S1813 process recipe

MICROPOSIT S1813 is the mid-film, best-documented grade of the MICROPOSIT S1800 G2 positive photoresist series, coating roughly 1.03–1.9 µm — the default general-purpose g-line resist, and the one grade this datasheet fully characterizes.

https://nanyte.com/photoresists/s1813 · last updated 2026-07-26

At a glance

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Manufacturer: Kayaku Advanced Materials (Microposit brand; datasheet originally published by Rohm and Haas Electronic Materials / later Dow Electronic Materials)
Tone: positive
Chemistry: DNQ-novolak
Thickness: 1.0–1.9 µm
Exposure dose: 150 mJ/cm² at 436 nm
Developer: MICROPOSIT MF-319 metal-ion-free (MIF) developer family (stated as optimized for); also compatible with metal-ion-bearing (MIB) MICROPOSIT developers.
Applications: General prototyping · Etch mask

Cross-checked — two independent extractions agree on the spin curve and the single-value figures.

Coat
1.0–1.9 µm
Soft bake
115 °C60 shotplate
Expose
150 mJ/cm²at 436 nm
Develop
TMAH or buffered alkaline

Substrate
Resist
Exposed

The exposed resist dissolves in the developer; the unexposed film stays. Schematic cross-sections for S1813 — feature width, film aspect ratio and sidewall angle are illustrative, not to scale.

—01 / Coating

Spin coating

Data points

S1813 — film thickness (µm) by spin speed (rpm)
Series	rpm	µm
S1813 G2	2000	1.9
	3000	1.6
	4000	1.3
	5000	1.2
	6000	1.1
	7000	1.0

Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool. Series digitized from a published figure are approximate (±10 %).

read from 'MICROPOSIT S1800 G2 Photoresist Undyed Series Spin Speed Curves' (Figure 2), p.2 of MICROPOSIT S1800 G2 Series Photoresists datasheet (Rohm and Haas Electronic Materials, ME06N041, Rev. 0, October 2006). The S1813 G2 trace is the triangle-marker series, 2nd of 4 stacked series (diamond/S1818 above, square/S1811 and x/S1805 below), matching the legend order. Its plotted markers run 2,000-7,000 rpm only (6 points), not the chart's wider 1,000-8,000 rpm axis range. No rpm-paired numeric anchor exists in the document — the two printed reference thicknesses (12,300 Å and 13,675 Å) are coat conditions used for other test figures (masking linearity, dispersion curve), not points on this spin curve.

Redrawn from the manufacturer's published data — hover to read between points, click to pin.

The datasheet publishes a spin-speed FIGURE (Figure 2, p.2, "MICROPOSIT S1800 G2 Photoresist Undyed Series Spin Speed Curves") plotting film thickness (0-40,000 Å) vs. spin speed (1,000-8,000 rpm axis range) for four grades (S1805, S1811, S1813, S1818 G2) on one chart, coated on an SVG 81 with a 115°C/60s softbake.
The S1813 G2 trace (triangle marker, second-highest of the four, which do not cross across the plotted range) spans 2,000-7,000 rpm — its own plotted extent, narrower than the chart's 1,000-8,000 rpm axis range.
The thickness range quoted for this grade is the span of that curve, 1.03-1.90 µm; the two reference coat thicknesses (12,300 Å / 13,675 Å) are single fixed-film conditions for other test figures (masking linearity, exposure latitude, dispersion curve), not a statement of what the resist can coat.
The datasheet does state maximum coating uniformity is typically attained between 3,500-5,500 rpm.
The two reference thicknesses still recur across the process-condition tables: 12,300 Å in Tables 1, 4, 5, 7, 8, and 13,675 Å in Table 3.

Adhesion: HMDS recommended — Works well with hexamethyldisilazane (HMDS)-based MICROPOSIT Primers.

—02 / Bake

Soft bake

Soft bake: 115 °C · 60 s · hotplate
Notes: Consistent across all process-condition tables in the datasheet (Tables 1-8).

