https://nanyte.com/photoresists/etertec-udh5600 · last updated 2026-10-15
- Manufacturer
- Eternal Materials
- Tone
- negative
- Thickness
- 25–30 µm
- Developer
- Na2CO3 0.7-1.0 % (optimum 0.85 %) or K2CO3 0.8-1.2 % (optimum 1.0 %)
- Applications
- Etch mask · Electroplating / molding
Cross-checked — the spin curve (where published) and the single-value figures were read twice, independently, from the datasheet, with any disagreement settled against it.
- Substrate
- Resist
- Exposed
Coating — dry-film lamination
Etertec UDH5600 is supplied as a pre-cut dry-film sheet and applied by hot-roll lamination — it is not spin-coated. Thickness is fixed per sheet, 25–30 µm, selected by sheet rather than by spin speed.
- A laminated film on dry, clean panels, with no spin step.
- Hot roll 90-120 °C, 2.5-3.5 bar (36-50 psi), 1-3 m/min (3-10 ft/min), identical for manual and automatic laminators
- pre-heat optional; exit temperature 40-65 °C. Automatic lines also seal at 60-80 °C, 3.0-6.0 bar (44-87 psi) for 1-4 s.
- Roll and panel cleanliness matter because dirt, copper or epoxy-glass slivers and resist chips cause pinholes.
- After lamination, rack the panels with a gap between each; stacking prints trapped particles from one board into the next and traps heat that interferes with exposure and develop.
- Hold at least 20 min, or as long as it takes the panels to reach room temperature.
SOURCE: Lamination, p.2.
- Adhesion
- No adhesion promoter is specified. The film is stated to adhere to vendor copper, electroless and panel-plated copper (as received or pumice/brush scrubbed), direct-metallization surfaces and microetched copper, provided the surface is cleaned well (Surface preparation, p.1). Nothing is stated for substrates other than copper.
Soft bake
- Soft bake
- Not published — characterize on-tool
- Notes
- There is no bake between lamination and exposure; the only wait is the racked post-lamination hold (at least 20 min).
SOURCE: Lamination / Post lamination Hold Time, p.2
Exposure dose
Etertec UDH5600's dose is published per sheet thickness, not as a single number. Read the row for the sheet you laminate and run a dose array around it.
- Dose at 365 nm
- Not published — characterize on-tool
- As published
- Both sheets, 25 and 30 µm, are given the same 45-120 mJ/cm² at 405 nm, aimed at steps 4-7 of a Stouffer 21 tablet on the resist (5-8 as seen on copper).
| Sheet | Dose |
|---|---|
| 25 µm | 45–120 mJ/cm² |
| 30 µm | 45–120 mJ/cm² |
SOURCE: Exposure table, p.3, introduced as 'referred to exposure at…
Exposure table, p.3, introduced as 'referred to exposure at 405nm': 'Energy (mJ/cm2)' 45-120 for both UDH5625 (25 µm) and UDH5630 (30 µm).
Development
- Developer
- Na2CO3 0.7-1.0 % (optimum 0.85 %) or K2CO3 0.8-1.2 % (optimum 1.0 %)
- Method
- spray
- Rinse
- Water rinse of 9-15 °dH hardness (150-300 ppm CaCO3, optimum 12 °dH), preferably at 15-25 °C (optimum 20 °C), in a rinse module at least two thirds the length of the developer module.
- Developer family
- Buffered alkaline
Not published for this resist: Dilution, Time — characterize on-tool.
SOURCE: Developing, p.4 (conditions table, develop-time table, dry-film load, antifoam and maintenance notes)
Hard bake, etch & strip
- Etch resistance
- Stated to have high chemical resistance to acid etchants; no etchant chemistries, concentrations or etch times are listed.
- Stripper
- Strips by immersion or conveyor in 2.0-5.0 % caustic (NaOH or KOH) or a proprietary stripper (Ordyl Stripper 5600 is named). The strip table, for 2-5 % NaOH at 40-60 °C and 1.0-3.0 bar (15-45 psi), gives 42-58 s for UDH5625 and 61-74 s for UDH5630. Strip time moves with caustic concentration, temperature, plating overhang height, spray pressure, exposure level and hold time before strip.1
Not published for this resist: Hard bake, Descum, Storage — characterize on-tool.
Where it's used
Practical notes from the datasheet
UDH5600 is the finest-line member of this set: two thin sheets (25 and 30 µm) aimed at IC substrates, with exposure written for UV laser direct imaging. It is also the only one of the three here whose energy table is explicitly tagged 405 nm. The datasheet adds two line-width-versus-step charts for each sheet (p.3): at 10, 13, 16 and 19 held Stouffer-41 steps the adhesion line width is 7, 5, 4.5 and 4 µm for UDH5625 (lines/spaces X/300 µm) and 10, 6.5, 6 and 5 µm for UDH5630, while the resolution line/space values are 7, 5.5, 6.5 and 9 µm for UDH5625 and 10, 6.5, 7.5 and 11 µm for UDH5630. Plating is the named strength: the film is said to perform well in copper sulphate, tin/lead, bright acid tin, nickel sulfamate and acid gold baths. Its hot-roll window, 90-120 °C, is lower than the 105-125 °C the two Ordyl AM datasheets give. No storage life, spin, bake or non-copper substrate data are given.
Troubleshooting
Common failure modes for Etertec UDH5600, answered from the manufacturer's datasheet and application notes. These are starting points — your substrate, tooling and environment shift the specifics, so calibrate on-tool.
I see pinholes in the developed film. What does the datasheet point to?
Dirt on the panel or the rollers. The sheet says both must be clean, since dirt, copper or epoxy-glass slivers and resist chips all cause pinholes. It also says to rack laminated panels with a gap between them rather than stacking, because stacking presses trapped particles into the next board's resist.
SOURCE: UDH5600 Product Data Sheet
Elga Europe, Etertec UDH5600 Product Data Sheet, Edition 01 (October 2023) - Lamination: Cleanliness and Post lamination Hold Time, p.2
Develop quality drifts after weeks of running. What maintenance is listed?
Clean the develop machine once a week to remove carbonate salts and resist and antifoam residue. Keep the dry-film load in the developer at or under 3 g/l and run an antifoam as the datasheet recommends.
SOURCE: UDH5600 Product Data Sheet
Elga Europe, Etertec UDH5600 Product Data Sheet, Edition 01 (October 2023) - Developing: Developer Maintenance and load note, p.4
Sources & disclaimer
- Eternal Materials — Etertec UDH5600 datasheet (Edition 01 - October 2023 (6 pages)) · accessed 2026-10-15
- Stripping, p.5.
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-10-15.