https://nanyte.com/photoresists/s1811 · last updated 2026-10-15
- Manufacturer
- Rohm and Haas Electronic Materials
- Tone
- positive
- Chemistry
- DNQ-novolak
- Thickness
- 0.8–1.5 µm
- Developer
- MICROPOSIT MF-319 metal-ion-free (MIF) developer family (stated as optimized for); also compatible with metal-ion-bearing (MIB) MICROPOSIT developers.
Cross-checked — the spin curve (where published) and the single-value figures were read twice, independently, from the datasheet, with any disagreement settled against it.
- Substrate
- Resist
- Exposed
Spin coating
Data points
| Series | rpm | µm |
|---|---|---|
| S1811 G2 | 2000 | 1.5 |
| 3000 | 1.3 | |
| 4000 | 1.1 | |
| 5000 | 0.96 | |
| 6000 | 0.87 | |
| 7000 | 0.79 |
Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool. Series digitized from a published figure are approximate (±10 %).
read from figure, 'MICROPOSIT S1800 G2 Photoresist Undyed Series Spin Speed Curves' (Figure 2), p.2 of MICROPOSIT S1800 G2 Series Photoresists datasheet (Rohm and Haas Electronic Materials, ME06N041 Rev. 0, October 2006); identified as the third of four plotted traces from the top (square marker, legend order S1818/S1813/S1811/S1805 top-to-bottom by thickness — it sits between the S1813 and S1805 traces and the four curves do not cross across the plotted range); read at every 1,000 rpm from 2,000–7,000 rpm from the PDF's vector path, calibrated against the axis tick lines (linear-linear, thickness 0–40,000 Å, spin speed 1,000–8,000 rpm); the square markers and the drawn trace agree to within about 0.01 µm at every point; no numeric table accompanies the figure, so there is no printed point value to anchor against.
- Figure 2 ('MICROPOSIT S1800 G2 Photoresist Undyed Series Spin Speed Curves', p.2) plots four traces — S1818 G2, S1813 G2, S1811 G2, S1805 G2 — on one axis (spin speed 1,000–8,000 rpm vs photoresist thickness 0–40,000 Å), each carrying a distinct legend marker (diamond, triangle, square, cross respectively, in that order top-to-bottom by thickness).
- Because the four curves do not cross across the plotted range, S1811 G2 (square marker) is the third trace down at every spin speed, between S1813 G2 above and S1805 G2 below.
- The trace plotted here was read at 1,000 rpm intervals from 2,000–7,000 rpm; no numeric thickness-vs-rpm table accompanies the figure, so there is no independent point-value anchor and the values carry the usual figure-read uncertainty of about 10–15%.
- Table 2 (p.2) records that Figure 2's coatings used an SVG 81 coater and a 115°C/60 sec hotplate softbake on silicon, measured on a Nanometrics 210 — that condition applies to this grade's trace and is recorded under softbake below.
- The document states maximum coating uniformity is 'typically attained between the spin speeds of 3,500–5,500 rpm' (p.2, series-wide statement, not S1811-specific); on this trace that window is roughly 0.9–1.15 µm.
- No rehydration hold or edge-bead handling is discussed anywhere in the document.
- Adhesion
- HMDS recommended — "MICROPOSIT S1800 G2 Series Photoresist work well with the hexamethyldisilazane-based MICROPOSIT Primers. Concentrated MICROPOSIT Primer is recommended when vacuum vapor priming. Diluted primer is recommended for liquid phase priming applications." (SUBSTRATE PREPARATION, p.2 — series-wide statement, not grade-specific).
Soft bake
- Soft bake
- 115 °C · 60 s · hotplate
- Notes
- From Table 2 ('Process Conditions, Refer to Figure 2'): coat tool SVG 81, softbake 115°C/60 sec hotplate, measured on a Nanometrics 210. This is the condition used to generate the Figure 2 spin-speed-curve trace that includes S1811 G2; it is not a separately stated softbake recommendation outside that figure.
SOURCE: Table 2, p.2 of MICROPOSIT S1800 G2 SERIES PHOTORESISTS, ME06N041, Rev. 0, October 2006
Exposure dose
Exposure is optimized at 436 nm across the S1800 G2 series and usable from 350 to 450 nm, but that window is all S1811 gets: the sheet's dose numbers were measured on S1813 and belong to it. Run a dose array on your own tool to land the working dose.
Not published for this resist: Dose at 365 nm, Dose at 405 nm — characterize on-tool.
Development
- Developer
- MICROPOSIT MF-319 metal-ion-free (MIF) developer family (stated as optimized for); also compatible with metal-ion-bearing (MIB) MICROPOSIT developers.
- Developer family
- TMAH or buffered alkaline
Not published for this resist: Dilution, Time, Method, Rinse — characterize on-tool.
SOURCE: Develop Properties, feature list, p.1: "Optimized for use with…
Develop Properties, feature list, p.1: "Optimized for use with the MICROPOSIT MF-319 metal-ion-free developer family" / "Compatible with metal-ion-bearing MICROPOSIT developers"
Hard bake, etch & strip
- Stripper
- "Residue-free photoresist removal using standard MICROPOSIT removers" (ADVANTAGES section, p.1) — no specific remover product is named.
- Storage
- "Store products in tightly closed original containers at temperatures recommended on the product label." (STORAGE section, p.5) — no specific temperature is printed in the document itself.