SOURCE: e.g. Table 1, p.1: "Softbake 115°C/60 sec. Hotplate"

—03 / Exposure

Exposure dose

The manufacturer publishes 150 mJ/cm² at 436 nm. Dose scales with film thickness and depends on your optics, so treat it as a starting point and run a dose array.

Dose at 436 nm (g-line): 150 mJ/cm²
As published: The 150 mJ/cm² sizing energy is a g-line number — 1.3× the 82 mJ/cm² clearing dose, measured on GCA and Nikon g-line steppers.

SOURCE: Table 9 ("Lithographic Responses Summary"), p.4: "Sizing…

Table 9 ("Lithographic Responses Summary"), p.4: "Sizing Energy 150 mJ/cm2 (1.3 E0)"; E0 = 82 mJ/cm2 from Figure 6 contrast curve, p.4

—04 / Development

Development

Developer: MICROPOSIT MF-319 metal-ion-free (MIF) developer family (stated as optimized for); also compatible with metal-ion-bearing (MIB) MICROPOSIT developers.
Dilution: Test conditions in Tables 4, 7 and 8 use MF-319/MF-321 diluted 1:10 ("MF-31/10", "MF-321/10"); Table 1 does not name a specific developer or dilution.
Method: Double Spray Puddle (DSP) at 21°C in all cited process-condition tables
Developer family: TMAH or buffered alkaline

SOURCE: e.g. Table 1, p.1: "Develop 15 +50 sec. Double Spray Puddle…

e.g. Table 1, p.1: "Develop 15 +50 sec. Double Spray Puddle (DSP) @ 21°C"; Tables 4, 7, 8, p.3-4: "MF-31/10 +30 DSP @ 21°C" / "MF-321/10 +30 DSP @ 21°C"

—05 / Post-processing

Hard bake, etch & strip

Stripper: Datasheet states only that "residue-free photoresist removal" is achieved "using standard MICROPOSIT removers", without naming a specific product.
Storage: "Store products in tightly closed original containers at temperatures recommended on the product label" (no specific temperature is given in the datasheet text itself).

—06 / Applications

Where it's used

General prototyping Etch mask

Practical notes from the datasheet

S1813 is a standard positive DNQ/novolak-class g-line resist (chemistry classification based on well-established industry knowledge of this product family; this specific TDS does not itself restate the chemical composition). Reach for S1813 when you want the series' balanced, best-documented option rather than pushing to the thin (S1805) or thick (S1818) ends of the family — it is the one grade whose exposure, contrast and develop behaviour the manufacturer actually measured in this datasheet. Its ~85 deg wall angle (Table 9) and single-tone positive process (no reversal/undercut step described) make it unsuited to lift-off without an added process (e.g. bilayer or image-reversal), and this datasheet makes no lift-off or electroplating claims. The published spin-speed figure (Figure 2) carries no accompanying numeric table - the only explicit numbers are the two reference coating thicknesses (12,300 A and 13,675 A) used across its process-condition tables. Develop time and post-exposure/hardbake steps are largely unaddressed or inconsistent across the datasheet's own example tables.

—07 / Family

Grades in this family

Other grades in the MICROPOSIT S1800 G2 series line differ mainly in coating thickness:

MICROPOSIT S1800 G2 series — grade comparison
Grade	Thickness	Exposure dose
S1813 (this page)	1.0–1.9 µm	150 mJ/cm² @ 436 nm
Microposit S1805	—	—
Microposit S1818	—	—
S1822	—	—

—08 / Troubleshooting

Troubleshooting

Common failure modes for S1813, answered from the manufacturer's datasheet and application notes. These are starting points — your substrate, tooling and environment shift the specifics, so calibrate on-tool.

What exposure dose does MICROPOSIT S1813 need?

The datasheet gives a sizing (E-size) energy of 150 mJ/cm² on g-line (436 nm) exposure tools — equal to 1.3× the clearing dose E0 = 82 mJ/cm² from the contrast curve. Exposure is optimized for 436 nm and usable across 350–450 nm. No i-line (365 nm) or h-line (405 nm) dose is published, and Table 6's Dill A/B coefficients are absorption parameters, not doses — don't treat them as one.