https://nanyte.com/photoresists/ar-p-3510t · last updated 2026-09-28
- Manufacturer
- Allresist
- Tone
- positive
- Chemistry
- DNQ-novolak
- Thickness
- 2 µm
- Developer
- AR 300-26 (1:2) or AR 300-35 (undiluted) or AR 300-44
- Applications
- Lift-off · Etch mask
- Substrate
- Resist
- Exposed
Spin coating
The manufacturer does not publish a spin curve for AR-P 3510T.
- The 'Spin curve' figure (p.1, bottom-left; axes: film thickness 1.0–6.0 µm vs. spin speed 0–8000 rpm) plots TWO traces, and per the manufacturer's OWN legend each trace already covers a combined pair of grades: 'AR-P 3510/3510 T' as one trace, 'AR-P 3540/3540 T' as the other — the document itself presents 3510 and 3510T as sharing one spin curve.
- No numeric spin table accompanies that figure, so no curve is published for this grade.
- The only confirmed numeric anchor is 2.0 µm at 4000 rpm, 60 s spin time (from the 'Coating' row of the worked process-conditions table, p.1, 'AR-P 3510' column — unsplit for this grade pair per the Properties I table).
- No accel or edge-bead detail is published.
- Adhesion
- Allresist names its adhesion promoter AR 300-80, not HMDS (Process chemicals box, p.1) — the box sits beside the AR-P 3540T worked example, so it is not stated specifically for AR-P 3510T.
Soft bake
- Soft bake
- 100 °C · 60 s · hotplate
- Notes
- 'Tempering (± 1 °C): 100 °C, 1 min, hot plate OR 95 °C, 25 min, convection oven' — this row of the worked process-conditions table (p.1) is NOT split between the table's two example columns (AR-P 3510, AR-P 3540 T), i.e. it is presented as one shared condition for the worked AR-P 3500(T) example, which is why it is attributed to AR-P 3510T here despite that exact SKU not being one of the two labeled columns. Oven alternative: 95 °C for 25 min (1500 s).
SOURCE: "Tempering" row, "Process conditions" table, p.1, of allresist_produktinfos_ar-p3500_3500t_englisch.pdf
Exposure dose
Allresist splits exposure dose by grade and the T variant gets no column of its own — the two grades that do are 55 mJ/cm² for AR-P 3510 and 120 mJ/cm² for AR-P 3540 T. Neither is published as this grade's dose. Run a dose array on your own tool to land the working dose.
Not published for this resist: Dose at 365 nm, Dose at 405 nm — characterize on-tool.
Development
- Developer
- AR 300-26 (1:2) or AR 300-35 (undiluted) or AR 300-44
- Dilution
- AR 300-26 at 1:2; AR 300-35 used undiluted; AR 300-44 listed as the third (ready-to-use) option — three alternative developer/dilution combinations named for the combined 'AR-P 3510 T, 3540 T' row of the 'Development recommendations' table (p.1). This differs from the base AR-P 3510/3540 row, which instead lists AR 300-26 at 1:5, AR 300-35 at 1:1, and 'AR 300-40 (300-47), 1:1'.
- Time
- Not published — characterize on-tool
- Method
- puddle
- Rinse
- DI-H2O, 30 s
- Developer family
- TMAH or buffered alkaline
SOURCE: "Development recommendations" table (AR-P 3510 T, 3540 T row)…
"Development recommendations" table (AR-P 3510 T, 3540 T row) + "Development"/"Rinse" rows of the "Process conditions" table, p.1, of allresist_produktinfos_ar-p3500_3500t_englisch.pdf
Hard bake, etch & strip
- Hard bake
- 115 °C · 60 s (optional)
- Descum
- Not published — characterize on-tool
- Etch resistance
- Manufacturer states the AR-P 3500(T) series is 'plasma etching resistant, temperature-stable up to 120 °C' (Characterisation, series-wide, p.1). A 'Plasma etching rates (nm/min)' table (5 Pa, 240–250 V bias: Ar-sputtering 7, O2 165, CF4 37, 80 CF4 + 16 O2 88) is given but is grouped with the AR-P 3540T-labeled Cauchy coefficients, so it is not confirmed to represent AR-P 3510T specifically and is not used as a numeric value for this grade.
- Stripper
- AR 300-70 or O2 plasma ashing ("Removal" row, "Process conditions" table, p.1 — unsplit, shared across the worked example). Note: a separate 'Process chemicals' box elsewhere on p.1, positioned alongside the AR-P 3540T worked example, instead lists 'Remover AR 300-76, T: AR 300-76' — that box is not confirmed to apply to AR-P 3510T and is not used as the primary value here.
- Storage
- 10–18 °C, approximately 6-month shelf life ("Storage 6 month (°C)" row, "Properties I" table, p.1 — a single value spanning both the 3510/3510T and 3540/3540T column groups).
