https://nanyte.com/photoresists/mr-dwl-100 · last updated 2026-10-15
- Manufacturer
- micro resist technology GmbH
- Tone
- negative
- Thickness
- 20–150 µm
- Applications
- Etch mask · Electroplating / molding · General prototyping · High aspect ratio
Cross-checked — the spin curve (where published) and the single-value figures were read twice, independently, from the datasheet, with any disagreement settled against it.
- Substrate
- Resist
- Exposed
Spin coating
Data points
| Series | rpm | µm |
|---|---|---|
| mr-DWL 100, 60 s | 1500 | 98 |
| 2000 | 72 | |
| 2500 | 55 | |
| 3000 | 45 | |
| 4000 | 33 | |
| 5000 | 26 | |
| 6000 | 21 |
Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool. Series digitized from a published figure are approximate (±10 %).
read from figure — the spin-speed chart on p.1 of the mr-DWL series sheet (film thickness 0–130 µm vs spin speed, linear axes, 750–6000 rpm), trace identified by legend as the thin blue line 'mr-DWL 100, 60 s', the highest curve on the chart. The trace carries no point markers, so values were read where the line crosses the labelled rpm gridlines, within about ±1.5 µm (the line is thin and steep at the left), and never beyond the plotted span: the trace enters the chart at the 130 µm top edge near 1100 rpm and ends at 6000 rpm.
- The chart gives the spin time with the curve — 60 s for this grade — and nothing else about coating: no dispense volume, acceleration, edge-bead step or substrate preparation.
- The curve leaves the top of the chart (130 µm) near 1100 rpm, so the upper end of the stated 20–150 µm window lies below the speeds plotted and has to be found on your coater.
- At 6000 rpm the curve reads about 21 µm, essentially at the 20 µm floor, so this grade cannot go thinner by spinning faster.
- Measure film thickness before fixing a recipe.
- Adhesion
- Not addressed on the sheet.
Soft bake
- Soft bake
- Not published — characterize on-tool
Exposure dose
mr-DWL is built for 405 nm laser writing and rated highly sensitive above 400 nm, but the sheet prints no dose at any wavelength, so plan a dose matrix on your own writer. Run a dose array on your own tool to land the working dose.
Not published for this resist: Dose at 365 nm, Dose at 405 nm — characterize on-tool.
Development
Not published for this resist: Developer, Dilution, Time, Method, Rinse — characterize on-tool.
Hard bake, etch & strip
- Etch resistance
- The sheet lists high wet and dry etch stability and names use as an etch mask for wet and dry etch processes. No etch rates are published.
Not published for this resist: Hard bake, Descum, Stripper, Storage — characterize on-tool.
Where it's used
Practical notes from the datasheet
mr-DWL 100 is the thickest of the three mr-DWL grades, listed for 20–150 µm. The sheet shows a laser-written structure in a 150 µm film with an aspect ratio of at least 10, credited to Heidelberg Instruments, which is the only high-aspect-ratio claim on the page and the reason this grade carries that tag. The series is described as negative-tone and designed for exposure above 400 nm, usable for direct laser writing at 405 nm and for two-photon polymerization, with high sensitivity and good thermal and chemical stability. Listed uses are fast contactless prototyping, an etch mask for wet and dry processes, a mould for electroplating, a master for stamp fabrication by thermal or UV moulding, and optical parts in microsystems. The sheet is a single page: it gives the film-thickness window for each grade and one spin chart, and stops there. Soft bake, exposure dose, post-exposure bake and developer are not on it, so those steps have to be established on the tool, and thick films will need them tuned at the thickness actually coated.
Grades in this family
Other grades in the mr-DWL series line differ mainly in coating thickness:
Troubleshooting
Common failure modes for mr-DWL 100, answered from the manufacturer's datasheet and application notes. These are starting points — your substrate, tooling and environment shift the specifics, so calibrate on-tool.
Can I coat mr-DWL 100 below 20 µm by spinning faster?
Not on this sheet's evidence. The 60 s curve is down to about 21 µm at 6000 rpm, the highest speed plotted, and the sheet lists 20 µm as the lower end of the grade. For thinner films the series offers mr-DWL 5 (3–12 µm) and mr-DWL 40 (20–100 µm); nothing is listed between 12 and 20 µm.
SOURCE: mr-DWL series sheet (micro resist technology GmbH, document…
mr-DWL series sheet (micro resist technology GmbH, document code ls.19.08.02) — Technical data table and spin-speed chart, p.1
Sources & disclaimer
- micro resist technology GmbH — mr-DWL 100 datasheet (Document code ls.19.08.02 printed on the sheet; no calendar date is printed) · accessed 2026-10-15
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-10-15.