https://nanyte.com/photoresists/lor-30b · last updated 2026-09-12
- Manufacturer
- MicroChem (MCC) — now Kayaku Advanced Materials
- Tone
- Not photoimageable (underlayer)
- Chemistry
- Ancillary (not photoimageable)
- Thickness
- 1.6–4.3 µm
- Exposure dose
- Not exposed — dissolves in developer
- Developer
- No specific commercial developer product is named for this grade; the datasheet states LOR/PMGI is compatible with both metal-ion-free (TMAH) and metal-ion-bearing developer chemistries.
- Applications
- Lift-off
Cross-checked — two independent extractions agree on the spin curve and the single-value figures.
- Substrate
- Underlayer
- Resist
- Exposed
Spin coating
Data points
| Series | rpm | µm |
|---|---|---|
| LOR 30B | 1000 | 4.3 |
| 1500 | 3.2 | |
| 2000 | 2.6 | |
| 2500 | 2.1 | |
| 3000 | 1.9 | |
| 3500 | 1.7 | |
| 4000 | 1.6 |
Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool. Series digitized from a published figure are approximate (±10 %).
read from figure — the purple cross-marker trace legended LOR 30B on the 'Thickness vs. Spin Speed - LOR B Thick Series' chart, p.5, the highest of the five traces. Seven plotted markers at 500 rpm intervals; no numeric table accompanies the chart.
- The topmost trace on the B-series chart and the steepest at the slow end: 43,500 Å at 1000 rpm drops to 25,800 Å by 2000 rpm, then flattens toward 16,000 Å at 4000 rpm.
- Reaching the top of the range means spinning slowly, where thickness is most sensitive to speed and to dispense, so a target above about 4 µm is worth confirming on a test wafer rather than reading off the chart.
- Coating parameters are published for the product line rather than per grade: 5 ml dispensed dynamically over 3-5 s onto a 150 mm wafer at 300-500 rpm, 10,000 rpm/s acceleration to a 3,000 rpm terminal speed, 45 s spin, with EBR PG for edge-bead and whisker removal.
- Adhesion
- HMDS not required — "Primers, such as HMDS, are typically not required" when LOR/PMGI is used as recommended; the datasheet describes excellent adhesion across semiconductor substrates.
Soft bake
- Soft bake
- Not published — characterize on-tool
- Notes
- The prebake dries the film and fixes its dissolution and undercut rate, and no grade-specific temperature or time is published.
SOURCE: "Soft-Bake/Prebake Process" section and Figures 5a-5b, Kayaku…
"Soft-Bake/Prebake Process" section and Figures 5a-5b, Kayaku "LOR and PMGI Resists" technical data sheet, Rev. D (August 2023)
Exposure
LOR 30B is not photoimageable. It is not exposed at all — it is coated beneath an imaged top resist and undercut laterally during development. See the development step below.
Development
- Developer
- No specific commercial developer product is named for this grade; the datasheet states LOR/PMGI is compatible with both metal-ion-free (TMAH) and metal-ion-bearing developer chemistries.
- Developer family
- TMAH or buffered alkaline
Not published for this resist: Dilution, Time, Method, Rinse — characterize on-tool.
SOURCE: Product description, the LOR/PMGI process-flow section and the…
Product description, the LOR/PMGI process-flow section and the product selection guide, Kayaku "LOR and PMGI Resists" technical data sheet, Rev. D (August 2023)
Hard bake, etch & strip
- Stripper
- Remover PG — expect the long end of any strip time at this thickness.
- Storage
- Store upright in original sealed containers in a dry area between 4 and 27 °C (40-80 °F), away from ignition sources, light, heat, oxidants, acids and reducers. Do not use after the expiration date.
Not published for this resist: Hard bake, Descum, Etch resistance — characterize on-tool.
Where it's used
Practical notes from the datasheet
LOR 30B is the thickest sacrificial underlayer in the B series, a PMGI-based film spun beneath a conventional photoresist and never exposed. The reasoning for reaching this far up the range is geometric: a lift-off works when the metal on the substrate and the metal on top of the imaging resist never join, so the underlayer has to be comfortably thicker than the film being deposited, and below that it tears rather than releases. Going thicker than needed is not free — a fast-dissolving B-series film keeps undercutting for as long as the develop runs, and on a 4 µm coat that ledge can travel a long way, which is why the thick-film examples in this datasheet are drawn with features measured in tens of microns rather than fractions of one. Worth knowing before specifying it: the current revision also offers a C series reaching comparable thicknesses at a different dissolution rate, so thickness alone no longer picks the grade.
Grades in this family
Other grades in the LOR B series line differ mainly in coating thickness:
Sources & disclaimer
- MicroChem (MCC) — now Kayaku Advanced Materials — LOR 30B datasheet (Rev. D, August 2023 (printed in the footer of every page)) · accessed 2026-09-10
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-09-12.