https://nanyte.com/photoresists/s1813 · last updated 2026-07-12
- Manufacturer
- Kayaku Advanced Materials (Microposit brand; datasheet originally published by Rohm and Haas Electronic Materials / later Dow Electronic Materials)
- Tone
- positive
- Chemistry
- DNQ-novolak
- Thickness
- 1.0–1.9 µm
- Exposure dose
- 150 mJ/cm² at 436 nm
- Developer
- Applications
- General prototyping · Etch mask
Cross-checked — two independent extractions agree.
Spin coating
S1813 is spin-coated to 1.0–1.9 µm. The curve below is redrawn from the manufacturer's published data — read your target thickness off the vertical axis and take the matching spin speed as a starting point.
Data points
| Series | rpm | µm |
|---|---|---|
| S1813 G2 | 2000 | 1.9 |
| 3000 | 1.6 | |
| 4000 | 1.3 | |
| 5000 | 1.2 | |
| 6000 | 1.1 | |
| 7000 | 1.0 |
Values are the manufacturer's starting points, not a guarantee; verify on your own tool. Characterize on-tool. Series digitized from a published figure were independently cross-checked by a second blind read; treat those values as approximate (±10 %).
re-extracted 2026-07-12, pixel-calibrated via PyMuPDF vector-drawing extraction (the chart's markers and axis tick-labels are native PDF vector/text objects; the S1813 G2 triangle marker centroid at each of the 6 rpm columns was located directly from the page's vector drawing commands and identified by its vertical rank — 2nd of 4 stacked series, diamond/S1818 above, square/S1811 and x/S1805 below, matching the legend order — then converted to Å via a y-axis calibration fit from the gridline tick-label text baselines: 280.11 Å/pt, exact and linear across all 9 gridlines). 'MICROPOSIT S1800 G2 Photoresist Undyed Series Spin Speed Curves' (Figure 2), p.2 of MICROPOSIT S1800 G2 Series Photoresists datasheet (Rohm and Haas Electronic Materials, ME06N041, Rev. 0, October 2006). The trace's plotted markers run 2,000-7,000 rpm only (6 points) — confirmed by vector extraction, not the chart's wider 1,000-8,000 rpm axis range. No rpm-paired numeric anchor exists in the document — the two printed reference thicknesses (12,300 Å and 13,675 Å) are coat conditions used for OTHER test figures (masking linearity, dispersion curve), not points on this spin curve. Supersedes the earlier eyeball read, which under-read the mid-to-low-rpm points by 5-12%.
The datasheet publishes a spin-speed FIGURE (Figure 2, p.2, "MICROPOSIT S1800 G2 Photoresist Undyed Series Spin Speed Curves") plotting film thickness (0-40,000 Å) vs. spin speed (1,000-8,000 rpm axis range) for four grades (S1805, S1811, S1813, S1818 G2) on one chart, coated on an SVG 81 with a 115°C/60s softbake. The S1813 G2 trace (triangle marker, second-highest of the four, which do not cross across the plotted range) was pixel-calibrated 2026-07-12 by vector-extracting each marker centroid at its 6 plotted rpm columns (2,000-7,000 rpm — the trace's own plotted extent, narrower than the chart's 1,000-8,000 rpm axis range) and converting to Å via a linear fit off the axis tick-label baselines (see spinCurves). RESOLVED 2026-07-12 (was previously flagged for QC): thicknessRange is now the span of this corrected curve (1.03-1.90 µm), not the two unrelated reference coat thicknesses (12,300 Å / 13,675 Å) previously used, which are single fixed-film conditions for OTHER test figures (masking linearity, exposure latitude, dispersion curve) and were never a stated achievable-range statement — see thicknessRange.source. The datasheet does state maximum coating uniformity is typically attained between 3,500-5,500 rpm. The two reference thicknesses still recur across the process-condition tables: 12,300 Å in Tables 1, 4, 5, 7, 8, and 13,675 Å in Table 3.
- Adhesion
Soft bake
- Soft bake
- 115 °C · 60 s · hotplate
- Notes
- Consistent across all process-condition tables in the datasheet (Tables 1-8).
