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mr-DWL 5 process recipe

The thin grade of micro resist technology's mr-DWL negative-tone series, made for 405 nm direct laser writing and two-photon polymerization: 3–12 µm films on the sheet's table, with a 30 s spin curve that falls from about 14 µm at 1000 rpm to under 3 µm at 6000 rpm.

https://nanyte.com/photoresists/mr-dwl-5 · last updated 2026-10-15

At a glance
Download PDF
Manufacturer
micro resist technology GmbH
Tone
negative
Thickness
3–12 µm
Applications
Etch mask · Electroplating / molding · General prototyping

Cross-checked — the spin curve (where published) and the single-value figures were read twice, independently, from the datasheet, with any disagreement settled against it.

  1. Coat
    3–12 µm
  2. Expose
  3. Develop
  • Substrate
  • Resist
  • Exposed
The exposed resist stays after development; the unexposed film dissolves. Schematic cross-sections for mr-DWL 5 — feature width, film aspect ratio and sidewall angle are illustrative, not to scale.
—01 / Coating

Spin coating

Spin curve for mr-DWL 5: film thickness in µm against spin speed in rpm.0510151k2k3k4k5k6kSPIN SPEED (rpm)THICKNESS (µm)
Data points
mr-DWL 5 — film thickness (µm) by spin speed (rpm)
Seriesrpmµm
mr-DWL 5, 30 s100014
15009.6
20007.5
25006.1
30005.2
40004.1
50003.4
60002.8

Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool. Series digitized from a published figure are approximate (±10 %).

read from figure — the spin-speed chart on p.1 of the mr-DWL series sheet (film thickness 0–130 µm vs spin speed, linear axes, 750–6000 rpm), trace identified by legend as the green line 'mr-DWL 5, 30 s'. The chart is a single image shared by three grades; the green trace is the lowest curve and carries no point markers, so values were read where the line crosses the labelled rpm gridlines, within about ±0.5 µm, and never beyond the plotted span (the trace starts near 850 rpm at about 16 µm and ends at 6000 rpm).

Redrawn from the manufacturer's published data — hover to read between points, click to pin.
  • The sheet's chart gives the spin time with each curve — 30 s for this grade — but nothing else about coating: no dispense volume, acceleration, edge-bead step or substrate preparation.
  • The curve passes 12 µm at roughly 1200 rpm, the top of the stated 3–12 µm window, and sits just under the 3 µm floor by 6000 rpm, so the window is covered by about 1200–5600 rpm on that chart.
  • Treat the curve as a starting point and measure film thickness on your own coater.
Adhesion
Not addressed on the sheet.
—02 / Bake

Soft bake

Soft bake
Not published — characterize on-tool
—03 / Exposure

Exposure dose

mr-DWL is built for 405 nm laser writing and rated highly sensitive above 400 nm, but the sheet prints no dose at any wavelength, so plan a dose matrix on your own writer. Run a dose array on your own tool to land the working dose.

Not published for this resist: Dose at 365 nm, Dose at 405 nm — characterize on-tool.

—04 / Development

Development

Not published for this resist: Developer, Dilution, Time, Method, Rinse — characterize on-tool.

—05 / Post-processing

Hard bake, etch & strip

Etch resistance
The sheet lists high wet and dry etch stability and names use as an etch mask for wet and dry etch processes. No etch rates are published.

Not published for this resist: Hard bake, Descum, Stripper, Storage — characterize on-tool.

—06 / Applications

Where it's used

Practical notes from the datasheet

mr-DWL 5 is the thinnest of the three mr-DWL grades and the only one on the sheet below 20 µm. The series is described as negative-tone and designed for exposure above 400 nm, usable for direct laser writing at 405 nm and for two-photon polymerization, with high sensitivity and good thermal and chemical stability. Listed uses are fast contactless prototyping, an etch mask for wet and dry processes, a mould for electroplating, a master for stamp fabrication by thermal or UV moulding, and optical parts in microsystems. The sheet is a single page: it gives the film-thickness window for each grade and one spin chart, and stops there. Soft bake, exposure dose, post-exposure bake and developer are not on it, so those steps have to be established on the tool.

—07 / Family

Grades in this family

Other grades in the mr-DWL series line differ mainly in coating thickness:

mr-DWL series — grade comparison
GradeThickness
mr-DWL 5 (this page)3–12 µm
mr-DWL 10020–150 µm
mr-DWL 4020–100 µm
—08 / Troubleshooting

Troubleshooting

Common failure modes for mr-DWL 5, answered from the manufacturer's datasheet and application notes. These are starting points — your substrate, tooling and environment shift the specifics, so calibrate on-tool.

Does mr-DWL 5 reach 20 µm, or do I need a different grade?

Use a thicker grade. The series sheet puts mr-DWL 5 at 3–12 µm, mr-DWL 40 at 20–100 µm and mr-DWL 100 at 20–150 µm, so nothing in the 12–20 µm gap is listed for any grade. The 30 s curve for mr-DWL 5 starts near 16 µm at about 850 rpm, but that is thicker than the stated window, so measure before relying on it.

SOURCE: mr-DWL series sheet (micro resist technology GmbH, document…

mr-DWL series sheet (micro resist technology GmbH, document code ls.19.08.02) — Technical data table and spin-speed chart, p.1

—09 / Sources

Sources & disclaimer

Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-10-15.

Cite this recipe

NANYTE. "mr-DWL 5 process recipe." NANYTE Photoresist Library. https://nanyte.com/photoresists/mr-dwl-5. Accessed 2026-10-15.

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