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Microposit S1818 process recipe

MICROPOSIT S1818 G2 is the thick-film grade of the MICROPOSIT S1800 G2 positive photoresist series, coating roughly 1.5–2.65 µm — chosen for the heaviest single S1800 coat, giving deeper etch masking or taller step coverage than the thinner grades.

https://nanyte.com/photoresists/s1818 · last updated 2026-07-26

At a glance
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Manufacturer
Rohm and Haas Electronic Materials
Tone
positive
Chemistry
DNQ-novolak
The exposed resist dissolves in the developer; the unexposed film stays. Schematic cross-sections for Microposit S1818 — feature width, film aspect ratio and sidewall angle are illustrative, not to scale.
01 / Coating

Spin coating

Spin curve for Microposit S1818: film thickness in µm against spin speed in rpm.1.01.52.02.53.02k3k4k5k6k7kSPIN SPEED (rpm)THICKNESS (µm)
Data points
Microposit S1818 — film thickness (µm) by spin speed (rpm)
Seriesrpmµm
S1818 G220002.6
30002.1
40001.9
50001.7
60001.6
70001.5

Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool. Series digitized from a published figure are approximate (±10 %).

read from figure, 'MICROPOSIT S1800 G2 Photoresist Undyed Series Spin Speed Curves' (Figure 2), p.2 of MICROPOSIT S1800 G2 Series Photoresists datasheet (Rohm and Haas Electronic Materials, ME06N041, Rev. 0, October 2006); identified as the highest of four plotted traces (diamond marker, legend order S1818/S1813/S1811/S1805 top-to-bottom by thickness — the four curves do not cross across the plotted range); read at gridline/marker crossings every 1,000 rpm from 2,000–7,000 rpm off a linear-linear chart (thickness 0–40,000 Å, spin speed 1,000–8,000 rpm); no numeric table accompanies the figure so no independent point-value anchor exists in the document — visual chart-reading only, typical uncertainty ~10–15%.

Redrawn from the manufacturer's published data — hover to read between points, click to pin.
  • Figure 2 ('MICROPOSIT S1800 G2 Photoresist Undyed Series Spin Speed Curves', p.2) plots four traces — S1818 G2, S1813 G2, S1811 G2, S1805 G2 — on one axis (spin speed 1,000–8,000 rpm vs photoresist thickness 0–40,000 Å), each carrying a distinct legend marker (diamond, triangle, square, cross respectively, in that order top-to-bottom by thickness) and, because the four curves do not cross across the plotted range, S1818 G2 (diamond marker) is identified as the highest trace at every spin speed.
  • The trace plotted here was read from gridline/marker crossings at 1,000 rpm intervals from 2,000–7,000 rpm; no numeric thickness-vs-rpm table accompanies the figure, so there is no independent point-value anchor and the values carry typical chart-reading uncertainty of about 10–15%.
  • Table 2 (p.2) records that Figure 2's coatings used an SVG 81 coater and a 115°C/60 sec hotplate softbake on silicon, measured on a Nanometrics 210 — that condition applies to this grade's trace and is recorded under softbake below.
  • The document states maximum coating uniformity is 'typically attained between the spin speeds of 3,500–5,500 rpm' (p.2, series-wide statement, not S1818-specific).
  • No rehydration hold or edge-bead handling is discussed anywhere in the document.
Adhesion
HMDS recommended — "MICROPOSIT S1800 G2 Series Photoresist work well with the hexamethyldisilazane-based MICROPOSIT Primers. Concentrated MICROPOSIT Primer is recommended when vacuum vapor priming. Diluted primer is recommended for liquid phase priming applications." (SUBSTRATE PREPARATION, p.2 — series-wide statement, not grade-specific).
02 / Bake

Soft bake

Soft bake
115 °C · 60 s · hotplate
Notes
From Table 2 ('Process Conditions, Refer to Figure 2'): coat tool SVG 81, softbake 115°C/60 sec hotplate, measured on a Nanometrics 210. This is the condition used to generate the Figure 2 spin-speed-curve trace that includes S1818 G2; it is not a separately stated softbake recommendation outside that figure.

