https://nanyte.com/photoresists/s1822 · last updated 2026-07-12
- Manufacturer
- Shipley Company
- Tone
- positive
- Chemistry
- DNQ-novolak
- Developer
- MICROPOSIT MF-319 Metal-Ion-Free (MIF) DEVELOPER family
Unverified — not yet human-checked; values transcribed from the datasheet, characterize on-tool.
Spin coating
S1822 is spin-coated to —. The curve below is redrawn from the manufacturer's published data — read your target thickness off the vertical axis and take the matching spin speed as a starting point.
Data points
| Series | rpm | µm |
|---|---|---|
| S1822 | 2000 | 3.2 |
| 3000 | 2.5 | |
| 4000 | 2.1 | |
| 5000 | 1.9 | |
| 6000 | 1.6 | |
| 7000 | 1.5 |
Values are the manufacturer's starting points, not a guarantee; verify on your own tool. Characterize on-tool. Series digitized from a published figure were independently cross-checked by a second blind read; treat those values as approximate (±10 %).
read from figure, 'MICROPOSIT S1800 PHOTO RESIST UNDYED SERIES, Spin Speed Curves' (Figure 1), p.2 of MICROPOSIT S1800 Series Photo Resists datasheet (Shipley Company, document code MPR S1800 1093, 1993 edition); identified as the topmost, thickest of five plotted traces (open-square marker, shared shape with S1811 — disambiguated by curve position, since S1822 is listed first in the legend and, consistent with it being the highest-viscosity/thickest-film grade in the family, plots as the uppermost curve at every spin speed with no crossings against S1818/S1813/S1811/S1805); read at gridline/marker crossings every 1,000 rpm from 2,000–7,000 rpm off a linear-linear chart (thickness 0–40,000 Å, spin speed 1,000–8,000 rpm); no numeric table or rpm-paired anchor is published anywhere else in the document for S1822 — visual chart-reading only, typical uncertainty ~10–15%; digitized 2026-07-12
Figure 1 ('MICROPOSIT S1800 PHOTO RESIST UNDYED SERIES, Spin Speed Curves', p.2) plots five undyed grades — S1822, S1818, S1813, S1811, S1805 — photoresist thickness (Å) vs spin speed (1000–8000 rpm). S1822 is identified as the topmost, thickest trace of the five. The legend reuses the same open-square marker for both S1822 and S1811, so marker shape alone cannot distinguish them; disambiguation here is by curve position — S1822 is listed first in the legend and, consistent with it being the highest-viscosity/thickest-film grade in the family (the curve ordering top-to-bottom is S1822 > S1818 > S1813 > S1811 > S1805), it plots as the uppermost, thickest curve on the chart. The trace was digitized 2026-07-12 by reading gridline/marker crossings at 1,000 rpm intervals from 2,000–7,000 rpm (see spinCurves), spanning roughly 3.20 µm (2,000 rpm) down to 1.50 µm (7,000 rpm); no numeric table or rpm-paired anchor is published anywhere else in the document for S1822, so the digitized values carry typical chart-reading uncertainty (~10–15% — see spinCurves[0].source). No single-point anchor (e.g. 'X µm at Y rpm') is stated anywhere else in the document for S1822. Softbake for the wafers used to generate Figures 1 and 2 was 115°C/60 s hotplate (Process Parameters box, p.2, keyed 'Refer to Figures 1 and 2') — this is the test condition tied to the figure that includes S1822, not a grade-specific recommendation, and is recorded separately below under softbake.
- Adhesion
Soft bake
- Soft bake
- 115 °C · 60 s · hotplate
- Notes
SOURCE: Process Parameters box ("Refer to Figures 1 and 2"), p.2
Exposure dose
The manufacturer does not publish a clearing dose for S1822. Determine it with a dose array on your own tool.
- As published
Not published for this resist: Dose at 365 nm, Dose at 405 nm — characterize on-tool.
Development
- Developer
- MICROPOSIT MF-319 Metal-Ion-Free (MIF) DEVELOPER family
- Developer family
- TMAH-based
Not published for this resist: Dilution, Time, Method, Rinse — characterize on-tool.
SOURCE: Develop Properties, feature list, p.1 ("Optimized for use with the MICROPOSIT MF-319 Metal-Ion-Free DEVELOPER family" / "Compatible with Metal-Ion-Bearing MICROPOSIT DEVELOPERS"); DEVELOP section, p.4
Hard bake, etch & strip
- Stripper
- Storage
Not published for this resist: Hard bake, Descum, Etch resistance — characterize on-tool.
Where it's used
S1822 was originally sold by Shipley Company — later Rohm and Haas Electronic Materials, then Dow Electronic Materials, then a Dow/DuPont-linked joint venture, and eventually Kayaku Advanced Materials, as the industry consolidated — as the thickest-film member of the undyed MICROPOSIT S1800 series. In grade-selection terms it was the pick when even S1818 could not lay down enough film in one coat; anyone specifying that film thickness today should confirm current availability and look to the surviving S1800 G2 grades, since the 2006 G2 edition omits S1822 entirely. This 1993 edition (document code "MPR S1800 1093") is, as far as this project has located, the only Shipley/Rohm-and-Haas S1800 datasheet that documents S1822 at all: the later 2006 "S1800 G2 Series" edition (ME06N041 Rev. 0) lists only S1805/S1811/S1813/S1818 in its undyed-series legend and omits S1822 entirely — which is why this superseded edition is retained here, and why S1822's status is flagged discontinued pending a human check of current availability. Nearly every quantitative process parameter in this document — exposure dose, Dill optical parameters, contrast curve, masking-linearity, exposure-latitude and focus-latitude data — is explicitly tied to worked examples for MICROPOSIT S1813, not S1822; those numbers must not be borrowed into S1822's own process window. Only series-wide statements (G-line/broadband exposure range, HMDS-based priming, MF-319-family MIF developer compatibility, storage conditions) and S1822's position as the topmost, thickest trace in the undyed spin-speed chart (Figure 1) can be attributed to this grade from this source. Like other thick-film DNQ-family positive resists of this era, coatings at this viscosity are the ones most likely to need an edge-bead removal step and a rehydration/relaxation wait after spin-coating before bake — but neither is mentioned in this document for S1822, so both are left null rather than assumed. Chemistry classified as dnq-novolak from Kayaku's S1800 G2 series-wide statement and the Dow/Rohm and Haas S1818 MSDS composition table (mixed cresol novolak resin + diazo photoactive compound) (chemistry classified 2026-07-12 from manufacturer SDS/TDS).
Sources & disclaimer
- Shipley Company — S1822 datasheet (MPR S1800 1093 (printed at the foot of p.1, bottom-right corner)) · accessed 2026-07-10
- https://www.nanophys.kth.se/nanolab/resists/S1813/Microposit_S1800_G2_Serie.pdf — The newer 2006 Rohm and Haas 'S1800 G2 Series' datasheet (ME06N041 Rev. 0), checked and found to NOT list S1822 in its undyed-series legend (only S1805/S1811/S1813/S1818 appear); cited for comparison to justify retaining this superseded 1993 edition as S1822's only located source, not as a data source for S1822 itself.
- https://kayakuam.com/products/microposit-s1800-g2-series-photoresists/ — Kayaku's MICROPOSIT S1800 G2 series page states the series-wide formulation (mixed cresol novolak resin + diazo photoactive compound); used as the basis for classifying S1822 as dnq-novolak, corroborated by the Dow/Rohm and Haas S1818 MSDS composition table.
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-07-12.