https://nanyte.com/photoresists/nr7-1500py · last updated 2026-09-28
- Manufacturer
- Futurrex, Inc.
- Tone
- negative
- Thickness
- 1.2–3 µm
- Exposure dose
- 390 mJ/cm² at 365 nm (per 1 µm film)
- Applications
- Lift-off · Etch mask
- Substrate
- Resist
- Exposed
Spin coating
Data points
| Series | rpm | µm |
|---|---|---|
| NR7-1500PY | 800 | 3.0 |
| 1000 | 2.7 | |
| 2000 | 1.9 | |
| 3000 | 1.5 | |
| 4000 | 1.3 | |
| 5000 | 1.2 |
Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool.
numeric table 'Film thickness after 150°C hotplate bake for 60 s. / Coating spin speed, 40 s spin (rpm): (nm)', p.1 of Futurrex NR7-1500PY Technical Information, the vendor's own product datasheet page appended to a University of Pennsylvania cleanroom SOP (PDF p.3). The datasheet publishes each point as an nm RANGE, not a single value (e.g. 800 rpm -> 2850-3150 nm); each point above is the exact midpoint of that stated range, converted nm->um. Raw ranges: 800rpm=2850-3150nm, 1000rpm=2565-2835nm, 2000rpm=1805-1995nm, 3000rpm=1425-1575nm, 4000rpm=1235-1365nm, 5000rpm=1140-1260nm. These six ranges are numerically identical, rpm-for-rpm, to the published spin table for the sibling Futurrex grade NR9-1500PY — plausibly one master curve reused across product lines formulated to the same nominal reference thickness. The 3000 rpm midpoint (1500 nm = 1.5 um) matches the '1500' in the product name NR7-1500PY, corroborating the midpoint reading.
- This document is a University of Pennsylvania INRF lab SOP (Richard Chang / Ngoc Thanh Pham, Summer 2008) that appends one page of Futurrex's own 'NEGATIVE RESIST NR7-1500PY' Technical Information sheet as a reference appendix (PDF p.3 = the vendor's own page '1').
- Only that one vendor page is available; the vendor's usual second 'Processing' page (with step-by-step spin/EBR/softbake/PEB/develop instructions, published for the sibling NR9-1500PY and NR71-3000P grades) is not part of this document, so no Futurrex-stated dispense volume, acceleration, or edge-bead-removal procedure is published for this grade.
- Separately, the UPenn SOP itself (pp.1-2 of the PDF, a lab procedure, not a Futurrex-published figure) reports its own campus recipe: HMDS primer spun at 3000 rpm/30 s (425 rpm/s accel) then baked 90°C/3 min hotplate before coating
- NR7-1500PY spun at 800 rpm/40 s, softbake 150°C/60 s (hotplate) — this line matches the vendor Properties-table bake condition exactly — exposure '2 mins (MA6)' aligner, post-exposure bake 100°C/2 min hotplate, develop with MF-319 for 10 s, yielding 1.5 µm
- hard-bake 90°C oven/20 min is called optional.
- Those lab-specific numbers (PEB temp/time, develop time, developer choice, exposure dose-as-time-on-a-specific-tool) are one university lab's own process on one specific aligner (Karl Suss MA6), not Futurrex recommendations — the two should not be conflated.
- Adhesion
- Not addressed on the available vendor page (the vendor's Substrate Preparation guidance, if any, would be on the Processing page that is not part of this document). The University of Pennsylvania INRF SOP that carries this document applies an HMDS primer (3000 rpm/30 s spin, 90°C/3 min hotplate bake) before coating NR7-1500PY as its own lab practice — a secondary source, not confirmed as Futurrex's own recommendation for this SKU.
Soft bake
- Soft bake
- 150 °C · 60 s · hotplate
- Notes
- The Properties-table heading itself ('Film thickness after 150°C hotplate bake for 60 s.') functions as the bake condition Futurrex measured its spin-curve thickness against — the same pattern seen on the sibling NR9-1500PY and NR71-3000P sheets, where the identical phrase is explicitly corroborated by a numbered Processing step. That corroborating Processing step is not present in this document, so this figure rests on the Properties-table heading alone. Independently, the University of Pennsylvania SOP that carries this document reports the identical 150°C/60 s softbake as its own lab practice for NR7-1500PY, which corroborates (but does not itself constitute) the vendor figure.
