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LOR 7A process recipe

LOR 7A coats 0.44-1.07 µm, the A-series grade that crosses one micron at its slowest spin and settles just under half a micron at its fastest.

https://nanyte.com/photoresists/lor-7a · last updated 2026-09-12

At a glance
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Manufacturer
MicroChem (MCC) — now Kayaku Advanced Materials
Tone
Not photoimageable (underlayer)
Chemistry
Ancillary (not photoimageable)
Thickness
0.4–1.1 µm
Exposure dose
Not exposed — dissolves in developer
Developer
No specific commercial developer product is named for this grade; the datasheet states LOR/PMGI is compatible with both metal-ion-free (TMAH) and metal-ion-bearing developer chemistries.
Applications
Lift-off

Cross-checked — two independent extractions agree on the spin curve and the single-value figures.

The underlayer is never exposed: it sits beneath an imaged top resist and the developer undercuts it laterally, leaving the overhang lift-off relies on. Schematic cross-sections for LOR 7A — feature width, film aspect ratio and sidewall angle are illustrative, not to scale.
01 / Coating

Spin coating

Spin curve for LOR 7A: film thickness in µm against spin speed in rpm.0.20.40.60.81.01.21k2k3k4kSPIN SPEED (rpm)THICKNESS (µm)
Data points
LOR 7A — film thickness (µm) by spin speed (rpm)
Seriesrpmµm
LOR 7A10001.1
15000.71
20000.66
25000.56
30000.50
35000.46
40000.44

Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool. Series digitized from a published figure are approximate (±10 %).

read from figure — the red filled-square trace legended LOR 7A on the 'Thickness vs. Spin Speed - LOR A Thick Series' chart, p.5, second from the bottom of the four traces. Seven plotted markers at 500 rpm intervals; no numeric table accompanies the chart.

Redrawn from the manufacturer's published data — hover to read between points, click to pin.
  • The curve has a pronounced knee: 10,700 Å at 1000 rpm drops to about 7,100 Å by 1500 and then eases, reaching 4,400 Å at 4000 rpm.
  • Almost half the available thickness range is spent in the first 500 rpm, so slow spins on this grade need tight speed control while anything above 2000 rpm is forgiving.
  • It runs just above LOR 5A across the sweep and the two converge at the fast end.
  • One published quirk is worth knowing before fitting anything to this curve: the 1500 rpm point sits slightly below a smooth fit through its neighbours, because the 1500-2000 rpm step is shallower than the 2000-2500 one.
  • That is how the manufacturer plots it, so the trace is not perfectly monotonic in slope around the knee.
  • Coating parameters are published for the product line rather than per grade: 5 ml dispensed dynamically over 3-5 s onto a 150 mm wafer at 300-500 rpm, 10,000 rpm/s acceleration to a 3,000 rpm terminal speed, 45 s spin, with EBR PG for edge-bead and whisker removal.
Adhesion
HMDS not required — "Primers, such as HMDS, are typically not required" when LOR/PMGI is used as recommended; the datasheet describes excellent adhesion across semiconductor substrates. To dehydrate the surface first, bake at 200 °C for 5 min. LOR/PMGI is virtually insoluble in typical photoresist solvents, so a properly baked underlayer does not intermix with the imaging resist above it.
02 / Bake

Soft bake

Soft bake
Not published — characterize on-tool
Notes
The prebake dries the film and fixes its dissolution and undercut rate, and no grade-specific temperature or time is published. The recommended prebake range for the product line is 160-210 °C, hotplate preferred, and some PMGI products bake as high as 280 °C. Prebake temperature has the greatest influence on undercut rate, with prebake time, developer choice, develop mode and especially develop time behind it. The published undercut-versus-bake curves (Figures 5a and 5b) are measured on LOR 10B — a B-series grade of comparable thickness but faster dissolution — so they give the shape of the relationship rather than numbers to copy onto an A grade.
SOURCE: "Soft-Bake/Prebake Process" section and Figures 5a-5b, Kayaku…

"Soft-Bake/Prebake Process" section and Figures 5a-5b, Kayaku "LOR and PMGI Resists" technical data sheet, Rev. D (August 2023)

03 / Exposure

Exposure

LOR 7A is not photoimageable. It is not exposed at all — it is coated beneath an imaged top resist and undercut laterally during development. See the development step below.

04 / Development

Development

Developer
No specific commercial developer product is named for this grade; the datasheet states LOR/PMGI is compatible with both metal-ion-free (TMAH) and metal-ion-bearing developer chemistries.
Developer family
TMAH or buffered alkaline

Not published for this resist: Dilution, Time, Method, Rinse — characterize on-tool.

SOURCE: Product description, the LOR/PMGI process-flow section and the…

Product description, the LOR/PMGI process-flow section and the product selection guide, Kayaku "LOR and PMGI Resists" technical data sheet, Rev. D (August 2023)

05 / Post-processing

Hard bake, etch & strip

Stripper
Remover PG. EBR PG removes edge beads and whiskers and is also an effective spin-bowl cleaner and a rework solvent for unbaked wafers.
Storage
Store upright in original sealed containers in a dry area between 4 and 27 °C (40-80 °F), away from ignition sources, light, heat, oxidants, acids and reducers. Do not use after the expiration date.

Not published for this resist: Hard bake, Descum, Etch resistance — characterize on-tool.

06 / Applications

Where it's used

Practical notes from the datasheet

LOR 7A is a PMGI-based sacrificial underlayer from the slow-dissolving A series, spun beneath a conventional photoresist and never exposed. It occupies the gap between LOR 5A and LOR 10A, and in practice that is exactly how it gets chosen: a target around 0.6-0.8 µm sits in the middle of this grade's usable band where its neighbours would each be working at the end of theirs. The underlayer is picked against the deposited film rather than the feature — it must be thicker than the metal so the deposit breaks cleanly at the edge — and the A series is the slower of the three dissolution families, so the undercut opens gradually and the process window is wider than a B or C grade would give. Nothing here is exposed, so prebake temperature and develop time are the only real controls.

07 / Family

Grades in this family

Other grades in the LOR A series line differ mainly in coating thickness:

LOR A series — grade comparison
GradeThickness
LOR 1A0.1–0.2 µm
LOR 2A0.1–0.3 µm
LOR 3A0.2–0.4 µm
LOR 5A0.3–0.8 µm
LOR 7A (this page)0.4–1.1 µm
LOR 10A0.6–1.4 µm
LOR 15A1.0–2.6 µm
08 / Sources

Sources & disclaimer

Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-09-12.

Cite this recipe

NANYTE. "LOR 7A process recipe." NANYTE Photoresist Library. https://nanyte.com/photoresists/lor-7a. Accessed 2026-09-12.

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