https://nanyte.com/photoresists/eternal-laminar-udf7200t · last updated 2026-10-15
- Manufacturer
- Eternal Materials
- Grades
- UDF7230T · UDF7240T · UDF7250T · UDF7262T · UDF7275T1
- Tone
- negative
- Thickness
- 30–75 µm
- Developer
- Na2CO3 0.85 % (range 0.7-1.0 %) or K2CO3 1.0 % (range 0.8-1.2 %)
- Applications
- Etch mask · Electroplating / molding
Cross-checked — the spin curve (where published) and the single-value figures were read twice, independently, from the datasheet, with any disagreement settled against it.
- Substrate
- Resist
- Exposed
Coating — dry-film lamination
LAMINAR NOVA UDF7200T is supplied as a pre-cut dry-film sheet and applied by hot-roll lamination — it is not spin-coated. Thickness is fixed per sheet, 30–75 µm, selected by sheet rather than by spin speed.
- Laminated, not spun; the sheet fixes the thickness.
- Two laminator setups are tabulated (Table 1, pp.2-3).
- Manual laminator: roll 90-120 °C, 1.0-3.0 m/min (3-10 ft/min), air-assist 35-50 psi, exit 40-65 °C. Automatic cut-sheet laminator: roll 90-130 °C, 1.0-3.0 m/min, 35-50 psi, exit 40-65 °C, then a seal step at 60-80 °C, 3.0-5.0 kg/cm² for 1-4 s.
- Preheating, slow speed and higher pressure help on fine lines, and a thicker sheet conforms better to surface defects; the price is film forced into through-holes, which thins the tent at the rim.
- Let panels cool to room temperature before exposure, rack them with space between, and keep them under yellow light until development is finished.
- Adhesion
- No adhesion promoter is mentioned. The copper surface is to be clean, dry and contaminant-free; jet pumice, Scotch-Brite, aluminium oxide spray, pumice brushing and chemical cleaning are listed as acceptable (Surface preparation, p.2). Fine-line adhesion against step-tablet exposure is plotted in Figure 2 (pp.7-8).
Soft bake
- Soft bake
- Not published — characterize on-tool
- Notes
- No bake between lamination and exposure; the only requirement is that the laminated panel returns to room temperature first (Handling and Hold Times, p.3).
SOURCE: Lamination and Handling and Hold Times, pp.2-3, DFR0159
Exposure dose
LAMINAR NOVA UDF7200T's dose is published per sheet thickness, not as a single number. Read the row for the sheet you laminate and run a dose array around it.
- As published
- Dose follows the sheet: 6-20 mJ/cm² on a 375 nm laser setting for the 30 µm film (7-24 on 405 nm), rising to 15-48 (20-53) for 75 µm, held to a Stouffer step-tablet target on copper.
| Sheet | Dose |
|---|---|
| 30 µm | 6–20 mJ/cm² |
| 40 µm | 7–22 mJ/cm² |
| 49 µm | 13–42 mJ/cm² |
| 62 µm | 14–45 mJ/cm² |
| 75 µm | 15–48 mJ/cm² |
SOURCE: Exposure parameters tables, pp.4-5: column 'Exposure energy…
Exposure parameters tables, pp.4-5: column 'Exposure energy set mode 375nm/405nm: 100/0'. UDF7230T 6~20, 7240T 7~22, 7250T 13~42, 7262T 14~45, 7275T 15~48 mJ/cm². The Figure 1 sensitivity curves (pp.5-6, printer Nuvogo800) show the low end of each range at the first step of its target window and the high end at the last. No wavelength is given here because the table names a laser-mix setting of the printer, not a 365 nm line.
| Sheet | Dose |
|---|---|
| 30 µm | 7–24 mJ/cm² |
| 40 µm | 8–26 mJ/cm² |
| 49 µm | 15–46 mJ/cm² |
| 62 µm | 18–50 mJ/cm² |
| 75 µm | 20–53 mJ/cm² |
SOURCE: Exposure parameters tables, pp.4-5: column 'Exposure energy…
Exposure parameters tables, pp.4-5: column 'Exposure energy set mode 375nm/405nm: 0/100' (all-405 nm laser setting). UDF7230T 7~24, 7240T 8~26, 7250T 15~46, 7262T 18~50, 7275T 20~53 mJ/cm². Figure 1 (pp.5-6, printer Nuvogo800) plots the same endpoints.
Development
- Developer
- Na2CO3 0.85 % (range 0.7-1.0 %) or K2CO3 1.0 % (range 0.8-1.2 %)
- Method
- Conveyorized spray at 28-30 °C (range 25-34 °C), 1.5-1.7 kg/cm² (range 1.5-2.0 kg/cm², 22-30 psi) through high-impact direct-fan or cone nozzles, breakpoint at 55 % of the chamber length (range 50-70 %).
