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Photec RD process recipe

Resonac's fine-line dry film for laser direct imaging of printed-wiring-board circuits. Three sheets, 15, 19 and 25 µm, resolve 4, 5 and 7 µm lines and spaces on a 405 nm direct-imaging tool, and the maker positions the series for semi-additive circuit formation.

https://nanyte.com/photoresists/photec-rd · last updated 2026-10-15

At a glance
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Manufacturer
Resonac
Tone
negative
Thickness
15–25 µm
Developer
Na2CO3 1.0 wt% in water, 30 °C, 0.16 MPa
Applications
Electroplating / molding

Cross-checked — the spin curve (where published) and the single-value figures were read twice, independently, from the datasheet, with any disagreement settled against it.

The exposed resist stays after development; the unexposed film dissolves. Schematic cross-sections for Photec RD — feature width, film aspect ratio and sidewall angle are illustrative, not to scale.
—01 / Coating

Coating — dry-film lamination

Photec RD is supplied as a pre-cut dry-film sheet and applied by hot-roll lamination — it is not spin-coated. Thickness is fixed per sheet, 15–25 µm, selected by sheet rather than by spin speed.

  • Supplied as a laminated dry film, so there is no spin curve and thickness is fixed by the grade (15, 19 or 25 µm).
  • The product page gives no lamination temperature, pressure or speed, and no hold times; those must come from Resonac's technical documentation or the supplier.
  • The test panels behind the table used a substrate of surface roughness Ra 0.4 µm.
Adhesion
No adhesion promoter or substrate preparation is described on the product page. It lists an adhesion figure instead: the narrowest line that stays attached, tested on a line/space layout of x over 3x, is 4 µm for RD-3015, 5 µm for RD-3019 and 7 µm for RD-3025.
—02 / Bake

Soft bake

Soft bake
Not published — characterize on-tool
Notes
No bake between lamination and exposure is listed on the product page.

SOURCE: Product Lineup table and footnotes, Resonac Photec RD Series product page

—03 / Exposure

Exposure dose

Photec RD's dose is published per sheet thickness, not as a single number. Read the row for the sheet you laminate and run a dose array around it.

Dose at 365 nm
Not published — characterize on-tool
As published
Dose is a single value per sheet at 405 nm on a direct-imaging tool: 95 mJ/cm² for the 15 and 19 µm sheets and 85 mJ/cm² for the 25 µm sheet, set to 15 steps held on a 41-step tablet.
Post-exposure bake
80 °C · 30 s · oven
Photec RD — dose per sheet thickness · at 405 nm
SheetDose
15 µm95 mJ/cm²
19 µm95 mJ/cm²
25 µm85 mJ/cm²
SOURCE: Product Lineup table, Resonac Photec RD Series product page…

Product Lineup table, Resonac Photec RD Series product page: 'Exposure energy (mJ/cm2)' 95 / 95 / 85 for RD-3015 / RD-3019 / RD-3025, footnoted 'DE-1 UH was applied (Adtec Engineering Co., Ltd, 405 nm DI)'. One value per grade, not a range.

—04 / Development

Development

Developer
Na2CO3 1.0 wt% in water, 30 °C, 0.16 MPa
Developer family
Buffered alkaline

Not published for this resist: Dilution, Time, Method, Rinse — characterize on-tool.

SOURCE: Footnotes to the Product Lineup table, Resonac Photec RD…

Footnotes to the Product Lineup table, Resonac Photec RD Series product page: 'Developer: 1.0 wt% Na2CO3 (aq), 30 °C, 0.16 MPa'

—05 / Post-processing

Hard bake, etch & strip

Not published for this resist: Hard bake, Descum, Etch resistance, Stripper, Storage — characterize on-tool.

—06 / Applications

Where it's used

Practical notes from the datasheet

The series is written for direct-writing exposure machines that pattern circuits with a laser, and the maker says it suits circuit formation by semi-additive processing. Resolution on the test layout is 4 µm lines and spaces for the 15 µm sheet, 5 µm for 19 µm and 7 µm for 25 µm, so the achievable line width tracks sheet thickness at roughly 1:3.5 to 1:4. Those results come from one tool (Adtec 405 nm DI) and one substrate (Ra 0.4 µm), shown with cross-section profile photos for each grade on the page; treat them as the vendor's best case. The page offers no lamination conditions, develop time, stripper, shelf life or storage guidance, so those fields are empty rather than borrowed from another dry film. Request the full datasheet from Resonac before committing a process.

—07 / Sources

Sources & disclaimer

  • Resonac — Photec RD datasheet (None printed. This is an HTML product page (copyright line 2026), not a revisioned datasheet; the data is labelled 'One of our data'.) · accessed 2026-10-15

Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-10-15.

Cite this recipe

NANYTE. "Photec RD process recipe." NANYTE Photoresist Library. https://nanyte.com/photoresists/photec-rd. Accessed 2026-10-15.

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