SOURCE: Table 2, p.2 of MICROPOSIT S1800 G2 SERIES PHOTORESISTS, ME06N041, Rev. 0, October 2006

03 / Exposure

Exposure dose

Exposure is optimized at 436 nm across the S1800 G2 series and usable from 350 to 450 nm, but that window is all S1818 gets: the sheet's dose numbers were measured on S1813 and belong to it. Run a dose array on your own tool to land the working dose.

Not published for this resist: Dose at 365 nm, Dose at 405 nm — characterize on-tool.

04 / Development

Development

Developer family
TMAH or buffered alkaline

Not published for this resist: Developer, Dilution, Time, Method, Rinse — characterize on-tool.

05 / Post-processing

Hard bake, etch & strip

Stripper
"Residue-free photoresist removal using standard MICROPOSIT removers" (ADVANTAGES section, p.1) — no specific remover product is named.
Storage
"Store products in tightly closed original containers at temperatures recommended on the product label." (STORAGE section, p.5) — no specific temperature is printed in the document itself.

Not published for this resist: Hard bake, Descum, Etch resistance — characterize on-tool.

06 / Applications

Where it's used

Practical notes from the datasheet

This grade appears exactly once in the document: as the highest of four traces (alongside S1805, S1811 and S1813 G2) on the undyed-series film-thickness-vs-spin-speed chart (Figure 2, p.2). Pick S1818 G2 over its thinner S1805/S1811/S1813 siblings when the process needs the most film a single S1800 G2 coat can give — it sits at the top of the series' spin-speed chart, coating thickest of the four undyed grades at any given speed. No dose, develop time, or lithographic-performance data (contrast curve, Dill parameters, absorbance spectrum, masking linearity, exposure/focus latitude — Figures 4–9, Tables 4–9) is published for S1818 specifically; every one of those figures and tables explicitly names MICROPOSIT S1813 G2 as the tested grade, and none of that data may be borrowed here. The document states the S1800 G2 system broadly is optimized for g-line (436 nm) exposure and usable across 350–450 nm, is compatible with HMDS-based MICROPOSIT primers, and works with both metal-ion-free (MF-319 family) and metal-ion-bearing MICROPOSIT developers, but none of those statements carry an S1818-specific number. This recipe replaces an earlier extraction made from the superseded circa-1993 Shipley 'MPR S1800 1093' edition, per a WL decision on 2026-07-10; the S1800 line traces from Shipley through Rohm and Haas Electronic Materials (publisher of this G2 edition) to Dow, DuPont, and today's Kayaku Advanced Materials. Chemistry classified as dnq-novolak directly from the Dow/Rohm and Haas MICROPOSIT S1818 MSDS composition table (mixed cresol novolak resin + diazo photoactive compound).

07 / Family

Grades in this family

Other grades in the MICROPOSIT S1800 G2 Series line differ mainly in coating thickness:

MICROPOSIT S1800 G2 Series — grade comparison
GradeThicknessExposure dose
S18131.0–1.9 µm150 mJ/cm² @ 436 nm
Microposit S1805
Microposit S1818 (this page)
S1822
08 / Troubleshooting

Troubleshooting

Common failure modes for Microposit S1818, answered from the manufacturer's datasheet and application notes. These are starting points — your substrate, tooling and environment shift the specifics, so calibrate on-tool.

How thick a film does MICROPOSIT S1818 G2 coat?

S1818 G2 is the thickest of the four undyed S1800 G2 grades — the top trace on the Figure 2 spin-speed chart. It runs from about 2.65 µm at 2,000 rpm down to 1.5 µm at 7,000 rpm. Maximum coating uniformity is typically attained between 3,500 and 5,500 rpm (a series-wide statement). These points are a figure read with roughly ±10–15% uncertainty, so confirm the target thickness on-tool.

SOURCE: MICROPOSIT S1800 G2 Series Photoresists datasheet (Rohm and…

MICROPOSIT S1800 G2 Series Photoresists datasheet (Rohm and Haas Electronic Materials, ME06N041 Rev. 0, October 2006) — Figure 2 undyed-series spin-speed curves, p.2

What exposure dose should I use for S1818 G2?