SOURCE: Properties table heading, p.1 of Futurrex NR7-1500PY Technical Information (PDF p.3)
Exposure dose
The manufacturer publishes 390 mJ/cm² at 365 nm (per 1 µm film). Dose scales with film thickness and depends on your optics, so treat it as a starting point and run a dose array.
- Dose at 365 nm
- 390 mJ/cm² (per 1 µm film)
- Dose at 405 nm
- Not published — characterize on-tool
- As published
- 390 mJ/cm² at 365 nm is a sensitivity normalized to a 1 µm film, quoted alongside the tools Futurrex expects — steppers, scanning projection aligners, proximity and contact printers — with no dose for any other coat thickness.
SOURCE: Properties, p.1 of Futurrex NR7-1500PY Technical Information (PDF p.3)
Development
Not published for this resist: Developer, Dilution, Time, Method, Rinse — characterize on-tool.
Hard bake, etch & strip
- Etch resistance
- "Superior selectivity in RIE process" (Description, p.1 of the Futurrex NR7-1500PY Technical Information excerpt).
- Stripper
- Resist Remover RR4 (Description, p.1: 'easy resist removal in Resist Remover RR4') — note this differs from the RR5 remover specified for Futurrex's NR9-1500PY and the RR41 remover specified for NR71-3000P; the three SKUs' strip chemistries should not be conflated.
- Storage
- "Guaranteed shelf life at 25°C storage (years) 3" (Properties, p.1); "shelf life exceeding 3 years at room temperature storage" (Description, p.1) of the Futurrex NR7-1500PY Technical Information excerpt. Full storage-condition guidance (temperature range, light/heat/ignition precautions), if published, would be on the missing Processing page.
Not published for this resist: Hard bake, Descum — characterize on-tool.
Where it's used
Practical notes from the datasheet
NR7-1500PY is Futurrex's negative-tone, 365 nm lift-off resist, formulated in cyclohexanone (24-28% solids) and developed in an unspecified 'basic water solution'; the datasheet's headline advantage is 'easy adjustment of the degree of resist undercut as a function of exposure energy', which is what makes its negative-sloping sidewall profile useful for lift-off. Only one page of Futurrex's own two-page Technical Information sheet is available here — appended as a reference to a 2008 University of Pennsylvania INRF cleanroom SOP rather than published as a standalone vendor PDF — so the vendor's own Processing-page guidance (PEB temperature/time, develop time, edge-bead removal, storage conditions) is not available and no value is quoted for those steps; the SOP's own campus recipe for them is quoted in the coating and development notes as one lab's process on one aligner (Karl Suss MA6), not as a Futurrex-published figure. The spin-thickness table that is available reproduces exactly the same six rpm/nm-range data points published for the sibling grade NR9-1500PY. The 390 mJ/cm² sensitivity at 365 nm is normalized to a 1 µm-thick film, and resist removal uses Resist Remover RR4 — a third distinct remover code, alongside RR5 (NR9-1500PY) and RR41 (NR71-3000P), that should not be conflated across the three Futurrex SKUs.
Troubleshooting
Common failure modes for NR7-1500PY, answered from the manufacturer's datasheet and application notes. These are starting points — your substrate, tooling and environment shift the specifics, so calibrate on-tool.
How do I get more or less undercut out of NR7-1500PY for lift-off?
Through the exposure dose. Futurrex lists easy adjustment of the degree of undercut as a function of exposure energy as one of the resist's advantages, and says the developed film has a negative-sloping sidewall that makes lift-off simple. The sheet gives no curve of undercut against dose, so bracket around the published sensitivity — 390 mJ/cm² at 365 nm for a 1 µm film — and cross-section the result at your thickness.
SOURCE: Negative Resist NR7-1500PY Technical Information (Futurrex, Inc., undated) — Description and Properties, p.1
My NR7-1500PY coat came out about 3 µm at 800 rpm, but a lab recipe said 1.5 µm — which is right?
Go with the Futurrex table. It gives, after a 150 °C / 60 s hotplate bake and a 40 s spin, 2850–3150 nm at 800 rpm, 1805–1995 nm at 2000 rpm, 1425–1575 nm at 3000 rpm and 1140–1260 nm at 5000 rpm. The University of Pennsylvania INRF lab SOP that carries this sheet lists 1.5 µm at 800 rpm, which the maker's numbers do not support; check any borrowed recipe against the vendor spin table and a thickness measurement.
