https://nanyte.com/photoresists/kmpr-1035 · last updated 2026-09-12
- Manufacturer
- Kayaku Advanced Materials
- Tone
- negative
- Chemistry
- Epoxy (SU-8 type)
- Thickness
- 28–115 µm
- Developer
- 2.38 % TMAH (0.26 N) aqueous alkaline developer; SU-8 developer (solvent) may be used instead
- Applications
- High aspect ratio · MEMS structural · Electroplating / molding · Etch mask
Cross-checked — two independent extractions agree on the spin curve and the single-value figures.
- Substrate
- Resist
- Exposed
Spin coating
Data points
| Series | rpm | µm | Published dose |
|---|---|---|---|
| KMPR 1035 | 1000 | 115 | — |
| 2000 | 56 | — | |
| 3000 | 37 | 665–1055 mJ/cm² · 31–55 µm row | |
| 4000 | 28 | 500–645 mJ/cm² · 21–30 µm row within 10 % of a bracket edge |
Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool. Series digitized from a published figure are approximate (±10 %).
Published dose is the datasheet’s own thickness bracket, quoted as printed — the full table and its citation are in the exposure section. A thickness the table does not cover shows nothing, and a thickness within 10 % of a bracket edge shows every bracket it could fall in.
read from figure — the filled-square trace legended KMPR 1035 on Figure 1, 'KMPR 1000 Thickness vs. Spin Speed', p.2, the highest of the five traces. Four plotted markers; no numeric table accompanies the chart.
- The steepest trace on the chart by a wide margin: 115 µm at 1000 rpm less than halves to 55.5 µm at 2000, then falls to 36.5 and 28 µm.
- Thickness is therefore extremely sensitive to speed at the slow end, and the 1000 rpm point also sits above the 110 µm the datasheet quotes as the series maximum — treat anything past about 80 µm as a target to establish on a test wafer, not to read off a curve.
- Table 1 puts this grade at 65 % solids and 8400 cSt, the most viscous in the line.
- The recommended program is a 500 rpm / 5-10 s spread at 100 rpm/s acceleration, then 30 s at the final speed at 300 rpm/s, dispensing 1 ml of resist per inch of substrate diameter.
- Adhesion
- HMDS recommended — Adhesion promoters are described as typically unnecessary; substrates should be clean and dry, ideally after a piranha clean and a de-ionized water rinse, or an O2 RIE/barrel-asher clean.
Soft bake
- Soft bake
- 100 °C (95–105 °C) · hotplate
- Notes
- 100 °C on a level hotplate, with 95-105 °C also usable.
SOURCE: Soft Bake section and Table 2, p.2 of the KMPR 1000 datasheet (Ver. 6, December 2019)
Exposure dose
KMPR 1035's dose is published against film thickness, not as a single number. Read the row for the film you coat and run a dose array around it.
- As published
- Dose follows the coating rather than the grade: 500-645 mJ/cm² at 21-30 µm rising to 1070-1465 mJ/cm² at 56-80 µm, with nothing published above 80 µm — which on this grade means no published dose for anything coated slower than roughly 1500 rpm.
- Post-exposure bake
- 100 °C (95–105 °C) · hotplate
| Film thickness | Dose |
|---|---|
| 21–30 µm | 500–645 mJ/cm² |
| 31–55 µm | 665–1055 mJ/cm² |
| 56–80 µm | 1070–1465 mJ/cm² |
SOURCE: KMPR 1000 datasheet
Table 3 'Exposure Dose' of the KMPR 1000 datasheet (Ver. 6). The three bins carried here are the ones this grade's thickness range crosses; the table's top bin ends at 80 µm, well below the 115 µm this grade reaches at 1000 rpm. The table is not attributed to a specific wavelength.
Development
- Developer
- 2.38 % TMAH (0.26 N) aqueous alkaline developer; SU-8 developer (solvent) may be used instead
- Method
- immersion, spray or spray-puddle
- Rinse
- After TMAH, spray rinse with de-ionized water for 20 s and blow dry with filtered air or nitrogen.
- Developer family
- TMAH or solvent
Not published for this resist: Dilution, Time — characterize on-tool.
SOURCE: Development and Rinse and Dry sections with Tables 6 and 7, p.3-4 of the KMPR 1000 datasheet (Ver. 6, December 2019)
Hard bake, etch & strip
- Hard bake
- Not published — characterize on-tool
- Descum
- RIE, 2 min at 100 W with 10 sccm O2 at 100 mTorr — quoted as step 3 of the datasheet's plating sequence.
- Etch resistance
- "Excellent dry etch resistance" (Features, p.1); the series is positioned for DRIE work, and the datasheet's own example shows 10 µm features etched to 65 µm deep.
- Stripper
- Remover PG (NMP) at 80 °C for 10-20 min by immersion, provided the film was never hard baked — on the thickest grade in the line expect the long end and use ultrasound.
- Storage
- Store frozen at -10 °C (14 °F) in tightly closed upright containers, away from light, heat, acids and ignition sources.
Where it's used
Practical notes from the datasheet
KMPR 1035 is the thickest and most viscous grade in Kayaku's chemically amplified epoxy negative line, reaching over 100 µm in a single coat — the regime of tall copper pillars and deep DRIE masks. It replaced KMPR 1050 in the current revision of the datasheet, which is the first thing to check if you are working from an older process: 1050 no longer appears, and 1035 is thinner at the same spin speed. The honest caution on this grade is where the published process runs out. Its curve reaches 115 µm at 1000 rpm, but the soft-bake, exposure and develop tables all stop at 80 µm, so above that there is no published bake time, no clearing dose and no develop time — only the post-exposure bake table, whose top row is open-ended, still applies. In practice that means the curve crosses 80 µm at roughly 1500 rpm, so anything coated slower than that has to be characterised on-tool. Below 80 µm the rest of the series discipline holds: the post-exposure bake is where cross-linking happens and is not optional, reflective substrates need 1.5-2× the dose, and hard baking is discouraged because an un-hard-baked film is the one that strips in Remover PG.
Grades in this family
Other grades in the KMPR 1000 series line differ mainly in coating thickness:
Sources & disclaimer
- Kayaku Advanced Materials — KMPR 1035 datasheet (Ver. 6, December 2019 (printed in the footer of every page)) · accessed 2026-09-10
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-09-12.