Not published for this resist: Hard bake, Descum, Etch resistance — characterize on-tool.
Where it's used
Practical notes from the datasheet
This grade appears exactly once in the document: as the third of four traces (alongside S1805, S1813 and S1818 G2) on the undyed-series film-thickness-vs-spin-speed chart (Figure 2, p.2). It sits between S1813 G2 above and S1805 G2 below, so pick S1811 G2 over S1813 when a thinner film is wanted at the same speed, and over S1805 when about twice the film is needed. No dose, develop time, or lithographic-performance data (contrast curve, Dill parameters, absorbance spectrum, masking linearity, exposure/focus latitude — Figures 4–9, Tables 4–9) is published for S1811 specifically; every one of those figures and tables explicitly names MICROPOSIT S1813 G2 as the tested grade, and that data does not carry over to S1811. The document states the S1800 G2 system broadly is optimized for g-line (436 nm) exposure and usable across 350–450 nm, is compatible with HMDS-based MICROPOSIT primers, and works with both metal-ion-free (MF-319 family) and metal-ion-bearing MICROPOSIT developers, but none of those statements carry an S1811-specific number. The S1800 line traces from Shipley through Rohm and Haas Electronic Materials (publisher of this G2 edition) to Dow, DuPont, and today's Kayaku Advanced Materials.
Grades in this family
Other grades in the MICROPOSIT S1800 G2 Series line differ mainly in coating thickness:
| Grade | Thickness | Exposure dose |
|---|---|---|
| Microposit S1805 | 0.4–0.7 µm | — |
| Microposit S1811 (this page) | 0.8–1.5 µm | — |
| S1813 | 1.0–1.9 µm | 150 mJ/cm² @ 436 nm |
| Microposit S1818 | 1.4–2.7 µm | — |
| S1822 | 1.5–3.2 µm | — |
Troubleshooting
Common failure modes for Microposit S1811, answered from the manufacturer's datasheet and application notes. These are starting points — your substrate, tooling and environment shift the specifics, so calibrate on-tool.
How thick a film does MICROPOSIT S1811 G2 coat?
S1811 G2 is the second-thinnest of the four undyed S1800 G2 grades — the third trace down on the Figure 2 spin-speed chart. It runs from about 1.5 µm at 2,000 rpm down to 0.79 µm at 7,000 rpm, roughly 0.9–1.15 µm across the 3,500–5,500 rpm window where the sheet says coating uniformity is typically best (a series-wide statement). These points are a figure read with roughly ±10–15% uncertainty, so confirm the target thickness on-tool.
SOURCE: MICROPOSIT S1800 G2 Series Photoresists datasheet (Rohm and…
MICROPOSIT S1800 G2 Series Photoresists datasheet (Rohm and Haas Electronic Materials, ME06N041 Rev. 0, October 2006) — Figure 2 undyed-series spin-speed curves and COAT, p.2
What exposure dose should I use for S1811 G2?
This datasheet publishes no exposure dose for S1811. The only quantified dose — 150 mJ/cm² sizing energy — is explicitly attributed to S1813 G2 and must not be borrowed for S1811. The series is exposable across 350–450 nm with properties optimized for 436 nm (g-line); pick a working dose by characterizing on-tool.
SOURCE: MICROPOSIT S1800 G2 Series Photoresists datasheet (Rohm and…
MICROPOSIT S1800 G2 Series Photoresists datasheet (Rohm and Haas Electronic Materials, ME06N041 Rev. 0, October 2006) — EXPOSURE section p.3; Table 9 (S1813-specific), p.4
What soft bake does S1811 G2 need?
The only soft-bake condition tied to S1811 is 115°C for 60 s on a hotplate — the coat condition used to generate its Figure 2 spin-speed trace (SVG 81 coater, measured on a Nanometrics 210). It is a documented test condition, not a separately stated grade-specific recommendation, so treat it as a starting point rather than an optimized bake.
SOURCE: MICROPOSIT S1800 G2 Series Photoresists datasheet (Rohm and…
MICROPOSIT S1800 G2 Series Photoresists datasheet (Rohm and Haas Electronic Materials, ME06N041 Rev. 0, October 2006) — Table 2, p.2
Does S1811 G2 need HMDS priming?
This is a family-generic answer — the datasheet gives no S1811-specific priming step. The S1800 G2 series works well with hexamethyldisilazane-based MICROPOSIT Primers: concentrated primer for vacuum vapour priming, diluted primer for liquid-phase priming.
SOURCE: MICROPOSIT S1800 G2 Series Photoresists datasheet (Rohm and…
MICROPOSIT S1800 G2 Series Photoresists datasheet (Rohm and Haas Electronic Materials, ME06N041 Rev. 0, October 2006) — SUBSTRATE PREPARATION, p.2
Sources & disclaimer
- Rohm and Haas Electronic Materials — Microposit S1811 datasheet (ME06N041, Rev. 0, October 2006) · accessed 2026-10-15
- https://kayakuam.com/products/microposit-s1800-g2-series-photoresists/ — Kayaku's MICROPOSIT S1800 G2 series page states the series-wide formulation (mixed cresol novolak resin + diazo photoactive compound); used as the basis for classifying S1811 as dnq-novolak, as for its S1805/S1813/S1818 siblings.
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-10-15.