https://nanyte.com/photoresists/mr-dwl-40 · last updated 2026-07-12
- Manufacturer
- micro resist technology GmbH
- Tone
- negative
- Chemistry
- Epoxy (SU-8 type)
- Thickness
- 20–100 µm
- Developer
- mr-Dev 600
- Applications
- Etch mask · Electroplating / molding · General prototyping · MEMS structural
Unverified — not yet human-checked; values transcribed from the datasheet, characterize on-tool.
Spin coating
The manufacturer does not publish a spin curve for mr-DWL 40. No spin-speed-vs-thickness table or figure is published for mr-DWL anywhere in this flyer — only the stated achievable film-thickness range per grade (see thicknessRange). No accel, dispense, or edge-bead guidance is given either. This is expected: the source is a multi-series marketing flyer, not a technical datasheet.
- Adhesion
- HMDS not required — Not addressed in this flyer.
Soft bake
- Soft bake
- Not published — characterize on-tool
Exposure dose
The manufacturer does not publish a clearing dose for mr-DWL 40. Determine it with a dose array on your own tool.
- As published
- 'Spectral sensitivity: High sensitivity > 400 nm, DLW @ 405 nm' (mr-DWL table, p.4). mr-DWL is explicitly marketed for 405 nm direct laser writing.
Not published for this resist: Dose at 365 nm, Dose at 405 nm — characterize on-tool.
Development
- Developer
- mr-Dev 600
- Developer family
- Solvent
Not published for this resist: Dilution, Time, Method, Rinse — characterize on-tool.
SOURCE: mr-DWL table, p.4 of Negative Photoresists flyer
Hard bake, etch & strip
- Etch resistance
- "Etch mask for wet and dry etch processes" (Main applications, mr-DWL section, p.4).
Not published for this resist: Hard bake, Descum, Stripper, Storage — characterize on-tool.
Where it's used
mr-DWL 40 is the mid-thickness grade of micro resist technology's mr-DWL negative-tone resist series, formulated for 405 nm exposure in direct laser writing (DLW) and two-photon polymerization (2PP) tools, and sold ready-to-use for coatings from 20 to 100 µm. The only source retrievable for this SKU is a multi-series marketing flyer rather than a full technical datasheet, so process parameters a TDS would normally publish — softbake, exposure dose, post-exposure bake, and a spin-speed-vs-thickness curve — are not stated here and are left null rather than estimated; mr-DWL's own TDS is served behind a non-guessable microresist.de download link and was not retrievable. The flyer names mr-Dev 600 as the developer (solvent-based) but gives no dilution, time, or method. Because mr-DWL is marketed specifically for 405 nm direct-write exposure, its h-line dose could in principle be the operationally relevant one, but no dose value in mJ/cm² is published for this SKU in this document, so exposureDose stays fully null rather than being backfilled from the 365 nm conventions used elsewhere in this library. Chemistry classified as epoxy from microresist.de's description of mr-DWL as chemically amplified negative tone sharing SU-8's advantageous properties, corroborated by peer-reviewed literature grouping SU-8 and mr-DWL as epoxy-based photoresists (chemistry classified 2026-07-12 from manufacturer SDS/TDS).
Sources & disclaimer
- micro resist technology GmbH — mr-DWL 40 datasheet (August 2022) · accessed 2026-07-10
- https://microresist.de/en/produkt/mr-dwl-series/ — microresist.de describes mr-DWL as 'chemically amplified negative tone... shares several advantageous properties with SU-8', and peer-reviewed literature groups 'epoxy-based photoresists SU-8 and mr-DWL' together; the basis for classifying mr-DWL 40 as epoxy.
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-07-12.