https://nanyte.com/photoresists/lor-10b · last updated 2026-09-12
- Manufacturer
- MicroChem (MCC) — now Kayaku Advanced Materials
- Tone
- Not photoimageable (underlayer)
- Chemistry
- Ancillary (not photoimageable)
- Thickness
- 0.7–1.6 µm
- Exposure dose
- Not exposed — dissolves in developer
- Developer
- No specific commercial developer product is named for this grade; the datasheet states LOR/PMGI is compatible with both metal-ion-free (TMAH) and metal-ion-bearing developer chemistries.
- Applications
- Lift-off
Cross-checked — two independent extractions agree on the spin curve and the single-value figures.
- Substrate
- Underlayer
- Resist
- Exposed
Spin coating
Data points
| Series | rpm | µm |
|---|---|---|
| LOR 10B | 1000 | 1.6 |
| 1500 | 1.2 | |
| 2000 | 1.0 | |
| 2500 | 0.83 | |
| 3000 | 0.72 | |
| 3500 | 0.67 | |
| 4000 | 0.65 |
Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool. Series digitized from a published figure are approximate (±10 %).
read from figure — the light-blue filled-diamond trace legended LOR 10B on the 'Thickness vs. Spin Speed - LOR B Thick Series' chart, p.5. Seven plotted markers at 500 rpm intervals; no numeric table accompanies the chart.
- The curve runs 15,700 Å at 1000 rpm down to 6,500 Å at 4000 rpm and is nearly flat above 3000 rpm, so speed stops being a useful control below about 0.7 µm — the grade below is the better answer there.
- A convenient landmark: 1.00 µm falls at 2000 rpm, near the middle of the usable range.
- Coating parameters are published for the product line rather than per grade: 5 ml dispensed dynamically over 3-5 s onto a 150 mm wafer at 300-500 rpm, 10,000 rpm/s acceleration to a 3,000 rpm terminal speed, 45 s spin, with EBR PG for edge-bead and whisker removal.
- Adhesion
- HMDS not required — "Primers, such as HMDS, are typically not required" when LOR/PMGI is used as recommended; the datasheet describes excellent adhesion across semiconductor substrates.
Soft bake
- Soft bake
- Not published — characterize on-tool
- Notes
- This is the grade the datasheet actually characterises: Figure 5a plots undercut rate against soft-bake temperature and Figure 5b plots it against soft-bake time, both measured on LOR 10B. The recommended prebake range for the product line is 160-210 °C, hotplate preferred, and some PMGI products bake as high as 280 °C. The text singles out prebake temperature as the greatest influence on undercut rate, ahead of prebake time, developer choice, develop mode and — particularly — develop time.
SOURCE: "Soft-Bake/Prebake Process" section and Figures 5a-5b, Kayaku…
"Soft-Bake/Prebake Process" section and Figures 5a-5b, Kayaku "LOR and PMGI Resists" technical data sheet, Rev. D (August 2023)
Exposure
LOR 10B is not photoimageable. It is not exposed at all — it is coated beneath an imaged top resist and undercut laterally during development. See the development step below.
Development
- Developer
- No specific commercial developer product is named for this grade; the datasheet states LOR/PMGI is compatible with both metal-ion-free (TMAH) and metal-ion-bearing developer chemistries.
- Developer family
- TMAH or buffered alkaline
Not published for this resist: Dilution, Time, Method, Rinse — characterize on-tool.
SOURCE: Product description, the LOR/PMGI process-flow section and the…
Product description, the LOR/PMGI process-flow section and the product selection guide, Kayaku "LOR and PMGI Resists" technical data sheet, Rev. D (August 2023)
Hard bake, etch & strip
- Stripper
- Remover PG. EBR PG removes edge beads and whiskers and is also an effective spin-bowl cleaner and a rework solvent for unbaked wafers.
- Storage
- Store upright in original sealed containers in a dry area between 4 and 27 °C (40-80 °F), away from ignition sources, light, heat, oxidants, acids and reducers. Do not use after the expiration date.
Not published for this resist: Hard bake, Descum, Etch resistance — characterize on-tool.
Where it's used
Practical notes from the datasheet
LOR 10B is a PMGI-based sacrificial underlayer from the fast-dissolving B series, and it is the grade worth knowing about even if you end up buying a different one: every published undercut measurement on this datasheet was made on LOR 10B. Figures 5a and 5b show undercut rate against prebake temperature and against prebake time, and the text singles out temperature as the strongest influence. No other grade gets that treatment, so anyone tuning an A or C grade is reading a B-grade curve and scaling by judgement. On thickness it sits in the middle of the B line at 0.65-1.57 µm. The B series dissolves faster than A for the same prebake, which is right when the deposited metal is thick and needs a generous ledge to break at, and wrong when the feature is fine — the undercut keeps running for as long as the imaging resist above is developing, and develop time is the variable the datasheet flags as especially influential.
Grades in this family
Other grades in the LOR B series line differ mainly in coating thickness:
Sources & disclaimer
- MicroChem (MCC) — now Kayaku Advanced Materials — LOR 10B datasheet (Rev. D, August 2023 (printed in the footer of every page)) · accessed 2026-09-10
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-09-12.