SOURCE: NR7-1500PY Technical Information
Negative Resist NR7-1500PY Technical Information (Futurrex, Inc., undated) — Properties, film thickness vs. spin speed, p.1. University of Pennsylvania INRF SOP 'Negative Resist NR7-1500PY photolithography' (Chang / Pham, 2008) — Procedure step 2 table
My NR7-1500PY pattern rounded over during metal deposition and the lift-off failed — how hot can it go?
Futurrex rates NR7-1500PY for temperatures up to 180 °C, so keep the substrate below that during evaporation or sputtering. MicroChemicals' lift-off note (not a Futurrex document) explains why it matters: resist heated past its softening point deforms, gets coated over its whole surface, and the solvent can no longer reach it. The same note lists remedies — better heat coupling to the holder, a lower deposition rate, or depositing in steps with cooling pauses.
SOURCE: NR7-1500PY Technical Information
Negative Resist NR7-1500PY Technical Information (Futurrex, Inc., undated) — Description, p.1. MicroChemicals application note 'Lift-off' (not a Futurrex document) — Thermal Effects on the Resist Structures
What remover does Futurrex specify for NR7-1500PY?
Resist Remover RR4 — Futurrex lists easy removal in RR4 among the resist's advantages. Don't carry the remover over from other Futurrex lift-off resists by habit; the NR7-1500PY sheet names RR4 specifically. The same sheet claims high selectivity in RIE and a shelf life beyond 3 years at room temperature (3 years guaranteed at 25 °C).
SOURCE: Negative Resist NR7-1500PY Technical Information (Futurrex, Inc., undated) — Description and Properties, p.1
Does NR7-1500PY need an HMDS prime before coating?
The Futurrex technical sheet does not cover substrate preparation. The University of Pennsylvania INRF SOP for this resist — one lab's practice, not a Futurrex recommendation — cleans in acetone and isopropanol with a DI rinse, dehydrates the substrate in a 120 °C oven for 20 min, spins HMDS at 3000 rpm for 30 s and bakes it at 90 °C for 3 min before coating. It also notes NR7-1500PY tends to adhere well to Si, glass and metals.
SOURCE: University of Pennsylvania INRF SOP 'Negative Resist…
University of Pennsylvania INRF SOP 'Negative Resist NR7-1500PY photolithography' (Chang / Pham, 2008) — Overview, Preparation and Procedure step 1, p.1
Sources & disclaimer
- Futurrex, Inc. — NR7-1500PY datasheet · accessed 2026-07-10
- https://www.seas.upenn.edu/~nanosop/documents/NR7-1500PY.pdf — Pages 1-2 of this same PDF (as distinct from page 3, the appended Futurrex vendor sheet): a University of Pennsylvania INRF ('Negative Resist NR7-1500PY photolithography', Richard Chang / Ngoc Thanh Pham, Summer 2008) cleanroom lab SOP. Used only for practical/lab-specific process numbers not present on the vendor page — HMDS pretreatment step, PEB temp/time, develop time and developer product, hard-bake — each explicitly flagged in the relevant field's notes as one lab's own recipe, not a Futurrex-published recommendation. Not used for any headline vendor spec (spin table and 365 nm dose both come from the appended Futurrex Technical Information page itself).
- Renkes et al.. Plasmonic Nanopore Sensing to Probe the DNA Loading Status of Adeno-Associated Viruses. Chemosensors (2025). doi:10.3390/chemosensors13120418Coats wafers with NR7-1500PY, patterns them on a backside mask aligner, develops in Futurrex RD-6 with an oxygen-plasma descum, then lifts off a 5 nm Cr / 100 nm Au stack to form the plasmonic apertures of a nanopore sensor.
- Zhang et al.. Proteomics-Empowered Microfluidic-SERS Immunoassay for Identifying and Detecting Biomarkers of Micropapillary Lung Adenocarcinoma. Advanced Science (2025). doi:10.1002/advs.202501336Spins NR7-1500PY on a glass wafer at 1200 rpm for 10 s then 3000 rpm for 40 s, bakes at 150 C for 1 min, exposes on a SUSS MicroTec aligner, post-bakes at 120 C for 2 min, develops in TMAH for 7 s, and lifts off Cr/Au overnight to form ring electrodes.
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-09-28.