https://nanyte.com/photoresists/ar-p-5350 · last updated 2026-07-26
- Manufacturer
- Allresist
- Tone
- positive
- Chemistry
- DNQ-novolak
- Thickness
- 1 µm
- Exposure dose
- 55 mJ/cm²
- Developer
- AR 300-35 (primary, fully worked example); AR 300-26 or AR 300-47 listed as alternatives
- Applications
- Lift-off · Etch mask
Cross-checked — two independent extractions agree on the spin curve and the single-value figures.
- Substrate
- Resist
- Exposed
Spin coating
Data points
| Series | rpm | µm |
|---|---|---|
| AR-P 5350 | 1000 | 2.0 |
| 1500 | 1.6 | |
| 2000 | 1.4 | |
| 3000 | 1.1 | |
| 4000 | 1.0 | |
| 6000 | 0.78 | |
| 7000 | 0.73 |
Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool. Series digitized from a published figure are approximate (±10 %).
read from figure, 'Spin curve' (D₀/µm 0.0–12.0 vs rpm 0–8000), p.1 of AR-P5300_english_Allresist_product_information.pdf (Allresist, as of January 2018 per p.1 footer); two individually-legended traces plotted together — the lower diamond-marker trace explicitly labeled 'AR-P 5350' beside its rightmost point (the upper square-marker trace is the separately labeled 'AR-P 5320', not extracted here); 7 diamond markers at rpm 1000/1500/2000/3000/4000/6000/7000 (no marker is plotted at 5000 rpm — the line passes through that gap unmarked — and both traces terminate at 7000 rpm, not extending to the axis's 8000 rpm end). The figure's 4000 rpm marker reads ≈1.01 µm, matching the Properties I table's printed 'Film thickness/4000 rpm (µm): 1.0' for AR-P 5350 (p.1) and the Coating row of the process-conditions table (p.2: '4000 rpm, 60 s, 1.0 µm').
- Spin-speed-vs-thickness figure ('Spin curve', p.1, axes D₀/µm 0.0-12.0 vs rpm 0-8000) carries two separately labeled traces, AR-P 5320 (upper) and AR-P 5350 (lower) — only the AR-P 5350 trace is plotted here, from its 7 diamond markers between 1000-7000 rpm (no marker at 5000 rpm; the trace does not extend to 8000 rpm).
- The figure's own 4000 rpm marker reads ≈1.01 µm, matching the Properties I table's 1.0 µm anchor closely.
- Adhesion
- HMDS not required — Manufacturer states 'good adhesion properties' as a series-wide characteristic.
Soft bake
- Soft bake
- 105 °C · 4 min · hotplate
- Notes
- 105 °C, 4 min hot plate — confirmed identically in two places: the 'Process parameters' box (p.1, explicitly labeled 'AR-P 5350' worked example) and the 'Tempering' row of the process-conditions table (p.2, which also gives a convection-oven alternative: 100 °C, 40 min = 2400 s).
SOURCE: "Process parameters" box, p.1 (AR-P 5350) + "Tempering" row…
"Process parameters" box, p.1 (AR-P 5350) + "Tempering" row, "Process conditions" table, p.2, of AR-P5300_english_Allresist_product_information.pdf
Exposure dose
The manufacturer publishes 55 mJ/cm². Dose scales with film thickness and depends on your optics, so treat it as a starting point and run a dose array.
- As published
- The 55 mJ/cm² clearing dose is Allresist's figure for this grade, measured on a broadband stepper spanning 365, 405 and 436 nm alongside its 1.0 µm reference coat; no single-wavelength dose is published.
Not published for this resist: Dose at 365 nm, Dose at 405 nm — characterize on-tool.
SOURCE: "UV exposure" and "Exposure dose" rows, "Process conditions"…
"UV exposure" and "Exposure dose" rows, "Process conditions" table, p.2, AR-P 5350 column, of AR-P5300_english_Allresist_product_information.pdf
Development
- Developer
- AR 300-35 (primary, fully worked example); AR 300-26 or AR 300-47 listed as alternatives
- Dilution
- AR 300-35 at 1:2 (worked example); alternatively AR 300-26 at 1:7, or AR 300-47 at 2:3 — per the 'Development recommendations' table, AR-P 5350 row
- Time
- 60 s
- Method
- puddle
- Rinse
- DI-H2O, 30 s
- Developer family
- TMAH or buffered alkaline
SOURCE: "Process parameters" box, p.1 (AR-P 5350) +…
"Process parameters" box, p.1 (AR-P 5350) + "Development"/"Rinse" rows of the "Process conditions" table, p.2 + "Development recommendations" table, p.2 (AR-P 5350 row), of AR-P5300_english_Allresist_product_information.pdf
Hard bake, etch & strip
- Etch resistance
- Manufacturer states the series is 'plasma etching resistant, temperature stable up to 120 °C' (Characterisation, series-wide, p.1).
- Stripper
- AR 300-76 or O2 plasma ashing ("Removal" row, "Process conditions" table, p.2, shared/unsplit across both grades).
- Storage
- 10–18 °C, approximately 6-month shelf life ("Storage 6 month (°C)" row, "Properties I" table, p.1 — a single value shared across the AR-P 5320 and AR-P 5350 columns).
Not published for this resist: Hard bake, Descum — characterize on-tool.
Where it's used
Practical notes from the datasheet
AR-P 5350 is the thinner (1.0 µm at 4000 rpm), higher-contrast, higher-resolution (0.5 µm) grade of Allresist's AR-P 5300 series, a DNQ/novolac positive resist purpose-built for lift-off. Unlike most positive resists, an elevated softbake (105 °C, 4 min — well above a typical ~90–100 °C positive-resist prebake) deliberately produces the negative-sloped undercut profile needed for clean metal lift-off; the manufacturer states this explicitly ('higher tempering temperatures are required to produce the undercut'). Post-bake is explicitly 'Not required' for this series (process-conditions table, p.2). Development is aqueous-alkaline (AR 300-35, 1:2, 60 s in the fully worked example, confirmed twice in the document); AR 300-26 (1:7) and 'AR 300-47' (2:3) are named as alternatives with no stated time. The two-page source disagrees with itself on revision date: page 1's footer reads 'As of January 2018', page 2's reads 'As of January 2017' — both as printed, unreconciled.
Sources & disclaimer
- Allresist — AR-P 5350 datasheet (Inconsistent across pages: 'As of January 2018' (p.1 footer) vs. 'As of January 2017' (p.2 footer) — recorded verbatim, not reconciled.) · accessed 2026-07-10
- https://www.allresist.com/portfolio-item/developer-ar-300-47/ — Allresist's own product page for developer AR 300-47: gives its main component as TMAH and its metal-ion content as under 0.1 ppm. Read together with the AR 300-26 page (sodium borate / sodium hydroxide) and the AR 300-35 page (sodium metasilicate / phosphate), it establishes that the developers this resist's own "Development recommendations" table offers span both a metal-ion-free and a metal-ion-containing chemistry.
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-07-26.