https://nanyte.com/photoresists/kmpr-1025 · last updated 2026-09-12
- Manufacturer
- Kayaku Advanced Materials
- Tone
- negative
- Chemistry
- Epoxy (SU-8 type)
- Thickness
- 21.5–87 µm
- Developer
- 2.38 % TMAH (0.26 N) aqueous alkaline developer; SU-8 developer (solvent) may be used instead
- Applications
- High aspect ratio · MEMS structural · Electroplating / molding · Etch mask
Cross-checked — two independent extractions agree on the spin curve and the single-value figures.
- Substrate
- Resist
- Exposed
Spin coating
Data points
| Series | rpm | µm | Published dose |
|---|---|---|---|
| KMPR 1025 | 1000 | 87 | — |
| 2000 | 43 | 665–1055 mJ/cm² · 31–55 µm row | |
| 3000 | 29 | 500–645 mJ/cm² · 21–30 µm row 665–1055 mJ/cm² · 31–55 µm row within 10 % of a bracket edge | |
| 4000 | 22 | 500–645 mJ/cm² · 21–30 µm row within 10 % of a bracket edge |
Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool. Series digitized from a published figure are approximate (±10 %).
Published dose is the datasheet’s own thickness bracket, quoted as printed — the full table and its citation are in the exposure section. A thickness the table does not cover shows nothing, and a thickness within 10 % of a bracket edge shows every bracket it could fall in.
read from figure — the filled-diamond trace legended KMPR 1025 on Figure 1, 'KMPR 1000 Thickness vs. Spin Speed', p.2, the second-highest of the five traces. Four plotted markers; no numeric table accompanies the chart.
- The steepest useful trace on the chart: 87 µm at 1000 rpm halves to 42.5 µm by 2000 rpm, then falls to 28.5 and 21.5 µm.
- Thickness is therefore very sensitive to speed at the slow end, and a target above about 60 µm is worth confirming on a test wafer rather than reading off the curve.
- Table 1 puts this grade at 64 % solids and 5200 cSt.
- The recommended program is a 500 rpm / 5-10 s spread at 100 rpm/s acceleration, then 30 s at the final speed at 300 rpm/s, dispensing 1 ml of resist per inch of substrate diameter.
- Adhesion
- HMDS recommended — Adhesion promoters are described as typically unnecessary; substrates should be clean and dry, ideally after a piranha clean and a de-ionized water rinse, or an O2 RIE/barrel-asher clean.
Soft bake
- Soft bake
- 100 °C (95–105 °C) · hotplate
- Notes
- 100 °C on a level hotplate, with 95-105 °C also usable. Convection ovens are advised against — a skin forms and traps solvent in the film.
SOURCE: Soft Bake section and Table 2, p.2 of the KMPR 1000 datasheet (Ver. 6, December 2019)
Exposure dose
KMPR 1025's dose is published against film thickness, not as a single number. Read the row for the film you coat and run a dose array around it.
- As published
- Dose follows the coating rather than the grade, and across this grade's range that is a three-fold spread: 500-645 mJ/cm² at 21-30 µm rising to 1070-1465 mJ/cm² at 56-80 µm, with nothing published above 80 µm.
- Post-exposure bake
- 100 °C (95–105 °C) · hotplate
| Film thickness | Dose |
|---|---|
| 21–30 µm | 500–645 mJ/cm² |
| 31–55 µm | 665–1055 mJ/cm² |
| 56–80 µm | 1070–1465 mJ/cm² |
SOURCE: KMPR 1000 datasheet
Table 3 'Exposure Dose' of the KMPR 1000 datasheet (Ver. 6). The three bins carried here are the ones this grade's thickness range crosses; the table's top bin ends at 80 µm, below the 87 µm this grade reaches at 1000 rpm. The table is not attributed to a specific wavelength.
Development
- Developer
- 2.38 % TMAH (0.26 N) aqueous alkaline developer; SU-8 developer (solvent) may be used instead
- Method
- immersion, spray or spray-puddle
- Rinse
- After TMAH, spray rinse with de-ionized water for 20 s and blow dry with filtered air or nitrogen.
- Developer family
- TMAH or solvent
Not published for this resist: Dilution, Time — characterize on-tool.
SOURCE: Development and Rinse and Dry sections with Tables 6 and 7, p.3-4 of the KMPR 1000 datasheet (Ver. 6, December 2019)
Hard bake, etch & strip
- Hard bake
- Not published — characterize on-tool
- Descum
- RIE, 2 min at 100 W with 10 sccm O2 at 100 mTorr — quoted as step 3 of the datasheet's plating sequence.
- Etch resistance
- "Excellent dry etch resistance" (Features, p.1); the series is positioned for DRIE work, and the datasheet's own example shows 10 µm features etched to 65 µm deep.
- Stripper
- Remover PG (NMP) at 80 °C for 10-20 min by immersion, provided the film was never hard baked — at this thickness expect the longer end, and ultrasound helps.
- Storage
- Store frozen at -10 °C (14 °F) in tightly closed upright containers, away from light, heat, acids and ignition sources.
Where it's used
Practical notes from the datasheet
KMPR 1025 sits in the tens-of-microns band of Kayaku's chemically amplified epoxy negative series — thick enough for copper pillar moulds and deep etch masks, and the grade the datasheet's own plating example is built around. What changes at this thickness is that every process number stretches: the soft bake runs 12 to 20 minutes depending on where in the range you coat, the clearing dose spans 500 to 1465 mJ/cm², and TMAH development takes 6 to 8 minutes rather than the 3 a thin film needs. None of those are grade properties; they are thickness properties, and the datasheet tabulates them that way. Worth knowing before working at the thick end: the spin curve reaches 87 µm at 1000 rpm, but the soft-bake, dose and develop tables all stop at 80 µm, so the top of this grade's coating range has no published process at all and has to be characterised on-tool. Two other cautions carry weight here. Reflective substrates raise the dose by 1.5-2×, and plating work almost always means a metal seed layer, so a dose set on bare silicon will under-expose on copper. And hard baking is explicitly not recommended for plating resistance — an un-hard-baked film swells and lifts cleanly in Remover PG at 80 °C, while a baked one fights removal at exactly the thickness where removal is already slowest.
Grades in this family
Other grades in the KMPR 1000 series line differ mainly in coating thickness:
Sources & disclaimer
- Kayaku Advanced Materials — KMPR 1025 datasheet (Ver. 6, December 2019 (printed in the footer of every page)) · accessed 2026-09-10
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-09-12.