This datasheet publishes no exposure dose for S1818. The only quantified dose — 150 mJ/cm² sizing energy — is explicitly attributed to S1813 G2 and must not be borrowed for S1818. The series is exposable across 350–450 nm with properties optimized for 436 nm (g-line); pick a working dose by characterizing on-tool.

SOURCE: MICROPOSIT S1800 G2 Series Photoresists datasheet (Rohm and…

MICROPOSIT S1800 G2 Series Photoresists datasheet (Rohm and Haas Electronic Materials, ME06N041 Rev. 0, October 2006) — EXPOSURE section p.3; Table 9 (S1813-specific), p.4

What soft bake does S1818 G2 need?

The only soft-bake condition tied to S1818 is 115°C for 60 s on a hotplate — the coat condition used to generate its Figure 2 spin-speed trace (SVG 81 coater, measured on a Nanometrics 210). It is a documented test condition, not a separately stated grade-specific recommendation, so treat it as a starting point rather than an optimized bake.

SOURCE: MICROPOSIT S1800 G2 Series Photoresists datasheet (Rohm and…

MICROPOSIT S1800 G2 Series Photoresists datasheet (Rohm and Haas Electronic Materials, ME06N041 Rev. 0, October 2006) — Table 2, p.2

Does S1818 G2 need HMDS priming?

This is a family-generic answer — the datasheet gives no S1818-specific priming step. The S1800 G2 series works well with hexamethyldisilazane-based MICROPOSIT Primers: concentrated primer for vacuum vapour priming, diluted primer for liquid-phase priming. Prime oxide-forming substrates before coating.

SOURCE: MICROPOSIT S1800 G2 Series Photoresists datasheet (Rohm and…

MICROPOSIT S1800 G2 Series Photoresists datasheet (Rohm and Haas Electronic Materials, ME06N041 Rev. 0, October 2006) — SUBSTRATE PREPARATION, p.2

Why is there so little process data specific to S1818?

S1818 appears only once in this datasheet — as the highest trace on the undyed-series spin-speed chart (Figure 2). Every contrast curve, Dill parameter, masking-linearity and exposure/focus-latitude figure names S1813 G2 as the tested grade, so none of that data may be applied to S1818. Its spin curve is the only grade-specific quantitative data published.

SOURCE: MICROPOSIT S1800 G2 Series Photoresists datasheet (Rohm and…

MICROPOSIT S1800 G2 Series Photoresists datasheet (Rohm and Haas Electronic Materials, ME06N041 Rev. 0, October 2006) — Figures 4–9 / Tables 4–9 (all S1813-specific)

09 / Sources

Sources & disclaimer

Research using this resist
  1. Bonafe et al.. Dissipative charge transport in organic mixed ionic-electronic conductor channels. Nature Communications (2025). doi:10.1038/s41467-025-57528-9
    Patterns Microposit S1818 (4000 rpm for 60 s, 110 C for 1 min) by maskless direct-write lithography on an ML3 Microwriter to define metal contacts, then uses a second S1818 layer spun at 2000 rpm as the lift-off stencil for a PEDOT:PSS transistor channel.
  2. Arulanandam et al.. Fabrication methods for high reflectance dielectric-metal point contact rear mirror for optoelectronic devices. MethodsX (2022). doi:10.1016/j.mex.2022.101898
    A methods paper that prints its full Shipley S1818 spin-coat, photolithography and strip recipe as a step table, using the resist to open vias through a dielectric rear-mirror stack and to mask the subsequent electroplating step.
  3. Cheng et al.. Ultrathin Microlens Arrays for Dynamic Beam Shaping Based on 3D Lithography. Micromachines (2026). doi:10.3390/mi17020250
    Selects S1818 as the thin-film resist for a 3D-lithography microlens array, targeting a coat of roughly 1.6 um so that a 624 nm resist relief transfers, at the established etch selectivity, into an 800 nm structure depth in the substrate.

Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-07-26.

Cite this recipe

NANYTE. "Microposit S1818 process recipe." NANYTE Photoresist Library. https://nanyte.com/photoresists/s1818. Accessed 2026-07-26.

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