S1822 process recipe

MICROPOSIT S1822 was the thickest grade of Shipley's original (1993) MICROPOSIT S1800 positive photoresist series, coating roughly 1.5–3.2 µm — heavier than even S1818. The later 2006 G2 edition drops it, so its current availability needs a human check.

Discontinued

https://nanyte.com/photoresists/s1822 · last updated 2026-07-26

At a glance

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Manufacturer: Shipley Company
Tone: positive
Chemistry: DNQ-novolak
Developer: MICROPOSIT MF-319 Metal-Ion-Free (MIF) DEVELOPER family

Coat
Soft bake
115 °C60 shotplate
Expose
Develop
TMAH or buffered alkaline

Substrate
Resist
Exposed

The exposed resist dissolves in the developer; the unexposed film stays. Schematic cross-sections for S1822 — feature width, film aspect ratio and sidewall angle are illustrative, not to scale.

—01 / Coating

Spin coating

Data points

S1822 — film thickness (µm) by spin speed (rpm)
Series	rpm	µm
S1822	2000	3.2
	3000	2.5
	4000	2.1
	5000	1.9
	6000	1.6
	7000	1.5

Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool. Series digitized from a published figure are approximate (±10 %).

read from figure, 'MICROPOSIT S1800 PHOTO RESIST UNDYED SERIES, Spin Speed Curves' (Figure 1), p.2 of MICROPOSIT S1800 Series Photo Resists datasheet (Shipley Company, document code MPR S1800 1093, 1993 edition); identified as the topmost, thickest of five plotted traces (open-square marker, shared shape with S1811 — disambiguated by curve position, since S1822 is listed first in the legend and, consistent with it being the highest-viscosity/thickest-film grade in the family, plots as the uppermost curve at every spin speed with no crossings against S1818/S1813/S1811/S1805); read at gridline/marker crossings every 1,000 rpm from 2,000–7,000 rpm off a linear-linear chart (thickness 0–40,000 Å, spin speed 1,000–8,000 rpm); no numeric table or rpm-paired anchor is published anywhere else in the document for S1822 — visual chart-reading only, typical uncertainty ~10–15%.

Redrawn from the manufacturer's published data — hover to read between points, click to pin.

Figure 1 ('MICROPOSIT S1800 PHOTO RESIST UNDYED SERIES, Spin Speed Curves', p.2) plots five undyed grades — S1822, S1818, S1813, S1811, S1805 — photoresist thickness (Å) vs spin speed (1000–8000 rpm).
S1822 is identified as the topmost, thickest trace of the five.
The legend reuses the same open-square marker for both S1822 and S1811, so marker shape alone cannot distinguish them; disambiguation here is by curve position — S1822 is listed first in the legend and, consistent with it being the highest-viscosity/thickest-film grade in the family (the curve ordering top-to-bottom is S1822 > S1818 > S1813 > S1811 > S1805), it plots as the uppermost, thickest curve on the chart.
The trace plotted here was read from gridline/marker crossings at 1,000 rpm intervals from 2,000–7,000 rpm, spanning roughly 3.20 µm (2,000 rpm) down to 1.50 µm (7,000 rpm); no numeric table or rpm-paired anchor is published anywhere else in the document for S1822, so the values carry typical chart-reading uncertainty of about 10–15%.
No single-point anchor (e.g. 'X µm at Y rpm') is stated anywhere else in the document for S1822.
Softbake for the wafers used to generate Figures 1 and 2 was 115°C/60 s hotplate (Process Parameters box, p.2, keyed 'Refer to Figures 1 and 2') — this is the test condition tied to the figure that includes S1822, not a grade-specific recommendation, and is recorded separately below under softbake.

Adhesion: HMDS recommended — "MICROPOSIT S1800 SERIES PHOTO RESISTS work well with the hexamethyldisilazane based MICROPOSIT PRIMERS.

