https://nanyte.com/photoresists/nr7-1500py · last updated 2026-07-12
- Manufacturer
- Futurrex, Inc.
- Tone
- negative
- Thickness
- 1.2–3 µm
- Exposure dose
- 390 mJ/cm² at 365 nm
- Applications
- Lift-off · Etch mask
Unverified — not yet human-checked; values transcribed from the datasheet, characterize on-tool.
Spin coating
NR7-1500PY is spin-coated to 1.2–3 µm. The curve below is redrawn from the manufacturer's published data — read your target thickness off the vertical axis and take the matching spin speed as a starting point.
Data points
| Series | rpm | µm |
|---|---|---|
| NR7-1500PY | 800 | 3.0 |
| 1000 | 2.7 | |
| 2000 | 1.9 | |
| 3000 | 1.5 | |
| 4000 | 1.3 | |
| 5000 | 1.2 |
Values are the manufacturer's starting points, not a guarantee; verify on your own tool. Characterize on-tool.
numeric table 'Film thickness after 150°C hotplate bake for 60 s. / Coating spin speed, 40 s spin (rpm): (nm)', p.1 of Futurrex NR7-1500PY Technical Information (the vendor's own product datasheet page, embedded as p.3 of the retrieved PDF). The datasheet publishes each point as an nm RANGE, not a single value (e.g. 800 rpm -> 2850-3150 nm); each point above is the exact midpoint of that stated range, converted nm->um. Raw ranges: 800rpm=2850-3150nm, 1000rpm=2565-2835nm, 2000rpm=1805-1995nm, 3000rpm=1425-1575nm, 4000rpm=1235-1365nm, 5000rpm=1140-1260nm. NOTE FOR QC: these six ranges are numerically IDENTICAL, rpm-for-rpm, to the spin table already recorded in this library's nr9-1500py.json (also a Futurrex '...1500PY' grade) — plausibly Futurrex reusing one master curve across product lines formulated to the same nominal reference thickness, but a human should re-verify this against the vendor page image before qc:pass, since two independently-read identical tables is also consistent with one of the two readings having been contaminated by memory of the other. The 3000 rpm midpoint (1500 nm = 1.5 um) matches the '1500' in the product name NR7-1500PY, corroborating the midpoint reading.
The retrieved PDF is a University of Pennsylvania INRF lab SOP (Richard Chang / Ngoc Thanh Pham, Summer 2008) that embeds one page of Futurrex's own 'NEGATIVE RESIST NR7-1500PY' Technical Information sheet as a reference appendix (p.3 of the PDF = the vendor's own page '1'). Only that one vendor page was retrievable; the vendor's usual second 'Processing' page (with step-by-step spin/EBR/softbake/PEB/develop instructions, present in this library's NR9-1500PY and NR71-3000P entries) was not part of this document, so no Futurrex-stated dispense volume, acceleration, or edge-bead-removal procedure is recorded here. Separately, the UPenn SOP itself (pp.1-2 of the PDF, a lab procedure, NOT a Futurrex-published figure) reports its own campus recipe: HMDS primer spun at 3000 rpm/30 s (425 rpm/s accel) then baked 90°C/3 min hotplate before coating; NR7-1500PY spun at 800 rpm/40 s, softbake 150°C/60 s (hotplate) — this line matches the vendor Properties-table bake condition exactly — exposure '2 mins (MA6)' aligner, post-exposure bake 100°C/2 min hotplate, develop with MF-319 for 10 s, yielding 1.5 µm; hard-bake 90°C oven/20 min is called optional. These lab-specific numbers (PEB temp/time, develop time, developer choice, exposure dose-as-time-on-a-specific-tool) are recorded here in prose only, NOT copied into the structured peb/develop/exposureDose fields, because they are one university lab's own process on one specific aligner (Karl Suss MA6) rather than a Futurrex-published recommendation — conflating the two would misattribute a secondary source's numbers to the manufacturer.
- Adhesion
Soft bake
- Soft bake
- 150 °C · 60 s · hotplate
- Notes
SOURCE: Properties table heading, p.1 of Futurrex NR7-1500PY Technical Information (embedded as p.3 of the retrieved PDF)
Exposure dose
The manufacturer publishes 390 mJ/cm² at 365 nm ('Sensitivity at 365 nm exposure wavelength (mJ/cm² for 1 µm thick film) 390' (Properties, p.1 of the Futurrex NR7-1500PY Technical Information excerpt); the retrieved page also states the resist is 'designed for 365nm wavelength exposure, using tools such as wafer steppers, scanning projection aligners, proximity printers and contact printers.'). Dose scales with film thickness and depends on your optics, so treat it as a starting point and run a dose array.
- Dose at 365 nm
- 390 mJ/cm²
- Dose at 405 nm
- Not published — characterize on-tool
- As published
SOURCE: Properties, p.1 of Futurrex NR7-1500PY Technical Information (embedded as p.3 of the retrieved PDF)
Development
Not published for this resist: Developer, Dilution, Time, Method, Rinse — characterize on-tool.
Hard bake, etch & strip
- Etch resistance
- "Superior selectivity in RIE process" (Description, p.1 of the Futurrex NR7-1500PY Technical Information excerpt).
- Stripper
- Storage
Not published for this resist: Hard bake, Descum — characterize on-tool.
Where it's used
NR7-1500PY is Futurrex's negative-tone, 365 nm lift-off resist, formulated in cyclohexanone (24-28% solids) and developed in an unspecified 'basic water solution'; the datasheet's headline advantage is 'easy adjustment of the degree of resist undercut as a function of exposure energy', which is what makes its negative-sloping sidewall profile useful for lift-off. Only one page of Futurrex's own two-page Technical Information sheet was retrievable — embedded as a reference appendix inside a 2008 University of Pennsylvania INRF cleanroom SOP rather than fetched as a standalone vendor PDF — so the vendor's own Processing-page guidance (PEB temperature/time, develop time, edge-bead removal, storage conditions) is not available here and those fields are left null; the SOP's own campus recipe for those steps is recorded in spinNotes/adhesion.notes/develop._note but explicitly NOT copied into the structured fields, since it is one lab's process on one aligner (Karl Suss MA6), not a Futurrex-published figure. The spin-thickness table that IS available reproduces exactly the same six rpm/nm-range data points already recorded for the sibling grade NR9-1500PY elsewhere in this library — flagged in spinNotes for a human QC pass rather than silently assumed correct. The 390 mJ/cm² sensitivity at 365 nm is normalized to a 1 µm-thick film, and resist removal uses Resist Remover RR4 — a third distinct remover code, alongside RR5 (NR9-1500PY) and RR41 (NR71-3000P), that should not be conflated across the three Futurrex SKUs in this library.
Sources & disclaimer
- Futurrex, Inc. — NR7-1500PY datasheet · accessed 2026-07-10
- https://www.seas.upenn.edu/~nanosop/documents/NR7-1500PY.pdf — Pages 1-2 of this SAME PDF (as distinct from page 3, the appended vendor sheet used as datasheetUrl basis): a University of Pennsylvania INRF ('Negative Resist NR7-1500PY photolithography', Richard Chang / Ngoc Thanh Pham, Summer 2008) cleanroom lab SOP. Used only for practical/lab-specific process numbers not present on the retrieved vendor page — HMDS pretreatment step, PEB temp/time, develop time and developer product, hard-bake — each explicitly flagged in the relevant field's notes as one lab's own recipe, not a Futurrex-published recommendation. Not used for any headline vendor spec (spin table and 365 nm dose both come from the appended Futurrex Technical Information page itself).
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-07-12.