resist
- Exposed
Spin coating
Data points
| Series | rpm | µm |
|---|---|---|
| LOR 15B | 1000 | 2.2 |
| 1500 | 1.6 | |
| 2000 | 1.4 | |
| 2500 | 1.2 | |
| 3000 | 1.1 | |
| 3500 | 1.0 | |
| 4000 | 1.0 |
Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool. Series digitized from a published figure are approximate (±10 %).
read from figure — the red filled-square trace legended LOR 15B on the 'Thickness vs. Spin Speed - LOR B Thick Series' chart, p.5, the middle of the five traces. Seven plotted markers at 500 rpm intervals; no numeric table accompanies the chart.
- A well-behaved curve that lands on a round number at each end — 21,700 Å at 1000 rpm down to almost exactly 10,000 Å at 4000, so the grade covers a clean factor of two.
- The knee sits around 1500-2000 rpm; below it thickness climbs quickly, above it the curve is nearly flat and speed buys little.
- Coating parameters are published for the product line rather than per grade: 5 ml dispensed dynamically over 3-5 s onto a 150 mm wafer at 300-500 rpm, 10,000 rpm/s acceleration to a 3,000 rpm terminal speed, 45 s spin, with EBR PG for edge-bead and whisker removal.
- Adhesion
- HMDS not required — "Primers, such as HMDS, are typically not required" when LOR/PMGI is used as recommended; the datasheet describes excellent adhesion across semiconductor substrates.
Soft bake
- Soft bake
- Not published — characterize on-tool
- Notes
- The prebake dries the film and fixes its dissolution and undercut rate, and no grade-specific temperature or time is published.
SOURCE: "Soft-Bake/Prebake Process" section and Figures 5a-5b, Kayaku…
"Soft-Bake/Prebake Process" section and Figures 5a-5b, Kayaku "LOR and PMGI Resists" technical data sheet, Rev. D (August 2023)
Exposure
LOR 15B is not photoimageable. It is not exposed at all — it is coated beneath an imaged top resist and undercut laterally during development. See the development step below.
Development
- Developer
- No specific commercial developer product is named for this grade; the datasheet states LOR/PMGI is compatible with both metal-ion-free (TMAH) and metal-ion-bearing developer chemistries.
- Developer family
- TMAH or buffered alkaline
Not published for this resist: Dilution, Time, Method, Rinse — characterize on-tool.
SOURCE: Product description, the LOR/PMGI process-flow section and the…
Product description, the LOR/PMGI process-flow section and the product selection guide, Kayaku "LOR and PMGI Resists" technical data sheet, Rev. D (August 2023)
Hard bake, etch & strip
- Stripper
- Remover PG. EBR PG removes edge beads and whiskers and is also an effective spin-bowl cleaner and a rework solvent for unbaked wafers.
- Storage
- Store upright in original sealed containers in a dry area between 4 and 27 °C (40-80 °F), away from ignition sources, light, heat, oxidants, acids and reducers. Do not use after the expiration date.
Not published for this resist: Hard bake, Descum, Etch resistance — characterize on-tool.
Where it's used
Practical notes from the datasheet
LOR 15B is a PMGI-based sacrificial underlayer from the fast-dissolving B series, spun beneath a conventional photoresist and never exposed. It sits between 10B and 20B, which makes it the grade for deposits in the one-to-two micron range that want B-series speed — a generous ledge opened quickly — without the extra thickness of 20B. The reason to want speed is mechanical: a thick deposit needs the underlayer to pull back far enough that the metal breaks cleanly at the edge rather than tearing. The reason to be careful with it is the same property seen from the other side, because a fast film keeps undercutting for as long as the imaging resist above is developing, and the datasheet singles out develop time as a particularly strong influence on where the ledge ends up. Of all the B grades, this one has the closest published characterisation to lean on: the undercut-versus-bake figures are measured on LOR 10B, its immediate neighbour.
Grades in this family
Other grades in the LOR B series line differ mainly in coating thickness:
Sources & disclaimer
- MicroChem (MCC) — now Kayaku Advanced Materials — LOR 15B datasheet (Rev. D, August 2023 (printed in the footer of every page)) · accessed 2026-09-10
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-09-12.