https://nanyte.com/photoresists/kmpr-1015 · last updated 2026-09-12
- Manufacturer
- Kayaku Advanced Materials
- Tone
- negative
- Chemistry
- Epoxy (SU-8 type)
- Thickness
- 12.5–40 µm
- Developer
- 2.38 % TMAH (0.26 N) aqueous alkaline developer; SU-8 developer (solvent) may be used instead
- Applications
- High aspect ratio · MEMS structural · Electroplating / molding · Etch mask
Cross-checked — two independent extractions agree on the spin curve and the single-value figures.
- Substrate
- Resist
- Exposed
Spin coating
Data points
| Series | rpm | µm | Published dose |
|---|---|---|---|
| KMPR 1015 | 1000 | 40 | 665–1055 mJ/cm² · 31–55 µm row |
| 2000 | 22 | 355–485 mJ/cm² · 12–20 µm row 500–645 mJ/cm² · 21–30 µm row within 10 % of a bracket edge | |
| 3000 | 16 | 355–485 mJ/cm² · 12–20 µm row | |
| 4000 | 13 | 355–485 mJ/cm² · 12–20 µm row within 10 % of a bracket edge |
Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool. Series digitized from a published figure are approximate (±10 %).
Published dose is the datasheet’s own thickness bracket, quoted as printed — the full table and its citation are in the exposure section. A thickness the table does not cover shows nothing, and a thickness within 10 % of a bracket edge shows every bracket it could fall in.
read from figure — the filled-triangle trace legended KMPR 1015 on Figure 1, 'KMPR 1000 Thickness vs. Spin Speed', p.2, the middle of the five traces. Four plotted markers; no numeric table accompanies the chart.
- The curve halves across the first half of the sweep — 40 µm at 1000 rpm to 21.5 µm at 2000 — then eases to 16 and 12.5 µm at 3000 and 4000 rpm.
- Its trace runs close to KMPR 1010's at the fast end, where the two overlap around 12-15 µm, so in that band the choice between them is really about which grade's slower spin gives the better uniformity.
- Table 1 puts this grade at 60 % solids and 1900 cSt.
- The recommended program is a 500 rpm / 5-10 s spread at 100 rpm/s acceleration, then 30 s at the final speed at 300 rpm/s, dispensing 1 ml of resist per inch of substrate diameter.
- Adhesion
- HMDS recommended — Adhesion promoters are described as typically unnecessary; substrates should be clean and dry, ideally after a piranha clean and a de-ionized water rinse, or an O2 RIE/barrel-asher clean.
Soft bake
- Soft bake
- 100 °C (95–105 °C) · hotplate
- Notes
- 100 °C on a level hotplate, with 95-105 °C also usable. Convection ovens are advised against — a skin forms and traps solvent in the film.
SOURCE: Soft Bake section and Table 2, p.2 of the KMPR 1000 datasheet (Ver. 6, December 2019)
Exposure dose
KMPR 1015's dose is published against film thickness, not as a single number. Read the row for the film you coat and run a dose array around it.
- As published
- Dose is published against film thickness rather than against the grade, so it follows the coating: 355-485 mJ/cm² at 12-20 µm, 500-645 at 21-30 and 665-1055 at 31-55.
- Post-exposure bake
- 100 °C (95–105 °C) · hotplate
| Film thickness | Dose |
|---|---|
| 12–20 µm | 355–485 mJ/cm² |
| 21–30 µm | 500–645 mJ/cm² |
| 31–55 µm | 665–1055 mJ/cm² |
SOURCE: KMPR 1000 datasheet
Table 3 'Exposure Dose' of the KMPR 1000 datasheet (Ver. 6). The three bins carried here are the ones this grade's thickness range crosses. The table is not attributed to a specific wavelength.
Development
- Developer
- 2.38 % TMAH (0.26 N) aqueous alkaline developer; SU-8 developer (solvent) may be used instead
- Method
- immersion, spray or spray-puddle
- Rinse
- After TMAH, spray rinse with de-ionized water for 20 s and blow dry with filtered air or nitrogen.
- Developer family
- TMAH or solvent
Not published for this resist: Dilution, Time — characterize on-tool.
SOURCE: Development and Rinse and Dry sections with Tables 6 and 7, p.3-4 of the KMPR 1000 datasheet (Ver. 6, December 2019)
Hard bake, etch & strip
- Hard bake
- Not published — characterize on-tool
- Descum
- RIE, 2 min at 100 W with 10 sccm O2 at 100 mTorr — quoted as step 3 of the datasheet's plating sequence.
- Etch resistance
- "Excellent dry etch resistance" (Features, p.1); the series is positioned for DRIE work, and the datasheet's own example shows 10 µm features etched to 65 µm deep.
- Stripper
- Remover PG (NMP) at 80 °C for 10-20 min by immersion, provided the film was never hard baked.
- Storage
- Store frozen at -10 °C (14 °F) in tightly closed upright containers, away from light, heat, acids and ignition sources.
Where it's used
Practical notes from the datasheet
KMPR 1015 fills the middle of Kayaku's chemically amplified epoxy negative line, coating 12.5 to 40 µm where 1010 stops near 27 and 1025 starts around 21. It is a grade that only exists in the current revision of the datasheet — the older Ver. 4.2 line ran 1005, 1010, 1025 and 1050 — so a process written against an older sheet will not mention it. The series is built for thick, vertical-walled masks that survive plating baths and dry etching and then strip cleanly, which is the practical distinction from SU-8. As everywhere in this line, the process numbers key to film thickness rather than to the grade, so choosing 1015 mainly decides which rows of those tables apply: across its range that means a 7, 12 or 15 min soft bake, 355-1055 mJ/cm², a 2 or 3 min post-exposure bake and 5-6 min in TMAH. The post-exposure bake is where cross-linking happens and is not optional, and hard baking is explicitly discouraged for plating work because an un-hard-baked film is the one that strips.
Grades in this family
Other grades in the KMPR 1000 series line differ mainly in coating thickness:
Sources & disclaimer
- Kayaku Advanced Materials — KMPR 1015 datasheet (Ver. 6, December 2019 (printed in the footer of every page)) · accessed 2026-09-10
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-09-12.