https://nanyte.com/photoresists/ordyl-p50000 · last updated 2026-10-15
- Manufacturer
- Elga Europe
- Tone
- negative
- Thickness
- 100–125 µm
- Developer
- Na2CO3 0.8-1.2 % (optimum 0.9 %, 29 °C) or K2CO3 0.6-1.0 % (optimum 0.8 %, 28 °C)
- Applications
- Electroplating / molding
Cross-checked — the spin curve (where published) and the single-value figures were read twice, independently, from the datasheet, with any disagreement settled against it.
- Substrate
- Resist
- Exposed
Coating — dry-film lamination
Ordyl P50000 is supplied as a pre-cut dry-film sheet and applied by hot-roll lamination — it is not spin-coated. Thickness is fixed per sheet, 100–125 µm, selected by sheet rather than by spin speed.
- This film is laminated, never spun, so thickness is the sheet you buy.
- Dry the panel thoroughly first.
- Hot roll 105-125 °C, 1-3 m/min (3-10 ft/min), pre-heat optional, on either laminator type.
- Roll pressure is 2.5-3.5 bar (36-50 psi) on a manual machine, 2.5-6.0 bar (36-87 psi) on an automatic one with a 1-4 s seal at 40-80 °C and 3.0-6.0 bar (44-87 psi).
- Panels should exit at 50-70 °C (inner layer) or 45-60 °C (outer layer).
- Hold for at least 20 minutes after lamination and not beyond a week; if the panel will sit longer than 72 hours the sheet asks for it to be covered with black PE to shield it from yellow light, which is a P50000-specific instruction not printed on the thinner Ordyl sheets.
- (Process Information, p.2.)
- Adhesion
- No adhesion promoter is discussed. Adhesion is stated for vendor copper, electroless and panel-plated copper (as plated or scrubbed with pumice and brush) and microetched copper, with a request for thorough cleaning (Process Information, Surface preparation, p.2).
Soft bake
- Soft bake
- Not published — characterize on-tool
- Notes
- No bake between lamination and exposure; the film is exposed after the post-lamination hold.
SOURCE: Process Information, p.2-3 -- lamination and hold time lead directly to exposure
Exposure dose
Ordyl P50000's dose is published per sheet thickness, not as a single number. Read the row for the sheet you laminate and run a dose array around it.
- As published
- Dose follows the sheet: 120-150 mJ/cm² for the 100 µm film and 150-180 mJ/cm² for the 125 µm film, each set to 8 solid steps on a Stouffer 21-step tablet, with a 360-380 nm lamp or laser.
| Sheet | Dose |
|---|---|
| 100 µm | 120–150 mJ/cm² |
| 125 µm | 150–180 mJ/cm² |
SOURCE: Exposure table 'Energy (mJ/cm2)', p.3, columns P50100 /…
Exposure table 'Energy (mJ/cm2)', p.3, columns P50100 / P50125, 'referred to 8 Solid STEP of SST21'. The table carries no single wavelength; the text above it recommends lamps or a laser with an emission peak at 360-380 nm, so no wavelength is given here.
Development
- Developer
- Na2CO3 0.8-1.2 % (optimum 0.9 %, 29 °C) or K2CO3 0.6-1.0 % (optimum 0.8 %, 28 °C)
- Method
- spray
- Rinse
- Water rinse at 9-15 °dH (150-250 ppm CaCO3; optimum 12 °dH, 213 ppm), 15-25 °C with 20 °C optimum, in a rinse module at least two thirds as long as the developing module.
- Developer family
- Buffered alkaline
Not published for this resist: Dilution, Time — characterize on-tool.
SOURCE: Developing and Developing time tables, p.3
Hard bake, etch & strip
- Stripper
- Strip in NaOH or KOH, 1.0-3.0 %, at 40-60 °C with 1.5-4.0 bar (22-58 psi) spray pressure and a 40-60 % break point; Ordyl Antifoam C is recommended. Dip-test strip times in 3.0 % NaOH at 50 °C: P50100 about 150 s, P50125 about 200 s. A proprietary stripper (Ordyl Stripper 5600) is offered for smaller flakes, faster strip, and less copper oxidation or tin / tin-lead attack. (Stripping, p.4.)
Not published for this resist: Hard bake, Descum, Etch resistance, Storage — characterize on-tool.
SOURCE: Whole data sheet -- no hardbake or post-develop bake appears
Where it's used
Practical notes from the datasheet
P50000 exists to avoid double-laminating a standard dry film. At 100 or 125 µm it is thicker than anything else on the Ordyl sheets here, and the data sheet credits a special photoinitiator system for curing through the full depth even above 100 µm. Named uses are copper, tin and tin/lead plating and packaging, i.e. thick-deposit direct plating rather than etch resist; unlike its thinner siblings the sheet does not list etching or tenting. The only resolution figures are the sheet thicknesses themselves (100 and 125 µm), so this is not a fine-line film. Storage conditions are given in a separate Ordyl specification form, not in this sheet.
Troubleshooting
Common failure modes for Ordyl P50000, answered from the manufacturer's datasheet and application notes. These are starting points — your substrate, tooling and environment shift the specifics, so calibrate on-tool.
A P50000 panel has to wait a few days between lamination and exposure. Any precautions?
The sheet allows up to one week after lamination. Past 72 hours it asks for the board to be covered with black polyethylene so yellow light does not reach the film. It also wants at least 20 minutes after lamination, or until the panel is back at room temperature, before you expose.
SOURCE: Elga Europe, Ordyl P50000 Product Data Sheet Ed. 05 (28 August 2019) -- Post lamination Hold Time, p.2
Sources & disclaimer
- Elga Europe — Ordyl P50000 datasheet (Edition 05 -- 28 August 2019 (printed on every page of the PDF)) · accessed 2026-10-15
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-10-15.