SOURCE: "Post-bake (optional)" row, "Process conditions" table, p.1, of allresist_produktinfos_ar-p3500_3500t_englisch.pdf
Where it's used
Practical notes from the datasheet
AR-P 3510T is the TMAH-compatible ('T') variant of Allresist's AR-P 3510 grade within the wider AR-P 3500(T) series, a classic DNQ/novolac positive resist for IC production with broadband UV / i-line / g-line sensitivity. The manufacturer states the 3500T sub-line is 'suitable for TMAH developer 0.26 n', distinguishing it from the base (non-T) grades. Several process parameters in this document are given only for the two SPECIFIC worked example columns the table actually labels — 'AR-P 3510' (base) and 'AR-P 3540 T' — and NOT for 'AR-P 3510 T' itself; most notably the exposure dose (55 vs. 120 mJ/cm² for the two shown grades) is clearly grade-sensitive, so no dose is stated for this grade rather than borrowing the base grade's number. By contrast, film thickness at 4000 rpm (2.0 µm) and the spin-curve figure are explicitly shared/combined between 3510 and 3510T by the manufacturer's own table structure and legend. A large block of dose-range, depth-of-focus, and SEM linearity/dark-field-erosion data on p.1 (bottom) and all of p.2 is explicitly labeled 'AR-P 3540 T' and belongs to that different grade, not to AR-P 3510T — excluded here despite the superficially similar SKU name.
Troubleshooting
Common failure modes for AR-P 3510T, answered from the manufacturer's datasheet and application notes. These are starting points — your substrate, tooling and environment shift the specifics, so calibrate on-tool.
AR-P 3510T develops much faster or slower than expected — am I using the base-grade developer dilution?
Quite possibly. The T grades have their own row in the datasheet's development table: AR 300-26 at 1:2, AR 300-35 undiluted, or AR 300-44. The base AR-P 3510 row is different: AR 300-26 at 1:5, AR 300-35 at 1:1, or AR 300-47 at 1:1. The 3500 T line is the one rated for 0.26 N TMAH developer. Develop by puddle at 21–23 °C held to ±0.5 °C and rinse in DI water for 30 s.
SOURCE: AR-P 3500 / 3500 T product information (Allresist, as of…
AR-P 3500 / 3500 T product information (Allresist, as of January 2014) — Characterisation, p.22; Process conditions and Development recommendations, p.23
What exposure dose should I start from for AR-P 3510T?
Not published for this grade. The process table gives 55 mJ/cm² for AR-P 3510 and 120 mJ/cm² for AR-P 3540 T, both as broadband-stepper E0, and neither should be borrowed for the T variant of the 2.0 µm grade. Allresist's method is to find the dose that clears a large open area in a reasonable develop time, then add 10–20 % for patterning. Do that with the developer and dilution you will actually run, since the dose moves with developer strength.
SOURCE: AR-P 3500 / 3500 T product information (Allresist, as of…
AR-P 3500 / 3500 T product information (Allresist, as of January 2014) — Process conditions: UV exposure, p.23; FAQs concerning photoresists (Allresist, 03.03.2016) — Question 9, p.8; Question 10, p.10
AR-P 3510T structures round off during a hot process step — how hot can it go?
The AR-P 3500 (T) series is rated temperature-stable up to 120 °C, and its glass transition temperature is listed at 108 °C. The optional post-bake is 115 °C for 1 min on a hotplate, or 25 min in a convection oven. The datasheet illustrates the risk with AR-P 3540 structures shown unbaked and after 140 °C tempering on a hotplate. If a later step runs hotter than about 120 °C, expect profile rounding and plan the thermal budget around it.
SOURCE: AR-P 3500 / 3500 T product information (Allresist, as of…
AR-P 3500 / 3500 T product information (Allresist, as of January 2014) — Characterisation, Properties II and Temperature stability figure, p.22; Process conditions: Post-bake, p.23
My AR-P 3510T thickness shifts between coating days — what should I check?
Humidity and solvent loss. Allresist's humidity study on the base AR-P 3510 grade shows film thickness falling steadily as relative humidity rises, so coat in a humidity-controlled room. Repeatedly opening the bottle evaporates solvent and thickens the film. Let a refrigerated bottle reach room temperature before opening, or moisture condenses on the resist. The datasheet reference coat is 4000 rpm for 60 s to 2.0 µm, followed by a 100 °C / 1 min hotplate softbake held to ±1 °C.
SOURCE: FAQs concerning photoresists (Allresist, 03.03.2016) —…
FAQs concerning photoresists (Allresist, 03.03.2016) — Questions 2 and 6, pp.3, 5–6; AR-P 3500 / 3500 T product information (Allresist, as of January 2014) — Properties I and Process conditions, pp.22–23
AR-P 3510T lifts off SiO2 or gold during develop or wet etch — what's the fix?
Prime the surface. Allresist lists AR 300-80 as the adhesion promoter for this series; per its FAQ, adhesion promoters are absolutely required on SiO2, glass, gold, silver and GaAs, where resist adhesion is inherently weaker. It is spun on as a roughly 15 nm layer just before coating; vapour HMDS is the alternative. Dry new wafers on a hotplate first, clean used ones in acetone followed by isopropanol or ethanol, and avoid coating above 60 % relative humidity, which substantially reduces adhesion.
SOURCE: AR-P 3500 / 3500 T product information (Allresist, as of…
AR-P 3500 / 3500 T product information (Allresist, as of January 2014) — Process chemicals, p.22; FAQs concerning photoresists (Allresist, 03.03.2016) — Questions 4–5, pp.4–5
Sources & disclaimer
- Allresist — AR-P 3510T datasheet (As of January 2014) · accessed 2026-07-10
- https://www.allresist.com/portfolio-item/developer-ar-300-44/ — Allresist's own product page for developer AR 300-44: gives its main component as TMAH and its metal-ion content as under 0.1 ppm. Read together with the AR 300-26 page (sodium borate / sodium hydroxide) and the AR 300-35 page (sodium metasilicate / phosphate), it establishes that the developers this resist's own "Development recommendations" table offers span both a metal-ion-free and a metal-ion-containing chemistry.
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-09-28.