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AR-U 4030 process recipe

AR-U 4030 is Allresist's image-reversal photoresist in the AR-U 4000 series, a novolac/bisazide negative formulation that can also be run as an ordinary positive resist, coating roughly 1.8-2.5 µm and producing pronounced undercut lift-off profiles when processed with an image-reversal bake plus flood exposure.

https://nanyte.com/photoresists/ar-u-4030 · last updated 2026-07-12

At a glance
Manufacturer
Allresist
Tone
image reversal
Chemistry
Bisazide-novolak
Thickness
1.8–2.5 µm
Exposure dose
42 mJ/cm²
Developer
AR 300-35
Applications
Image reversal · Lift-off · Etch mask
Etch maskSuitable forLift-offSuitable for

Cross-checked — two independent extractions agree.

01 / Coating

Spin coating

AR-U 4030 is spin-coated to 1.8–2.5 µm. The curve below is redrawn from the manufacturer's published data — read your target thickness off the vertical axis and take the matching spin speed as a starting point.

Spin curve for AR-U 4030: film thickness in µm against spin speed in rpm.0.002.04.01k2k3k4k5k6kSPIN SPEED (rpm)THICKNESS (µm)
Data points
AR-U 4030 — film thickness (µm) by spin speed (rpm)
Seriesrpmµm
AR-U 403010004.1
20002.9
30002.4
40002.1
50001.9
60001.8

Values are the manufacturer's starting points, not a guarantee; verify on your own tool. Characterize on-tool. Series digitized from a published figure were independently cross-checked by a second blind read; treat those values as approximate (±10 %).

read from figure, 'Spin curve' (D₀/µm 0-6.0 vs rpm 0-8000), p.32 of Allresist AR-U 4000 product-information sheet (as of January 2017); genuine multi-grade chart with three individually legended traces — AR-U 4030 (topmost, dark-navy diamonds), AR-U 4040 (middle, red squares), AR-U 4060 (bottom, olive triangles). TRACE IDENTITY, re-proven 2026-07-12: the topmost (navy diamond) trace is AR-U 4030, established two independent ways: (1) its marker color matches the dark-navy 'AR-U 4030' legend label positioned at that trace's right-hand endpoint; (2) it sorts correctly against the Properties I table's per-grade nominal 'Film thickness/4000 rpm (µm)' row (AR-U 4030 = 1.8, AR-U 4040 = 1.4, AR-U 4060 = 0.6, p.32) and the Coating-box captions ('4000 rpm, 60 s, 1.8/1.4/0.6 µm', p.33/p.34) — the topmost/thickest plotted trace must be the grade with the largest nominal thickness (4030), the middle trace 4040, the bottom (olive triangle) trace 4060; no ambiguity in trace assignment. ADJUDICATED 2026-07-12 (third pixel read, WL directive: figure over table): the prior extraction's 6 points were systematically ~15-30% too low (a mis-calibration, not a wrong-trace read — same topmost/navy trace, same 6 rpm columns). Re-extracted via PyMuPDF: axes calibrated from the 13 horizontal gridlines (rows 18-269, evenly spaced, matching the 13 y-axis labels 0.0-6.0 in 0.5 steps exactly, giving 269=D0-0µm, 41.833 px/µm) and the 9 vertical gridlines (columns 54-433, matching the 9 x-axis labels 0-8000 rpm in 1000-rpm steps exactly, giving 54=0rpm, 0.047375 px/rpm); AR-U 4030 marker centroid at each rpm column taken as the midpoint of the longest contiguous run of navy-diamond-colored pixels within +-6 px of the expected column (rejects gridline/legend-text color bleed, which a naive min/max-span search does not). New read: 4.12/2.93/2.40/2.09/1.89/1.79 µm at 1000/2000/3000/4000/5000/6000 rpm — closely matches the independent cross-check extraction (4.13/2.94/2.41/2.09/1.88/1.71) to within 1-5% at every point, confirming the cross-check was correct and this file's prior read erred. ANCHOR CHECK — CONFIRMED CONFLICT, RESOLVED PER D11: the figure's own 4000 rpm marker reads 2.09 µm, ~16% above the Properties I table's printed anchor 'Film thickness/4000 rpm (µm): 1.8' and the matching Coating-box captions. Per WL's domain rule (a figure/measured curve usually wins over a printed nominal table value), the figure value (2.09 µm) is retained as the recipe's spin-curve data; the 1.8 µm table anchor is a nominal/rounded spec value, not necessarily this specific measured curve's own reading. This is a genuine figure-vs-table disagreement in the source datasheet, not a misread — figure retained per adjudication policy.

Redrawn from the manufacturer's published data — hover to read values between points, click to pin.

Spin-speed-vs-thickness figure ('Spin curve', p.32, axes D₀/µm 0-6.0 vs rpm 0-8000): genuine multi-grade chart, three individually legended traces (AR-U 4030 topmost/navy, AR-U 4040 middle/red, AR-U 4060 bottom/olive); only the AR-U 4030 (topmost navy diamond) trace was digitized here, 6 markers from 1000-6000 rpm. ADJUDICATED 2026-07-12 (third pixel read, WL directive: figure over table): trace identity re-proven via both the legend color match AND the Properties I nominal-thickness ranking (4030=1.8 > 4040=1.4 > 4060=0.6 µm at 4000 rpm, matching top>mid>bottom trace order) — no ambiguity. The prior digitization was ~15-30% too low (mis-calibration); re-extracted with gridline-exact axis calibration (see spinCurves[0].source), now matching the independent cross-check extraction to within 1-5% at every point. The figure's own 4000 rpm marker (2.09 µm) is ~16% above the Properties I table's printed anchor (1.8 µm) — a genuine figure-vs-table disagreement in the source datasheet; per D11 the figure value is retained. No dispense volume or acceleration ramp is described anywhere in this document.