—02 / Bake

Soft bake

Soft bake: 115 °C · 60 s · hotplate
Notes: This is the coat/softbake condition printed in the 'Process Parameters (Refer to Figures 1 and 2)' box on p.2, i.e. the condition used to generate the undyed-series spin-speed chart that includes S1822 (Substrate: Silicon, Coat: SVG 81, Measure: Nanometrics 210).

SOURCE: Process Parameters box ("Refer to Figures 1 and 2"), p.2

—03 / Exposure

Exposure dose

S1822 is absent from this edition's optical-constant table, which covers S1813, S1813 D1, S1811 J2 and S1818 J1, and the one sizing energy in it is S1813's. What is left is 350 to 450 nm, optimized at 436 nm. Run a dose array on your own tool to land the working dose.

Not published for this resist: Dose at 365 nm, Dose at 405 nm — characterize on-tool.

—04 / Development

Development

Developer: MICROPOSIT MF-319 Metal-Ion-Free (MIF) DEVELOPER family
Developer family: TMAH or buffered alkaline

SOURCE: Develop Properties, feature list, p.1 ("Optimized for use with…

Develop Properties, feature list, p.1 ("Optimized for use with the MICROPOSIT MF-319 Metal-Ion-Free DEVELOPER family" / "Compatible with Metal-Ion-Bearing MICROPOSIT DEVELOPERS"); DEVELOP section, p.4

—05 / Post-processing

Hard bake, etch & strip

Stripper: Standard MICROPOSIT REMOVERS — "Residue-free photoresist removal using standard MICROPOSIT REMOVERS" (Removal Property, feature list, p.1; series-wide, no specific remover product named).
Storage: Store MICROPOSIT S1800 PHOTO RESISTS only in upright, original containers in a dry area at 50°-70°F (10°-21°C).

—06 / Applications

Where it's used

Practical notes from the datasheet

S1822 was the thickest-film grade in Shipley's undyed MICROPOSIT S1800 series — a line that passed to Rohm and Haas Electronic Materials, then Dow, and eventually Kayaku Advanced Materials as the industry consolidated. It was the grade to reach for when S1818 could not lay down enough film in a single coat. Confirm availability before designing it in: the 2006 S1800 G2 edition lists only S1805, S1811, S1813 and S1818, and S1822 does not appear in it. Take the published numbers narrowly. The exposure dose, Dill optical parameters, contrast curve, masking-linearity and exposure- and focus-latitude data printed alongside S1822 are worked for S1813, and must not be carried into an S1822 process window. What does apply is series-wide: the g-line/broadband exposure range, HMDS priming, MF-319-family MIF developer compatibility, storage conditions, and S1822's position as the topmost, thickest trace in the undyed spin-speed chart (Figure 1). Like other thick-film DNQ positives of its era, S1822 is the kind of coating most likely to need an edge-bead removal step and a relaxation wait after spin-coating before bake — neither is specified for it, so establish both on your own tool. The dnq-novolak classification comes from Kayaku's series-wide S1800 G2 statement and the Dow/Rohm and Haas S1818 MSDS composition table (cresol novolak resin with a diazo photoactive compound).

—07 / Family

Grades in this family

Other grades in the MICROPOSIT S1800 series line differ mainly in coating thickness:

MICROPOSIT S1800 series — grade comparison
Grade	Thickness	Exposure dose
S1813	1.0–1.9 µm	150 mJ/cm² @ 436 nm
Microposit S1805	—	—
Microposit S1818	—	—
S1822 (this page)	—	—

—08 / Troubleshooting

Troubleshooting

Common failure modes for S1822, answered from the manufacturer's datasheet and application notes. These are starting points — your substrate, tooling and environment shift the specifics, so calibrate on-tool.

Is MICROPOSIT S1822 still available?

Treat it as discontinued pending a human check. S1822 is documented only in the superseded 1993 Shipley edition of the S1800 datasheet; the current 2006 S1800 G2 edition omits it entirely, listing only S1805/S1811/S1813/S1818 in its undyed-series legend. Confirm current availability before specifying it, and look to the surviving G2 grades for a thick single coat.