SOURCE: e.g. Table 1, p.1: "Softbake 115°C/60 sec. Hotplate"
Exposure dose
The manufacturer publishes 150 mJ/cm² at 436 nm (Sizing ("E-size") exposure dose measured on g-line (436 nm) exposure tools (GCA 8500 g-Line 0.35 NA; Nikon 1505 G6E g-Line 0.54 NA), reported as 150 mJ/cm² = 1.3 x E0, where E0 = 82 mJ/cm² is the resist's clearing dose from the contrast curve (Figure 6, Table 9). Resist is exposable over 350-450 nm broadly, with exposure properties optimized for 436 nm. A separate Table 6 gives Dill optical parameters (A, B absorption coefficients, not a dose) at both 365 nm and 436 nm for use in lithography simulators — these are not exposure doses and were not used to populate at365_mJcm2/at405_mJcm2.). Dose scales with film thickness and depends on your optics, so treat it as a starting point and run a dose array.
- Dose at 436 nm (g-line)
- 150 mJ/cm²
- As published
Not published for this resist: Dose at 365 nm, Dose at 405 nm — characterize on-tool.
SOURCE: Table 9 ("Lithographic Responses Summary"), p.4: "Sizing Energy 150 mJ/cm2 (1.3 E0)"; E0 = 82 mJ/cm2 from Figure 6 contrast curve, p.4
Development
- Developer
- Dilution
- Test conditions in Tables 4, 7 and 8 use MF-319/MF-321 diluted 1:10 ("MF-31/10", "MF-321/10"); Table 1 does not name a specific developer or dilution.
- Method
- Double Spray Puddle (DSP) at 21°C in all cited process-condition tables
- Developer family
- TMAH-based
Not published for this resist: Time, Rinse — characterize on-tool.
SOURCE: e.g. Table 1, p.1: "Develop 15 +50 sec. Double Spray Puddle (DSP) @ 21°C"; Tables 4, 7, 8, p.3-4: "MF-31/10 +30 DSP @ 21°C" / "MF-321/10 +30 DSP @ 21°C"
Hard bake, etch & strip
- Stripper
- Datasheet states only that "residue-free photoresist removal" is achieved "using standard MICROPOSIT removers", without naming a specific product.
- Storage
Not published for this resist: Hard bake, Descum, Etch resistance — characterize on-tool.
Where it's used
S1813 is a standard positive DNQ/novolak-class g-line resist (chemistry classification based on well-established industry knowledge of this product family; this specific TDS does not itself restate the chemical composition). Reach for S1813 when you want the series' balanced, best-documented option rather than pushing to the thin (S1805) or thick (S1818) ends of the family — it is the one grade whose exposure, contrast and develop behaviour the manufacturer actually measured in this datasheet. Its ~85 deg wall angle (Table 9) and single-tone positive process (no reversal/undercut step described) make it unsuited to lift-off without an added process (e.g. bilayer or image-reversal), and this datasheet makes no lift-off or electroplating claims. The published spin-speed figure (Figure 2) could not be digitized reliably from text extraction, so no spinCurves points are reported - only the two explicit reference coating thicknesses (12,300 A and 13,675 A) used across its process-condition tables. Develop time and post-exposure/hardbake steps are largely unaddressed or inconsistent across the datasheet's own example tables, and are left null rather than guessed.
Sources & disclaimer
- Kayaku Advanced Materials (Microposit brand; datasheet originally published by Rohm and Haas Electronic Materials / later Dow Electronic Materials) — S1813 datasheet (ME06N041, Rev. 0, October 2006 (Rohm and Haas Electronic Materials)) · accessed 2026-07-10
- https://kayakuam.com/products/microposit-s1800-g2-series-photoresists/ — Confirms Kayaku Advanced Materials currently lists/sells the MICROPOSIT S1800 G2 series (used only to support 'status: active'); the page itself returned HTTP 403 to automated fetch during this session, so its content was not used for any numeric field.
- Nikolaev et al.. Mechanical Properties of Microposit S1813 Thin Layers. Advanced Structured Materials (2020). doi:10.1007/978-3-030-48161-2_9Nanoindentation of S1813 films (a book/proceedings chapter, not a standalone journal article).
- Gerlt et al.. Reduced Etch Lag and High Aspect Ratios by Deep Reactive Ion Etching (DRIE). Micromachines (2021). doi:10.3390/mi120505421.4 µm S1813 used as a DRIE etch mask, reporting a Si:resist selectivity of roughly 22:1.
- Wu et al.. Fabrication of Large-Area Silicon Spherical Microlens Arrays by Thermal Reflow and ICP Etching. Micromachines (2024). doi:10.3390/mi15040460Reflowed S1813 microlenses transferred into a 128x128 silicon microlens array with roughly 1.1 nm surface roughness.
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-07-12.