Adhesion
HMDS not required — Datasheet specifies Allresist's own adhesion promoter AR 300-80 (Process chemicals table, p.32); does not mention HMDS specifically, so hmds is left null rather than assumed true or false.
02 / Bake

Soft bake

Soft bake
90 °C · 60 s · hotplate
Notes
Referred to as 'Tempering' in the datasheet. ± 1 °C tolerance. Alternative: 85 °C, 25 min (1500 s) convection oven. Same schedule is used for both the positive-tone and negative/image-reversal processes. Corroborated by Processing instructions prose (p.35): for pure positive-tone use, 'a softbake at only 85 °C (oven) or 90 °C (hot plate) after coating is recommended... since this resist has the potential to be crosslinked due to its specific components.'

SOURCE: Process conditions diagrams, p.33 (positive) and p.34 (negative); Processing instructions, p.35

03 / Exposure

Exposure dose

The manufacturer publishes 42 mJ/cm² ('Image-wise UV exposure: Broadband UV, 365 nm, 405 nm, 436 nm; 90 % layer build up. Exposure dose (E0, broadband UV stepper): 42 mJ/cm²' for AR-U 4030 (Process conditions negative process diagram, p.34).). Dose scales with film thickness and depends on your optics, so treat it as a starting point and run a dose array.

As published
'Image-wise UV exposure: Broadband UV, 365 nm, 405 nm, 436 nm; 90 % layer build up. Exposure dose (E0, broadband UV stepper): 42 mJ/cm²' for AR-U 4030 (Process conditions negative process diagram, p.34).
Post-exposure bake
115 °C · 4 min
Flood exposure
74 mJ/cm²

Not published for this resist: Dose at 365 nm, Dose at 405 nm — characterize on-tool.

SOURCE: Process conditions, NEGATIVE (image-reversal) process diagram, p.34 of Allresist AR-U 4000 series product information (English); dose stated as "Exposure dose (E0, broadband UV stepper): 42 mJ/cm²". The positive-process diagram on p.33 gives a different dose (38 mJ/cm²) and is deliberately not used.

04 / Development

Development

Developer
AR 300-35
Dilution
4:3
Time
60 s
Method
puddle
Rinse
DI-H2O, 30 s
Developer family
Buffered alkaline

SOURCE: Process conditions negative process diagram, p.34

05 / Post-processing

Hard bake, etch & strip

Etch resistance
No qualitative etch-resistance claim is made in the Characteristics list (unlike Allresist's AR-N 4300 sheet); only a raw rate table is given. Plasma etching rates (5 Pa, 240-250 V Bias, Properties II table, p.32): Ar-sputtering 8 nm/min, O2 169 nm/min, CF4 40 nm/min, 80% CF4 + 16% O2 89 nm/min.
Stripper
General Process chemicals table (p.32): AR 300-76, AR 300-72. Positive-process removal (p.33): 'AR 300-76 or O2 plasma ashing'. Negative-process removal (p.34): 'AR 300-70 or O2 plasma ashing' — this last figure ('AR 300-70') differs from the AR 300-76 used elsewhere in the same datasheet; reproduced verbatim as printed rather than corrected to 300-76, and flagged here for human verification against the source PDF, p.34, in case it is a distinct product or a transcription variant.
Storage
"Storage 6 month (°C): 8 - 12" (Properties I table, p.32).

Not published for this resist: Hard bake, Descum — characterize on-tool.

SOURCE: Process conditions diagrams, p.33 (positive) and p.34 (negative)

06 / Applications

Where it's used

Image reversalLift-offEtch mask

AR-U 4030 is Allresist's image-reversal resist in the AR-U 4000 series — described as a 'combination of novolac and bisazide' — that can be processed either as an ordinary positive resist or, with an image-reversal bake and flood exposure, as a negative resist with pronounced undercut lift-off profiles. In image-reversal (negative) mode the sequence is: image-wise broadband exposure (42 mJ/cm² for this grade) -> an 'image reversal bake' (115 °C/4 min hotplate, or 110 °C/25 min oven) that crosslinks the exposed areas via the resist's amine component -> an unmasked flood exposure (74 mJ/cm², roughly twice the image-wise dose) that renders the remaining, still-unexposed areas developable -> puddle development in AR 300-35 (4:3). Undercut and vertical-wall profiles are controlled by the same three levers in opposite directions: low image-wise dose + low reversal-bake temperature + longer development time maximizes undercut for lift-off, while high dose + high bake temperature + shorter development time produces vertical walls suited to etch masking. Critically, the image-wise exposure dose differs by process mode for the same grade — 38 mJ/cm² if used as a plain positive resist versus 42 mJ/cm² in the image-reversal negative mode — so the two figures must not be conflated; this recipe records the negative/image-reversal dose since that matches the resist's headline classification (tone: image-reversal), with the positive-mode figure noted separately. No h-line- or i-line-isolated dose is published anywhere; both the 42 mJ/cm² image-wise and 74 mJ/cm² flood-exposure doses are broadband (365/405/436 nm) figures.

07 / Sources

Sources & disclaimer

Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-07-12.

Cite this recipe

NANYTE. "AR-U 4030 process recipe." NANYTE Photoresist Library. https://nanyte.com/photoresists/ar-u-4030. Accessed 2026-07-12.

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