https://nanyte.com/photoresists/ar-p-3510t · last updated 2026-07-10
- Manufacturer
- Allresist
- Tone
- positive
- Chemistry
- DNQ-novolak
- Thickness
- 2 µm
- Developer
- AR 300-26 (1:2) or AR 300-35 (undiluted) or AR 300-44
- Applications
- Lift-off · Etch mask
Unverified — not yet human-checked; values transcribed from the datasheet, characterize on-tool.
Spin coating
The manufacturer does not publish a spin curve for AR-P 3510T. The 'Spin curve' figure (p.1, bottom-left; axes: film thickness 1.0–6.0 µm vs. spin speed 0–8000 rpm) plots TWO traces, and per the manufacturer's OWN legend each trace already covers a combined pair of grades: 'AR-P 3510/3510 T' as one trace, 'AR-P 3540/3540 T' as the other — this document itself, not an extraction error, presents 3510 and 3510T as sharing one spin curve. This extraction did not read numeric points off the figure: the PDF's text layer surfaces only axis tick labels, not the underlying vector-curve geometry, and a low-confidence multi-grade read is worse than none (per the SU-8 2050 / LOR 3A precedents in this project). The only confirmed numeric anchor is 2.0 µm at 4000 rpm, 60 s spin time (from the 'Coating' row of the worked process-conditions table, p.1, 'AR-P 3510' column — unsplit for this grade pair per the Properties I table). No accel or edge-bead detail is published.
- Adhesion
Soft bake
- Soft bake
- 100 °C · 60 s · hotplate
- Notes
SOURCE: "Tempering" row, "Process conditions" table, p.1, of allresist_produktinfos_ar-p3500_3500t_englisch.pdf
Exposure dose
The manufacturer does not publish a clearing dose for AR-P 3510T. Determine it with a dose array on your own tool.
- As published
- Broadband UV, 365 nm, 405 nm, 436 nm
Not published for this resist: Dose at 365 nm, Dose at 405 nm — characterize on-tool.
Development
- Developer
- AR 300-26 (1:2) or AR 300-35 (undiluted) or AR 300-44
- Dilution
- Time
- Not published — characterize on-tool
- Method
- puddle
- Rinse
- DI-H2O, 30 s
- Developer family
- TMAH-based
SOURCE: "Development recommendations" table (AR-P 3510 T, 3540 T row) + "Development"/"Rinse" rows of the "Process conditions" table, p.1, of allresist_produktinfos_ar-p3500_3500t_englisch.pdf
Hard bake, etch & strip
- Hard bake
- 115 °C · 60 s
- Descum
- Not published — characterize on-tool
- Etch resistance
- Stripper
- Storage
SOURCE: "Post-bake (optional)" row, "Process conditions" table, p.1, of allresist_produktinfos_ar-p3500_3500t_englisch.pdf
Where it's used
AR-P 3510T is the TMAH-compatible ('T') variant of Allresist's AR-P 3510 grade within the wider AR-P 3500(T) series, a classic DNQ/novolac positive resist for IC production with broadband UV / i-line / g-line sensitivity. The manufacturer states the 3500T sub-line is 'suitable for TMAH developer 0.26 n', distinguishing it from the base (non-T) grades. Several process parameters in this document are given only for the two SPECIFIC worked example columns the table actually labels — 'AR-P 3510' (base) and 'AR-P 3540 T' — and NOT for 'AR-P 3510 T' itself; most notably the exposure dose (55 vs. 120 mJ/cm² for the two shown grades) is clearly grade-sensitive, so no dose is recorded here rather than borrowing the base grade's number. By contrast, film thickness at 4000 rpm (2.0 µm) and the spin-curve figure are explicitly shared/combined between 3510 and 3510T by the manufacturer's own table structure and legend. A large block of dose-range, depth-of-focus, and SEM linearity/dark-field-erosion data on p.1 (bottom) and all of p.2 is explicitly labeled 'AR-P 3540 T' and belongs to that different grade, not to AR-P 3510T — excluded here despite the superficially similar SKU name.
Sources & disclaimer
- Allresist — AR-P 3510T datasheet (As of January 2014) · accessed 2026-07-10
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-07-10.