- Rinse
- Hard-water spray rinse (150-300 ppm CaCO3 equivalent) at 20-25 °C (range 15-30 °C) and 2.0 kg/cm² (range 1.2-2.5 kg/cm²), then hot-air dry.
- Developer family
- Buffered alkaline
Not published for this resist: Dilution, Time — characterize on-tool.
SOURCE: Development, 'Developing operation conditions' table, p.10, DFR0159
Hard bake, etch & strip
- Etch resistance
- Stated to perform well in both acid and alkaline etchants (Etching, p.11), with high chemical resistance to acidic etchants listed under Features (p.1).
- Stripper
- 2.0-5.0 % NaOH or KOH, or a proprietary stripper, by immersion or conveyorized spray at 40-60 °C and 1.0-3.0 kg/cm² (15-45 psi). Strip time at 2-5 % NaOH grows with the sheet: UDF7230T 25-45 s, 7240T 46-70 s, 7250T 71-109 s, 7262T 107-180 s, 7275T 154-253 s; the 21-step strip-test targets are 7-9 steps on resist (8-10 on copper). Times shift with caustic strength, temperature, plating overhang, spray pressure, exposure level and hold time before stripping (Stripping, pp.11-12; Figure 5, p.12).
- Storage
- Store at 5-20 °C (41-68 °F) and 50 % relative humidity ± 10 % to get the full shelf life (Storage, p.13); no shelf-life duration is printed. Open the film under controlled yellow light only, do not reuse release or cover sheets, keep unexposed resist off skin and ventilate the lamination room (Safety and Handling, p.13).
Not published for this resist: Hard bake, Descum — characterize on-tool.
Where it's used
Practical notes from the datasheet
UDF7200T spans five sheet thicknesses, 30 to 75 µm, all listed for acid plating, Ni/Au plating, print-and-etch and tent-and-etch. The step-tablet target moves with thickness: the three thickest sheets are exposed to a higher step (Stouffer 41 steps 19-28) than the two thinnest (16-25), and the dose ranges climb roughly 2.5-fold from the 30 µm to the 75 µm sheet. Develop and strip times grow just as steeply, so the thickest sheets cost the most line time. Resolution and adhesion are plotted against the step held (Figures 2 and 3, pp.7-9) on the Nuvogo800 printer rather than quoted as single numbers; for instance the datasheet's cross-section micrographs show 40 µm lines and spaces in UDF7240T and UDF7250T at Stouffer 41 steps 19 and 22 on the 375 nm setting (p.4). Set the exposure to the step-tablet target on your own copper and tool; the dose figures here belong to the printer that produced them.
Troubleshooting
Common failure modes for LAMINAR NOVA UDF7200T, answered from the manufacturer's datasheet and application notes. These are starting points — your substrate, tooling and environment shift the specifics, so calibrate on-tool.
Panels show dirt imprints and the resist behaves oddly in exposure or develop after lamination. What causes that?
Stacking. Eternal says laminated panels should be racked with a gap between each and allowed to cool to room temperature before exposure. Panels piled on each other press trapped particles into the next board's resist and hold heat, which interferes with both exposure and development.
SOURCE: Eternal Materials, LAMINAR NOVA UDF7200T datasheet DFR0159 (rev 2019/03/14) — Handling and Hold Times, p.3
Stripping takes much longer on my thicker sheets than the thin ones. Is that normal?
Yes. The strip table runs from 25-45 s for the 30 µm sheet to 154-253 s for the 75 µm sheet at 40-60 °C in 2-5 % NaOH. The datasheet also names caustic concentration, bath temperature, plating overhang height, spray pressure, exposure level and hold time before stripping as the other drivers of strip time.
SOURCE: LAMINAR NOVA UDF7200T datasheet
Eternal Materials, LAMINAR NOVA UDF7200T datasheet DFR0159 (rev 2019/03/14) — Stripping parameters table and Figure 5, pp.11-12
Sources & disclaimer
- Eternal Materials — LAMINAR NOVA UDF7200T datasheet (Document DFR0159, 'Revised Date: 2019/03/14', printed on every page.) · accessed 2026-10-15
- LAMINAR NOVA Series UDF7200T datasheet DFR0159 (revised 2019/03/14), Specification table, p.1: UDF7230T 30 µm, UDF7240T 40 µm, UDF7250T 49 µm, UDF7262T 62 µm, UDF7275T 75 µm (each ± 2 µm).
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-10-15.