https://nanyte.com/photoresists/ti-35e · last updated 2026-09-10
- Manufacturer
- MicroChemicals GmbH
- Tone
- image reversal
- Thickness
- 3–4.5 µm
- Exposure dose
- 140 mJ/cm²
- Developer
- AZ 826 MIF (metal-ion-free), or a potassium- or sodium-based developer — AZ 400K diluted 1:4, or AZ 351B
- Applications
- Lift-off · Image reversal · Etch mask
- Substrate
- Resist
- Exposed
Spin coating
The manufacturer does not publish a spin curve for TI 35E.
- No spin curve is plotted or tabulated.
- The datasheet gives the 3.0-4.5 µm range and one anchor inside it — 'With spin-speed of 3000 rpm a resist thickness of 3.6 µm will be achieved' (p.1) — which is a single point, not a sweep.
- The only other coating instruction is to hold the final speed for at least 30-40 s.
- Accel, dispense volume and edge-bead removal are not published.
- Note the edge effect the document does flag: on square substrates the film at the edges runs significantly thicker than 3-4 µm, which is why it tells you to double the post-exposure delay there.
- Adhesion
- HMDS recommended — Two routes are given.
Soft bake
- Soft bake
- 95 °C · 2 min · hotplate
- Notes
- 95 °C for 2 min on a hotplate. A furnace alternative of 95 °C for 20 min is given.
SOURCE: Processing the TI 35E, p.4
Exposure dose
The manufacturer publishes 140 mJ/cm². Dose scales with film thickness and depends on your optics, so treat it as a starting point and run a dose array.
- As published
- 140 mJ/cm² is the typical first exposure, with 100-250 mJ/cm² the working range.
- Post-exposure bake
- 115–120 °C · 2 min · hotplate
- Flood exposure
- 540 mJ/cm²
Not published for this resist: Dose at 365 nm, Dose at 405 nm — characterize on-tool.
SOURCE: Processing the TI 35E, p.4 ('at a dose of 140 mJ/cm2') and the process overview table, p.6 ('100 .. 250, 140 (typ.)')
Development
- Developer
- AZ 826 MIF (metal-ion-free), or a potassium- or sodium-based developer — AZ 400K diluted 1:4, or AZ 351B
- Dilution
- AZ 400K at 1:4; no dilution is stated for AZ 826 MIF or AZ 351B.
- Developer family
- TMAH or buffered alkaline
Not published for this resist: Time, Method, Rinse — characterize on-tool.
SOURCE: Processing the TI 35E, p.5, and the process overview table…
Processing the TI 35E, p.5, and the process overview table, p.6 ('Developer — Clariant AZ 351B, MIF Developers e.g. AZ 826')
Hard bake, etch & strip
- Hard bake
- 140–145 °C · 2 min · hotplate
- Etch resistance
- Built for wet chemistry.
- Stripper
- AZ 100 remover, or acetone. For lifting off the deposited film the sheet lists PGMEA, NMP, MMP, EEP, DMF, acetone and ethyl lactate.
Not published for this resist: Descum, Storage — characterize on-tool.
SOURCE: Processing the TI 35E, p.5, the fields-of-application section, p.3, and the process overview table, p.6
Where it's used
Practical notes from the datasheet
TI 35E is run in image-reversal mode, which is why the exposure mask has to be inverted: the areas exposed through the mask are the ones that survive. The sequence adds two steps to an ordinary positive process — the reversal bake and a maskless flood exposure — and needs no new equipment beyond that. The payoff is the negative wall profile, and the first exposure is the knob that sets it: 140 mJ/cm² suits most work, and lowering it opens the undercut further, at the cost of eroding the areas that are supposed to clear if taken too far. At 3.6 µm coated from 3000 rpm the sheet rates the undercut for lifting off evaporated films up to 6 µm thick, with typical feature aspect ratios of 1.6 to 2.0; sputtered films reach roughly 1 µm instead, because the deposition is not directional, and may need ultrasonic help. One step is easy to skip and shouldn't be: after the first exposure the wafer rests at room temperature for at least 10 minutes so the nitrogen generated during exposure can diffuse out, doubled for square substrates whose edge bead runs thicker. The other trap is the reversal bake temperature, which the datasheet flags as the critical one and the reason it steers you off furnace baking.
Sources & disclaimer
- MicroChemicals GmbH — TI 35E datasheet (revised 08/2016) · accessed 2026-09-10
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-09-10.