https://nanyte.com/photoresists/lor-7b · last updated 2026-09-12
- Manufacturer
- MicroChem (MCC) — now Kayaku Advanced Materials
- Tone
- Not photoimageable (underlayer)
- Chemistry
- Ancillary (not photoimageable)
- Thickness
- 0.3–0.9 µm
- Exposure dose
- Not exposed — dissolves in developer
- Developer
- No specific commercial developer product is named for this grade; the datasheet states LOR/PMGI is compatible with both metal-ion-free (TMAH) and metal-ion-bearing developer chemistries.
- Applications
- Lift-off
Cross-checked — two independent extractions agree on the spin curve and the single-value figures.
- Substrate
- Underlayer
- Resist
- Exposed
Spin coating
Data points
| Series | rpm | µm |
|---|---|---|
| LOR 7B | 1000 | 0.90 |
| 1500 | 0.72 | |
| 2000 | 0.57 | |
| 2500 | 0.44 | |
| 3000 | 0.39 | |
| 3500 | 0.34 | |
| 4000 | 0.32 |
Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool. Series digitized from a published figure are approximate (±10 %).
read from figure — the dark-blue filled-circle trace legended LOR 7B on the 'Thickness vs. Spin Speed - LOR B Thick Series' chart, p.5. Seven plotted markers at 500 rpm intervals; no numeric table accompanies the chart.
- The lowest trace on the B-series chart, falling from 9,000 Å at 1000 rpm to 3,200 Å at 4000 rpm — a factor of nearly three, so speed is a real lever across this grade's whole range, unlike the thicker B grades whose curves flatten early.
- Most of that fall happens below 2500 rpm.
- Coating parameters are published for the product line rather than per grade: 5 ml dispensed dynamically over 3-5 s onto a 150 mm wafer at 300-500 rpm, 10,000 rpm/s acceleration to a 3,000 rpm terminal speed, 45 s spin, with EBR PG for edge-bead and whisker removal.
- A substrate of irregular shape needs a slower spin for an even coat.
- Adhesion
- HMDS not required — "Primers, such as HMDS, are typically not required" when LOR/PMGI is used as recommended; the datasheet describes excellent adhesion across semiconductor substrates.
Soft bake
- Soft bake
- Not published — characterize on-tool
- Notes
- The prebake does two jobs — it dries the film and it fixes the dissolution and undercut rate — and no grade-specific temperature or time is published.
SOURCE: "Soft-Bake/Prebake Process" section and Figures 5a-5b, Kayaku…
"Soft-Bake/Prebake Process" section and Figures 5a-5b, Kayaku "LOR and PMGI Resists" technical data sheet, Rev. D (August 2023)
Exposure
LOR 7B is not photoimageable. It is not exposed at all — it is coated beneath an imaged top resist and undercut laterally during development. See the development step below.
Development
- Developer
- No specific commercial developer product is named for this grade; the datasheet states LOR/PMGI is compatible with both metal-ion-free (TMAH) and metal-ion-bearing developer chemistries.
- Developer family
- TMAH or buffered alkaline
Not published for this resist: Dilution, Time, Method, Rinse — characterize on-tool.
SOURCE: Product description, the LOR/PMGI process-flow section and the…
Product description, the LOR/PMGI process-flow section and the product selection guide, Kayaku "LOR and PMGI Resists" technical data sheet, Rev. D (August 2023)
Hard bake, etch & strip
- Stripper
- Remover PG. EBR PG removes edge beads and whiskers and is also an effective spin-bowl cleaner and a rework solvent for unbaked wafers.
- Storage
- Store upright in original sealed containers in a dry area between 4 and 27 °C (40-80 °F), away from ignition sources, light, heat, oxidants, acids and reducers. Do not use after the expiration date.
Not published for this resist: Hard bake, Descum, Etch resistance — characterize on-tool.
Where it's used
Practical notes from the datasheet
LOR 7B is a PMGI-based sacrificial underlayer from the fast-dissolving B series, spun beneath a conventional photoresist and never exposed itself. The A, B and C series are the same polymer family tuned to different dissolution rates: a B grade opens its undercut faster than an A grade for the same prebake and develop. That is what you want when the deposited film is thick enough to need a generous ledge to break at, and what you do not want when the feature is fine and the undercut would run under it. What makes this grade the useful end of the B line is that it stays sub-micron — 0.32 to 0.90 µm — so you get B-series speed at a thickness the 10B, 15B, 20B and 30B grades would overshoot. Everything that sets the final ledge is a process variable rather than a product property: prebake temperature first, then develop time, then the developer and develop mode. Nothing here is exposed, so there is no dose, no tone and no post-exposure bake.
Grades in this family
Other grades in the LOR B series line differ mainly in coating thickness:
Sources & disclaimer
- MicroChem (MCC) — now Kayaku Advanced Materials — LOR 7B datasheet (Rev. D, August 2023 (printed in the footer of every page)) · accessed 2026-09-10
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-09-12.