https://nanyte.com/photoresists/ordyl-fp-400 · last updated 2026-10-15
- Manufacturer
- Elga Europe
- Tone
- negative
- Thickness
- 15–50 µm
- Developer
- Na2CO3 0.8-1.2 % (optimum 0.9 %, 29 °C) or K2CO3 0.6-1.0 % (optimum 0.8 %, 28 °C)
- Applications
- Etch mask · Electroplating / molding
Cross-checked — the spin curve (where published) and the single-value figures were read twice, independently, from the datasheet, with any disagreement settled against it.
- Substrate
- Resist
- Exposed
Coating — dry-film lamination
Ordyl FP 400 is supplied as a pre-cut dry-film sheet and applied by hot-roll lamination — it is not spin-coated. Thickness is fixed per sheet, 15–50 µm, selected by sheet rather than by spin speed.
- FP 400 is laminated to the panel with a hot-roll laminator, so there is no spin step and the sheet fixes the thickness.
- Panels must be bone dry first.
- Manual laminator: hot roll 105-125 °C, roll pressure 2.5-3.5 bar (36-50 psi), 1-3 m/min (3-10 ft/min), pre-heat optional.
- Automatic laminator: same roll temperature and speed, roll pressure 2.5-6.0 bar (36-87 psi), plus a seal step at 40-80 °C, 3.0-6.0 bar (44-87 psi) for 1-4 s.
- Panels should leave the laminator at 50-70 °C (inner layer) or 45-60 °C (outer layer).
- Hold the panel at least 20 min after lamination, or longer if it has not yet cooled to room temperature, but not beyond 1 week.
- (Process Information, Lamination, Board exit temperature and Post lamination Hold Time, p.4.)
- Adhesion
- No adhesion promoter is discussed. The sheet lists the copper surfaces it adheres to: vendor copper, electroless and panel-plated copper (as plated or pumice-and-brush scrubbed), and microetched copper, and asks for thorough cleaning before lamination (Process Information, Surface preparation, p.4).
Soft bake
- Soft bake
- Not published — characterize on-tool
- Notes
- There is no bake between lamination and exposure. The film is used as laminated, after the hold period described under lamination.
SOURCE: Process Information, p.4-5 -- the data sheet goes from lamination and hold time straight to exposure
Exposure dose
Ordyl FP 400's dose is published per sheet thickness, not as a single number. Read the row for the sheet you laminate and run a dose array around it.
- As published
- Dose follows the sheet: 150-200 mJ/cm² for the 15 µm film up to 300-350 mJ/cm² for the 50 µm film, each set to 6 solid steps on a Stouffer 21-step tablet, with a 360-380 nm lamp or laser.
| Sheet | Dose |
|---|---|
| 15 µm | 150–200 mJ/cm² |
| 25 µm | 180–230 mJ/cm² |
| 40 µm | 200–250 mJ/cm² |
| 50 µm | 300–350 mJ/cm² |
SOURCE: Exposure table 'Energy (mJ/cm2)', p.5, columns FP 415 / FP 425…
Exposure table 'Energy (mJ/cm2)', p.5, columns FP 415 / FP 425 / FP 440 / FP 450, 'referred to 6 Solid STEP of SST21'. The table carries no single wavelength; the surrounding text recommends lamps or a laser with an emission peak at 360-380 nm, so no wavelength is given here. Column-to-thickness pairing follows the product numbering (see thickness note).
Development
- Developer
- Na2CO3 0.8-1.2 % (optimum 0.9 %, 29 °C) or K2CO3 0.6-1.0 % (optimum 0.8 %, 28 °C)
- Method
- spray
- Rinse
- Water rinse, 9-15 °dH (150-250 ppm CaCO3; optimum 12 °dH, 213 ppm) at 15-25 °C (optimum 20 °C), in a rinse module at least two thirds as long as the developing module.
- Developer family
- Buffered alkaline
Not published for this resist: Dilution, Time — characterize on-tool.
SOURCE: Developing and Developing time tables, p.5
Hard bake, etch & strip
- Stripper
- Strip in NaOH or KOH, 1.0-3.0 %, at 40-60 °C with a spray pressure of 1.5-4.0 bar (22-58 psi) and a break point of 40-60 %; Ordyl Antifoam C is recommended. Dip-test stripping times in 3.0 % NaOH at 50 °C: FP 415 about 50 s, FP 425 about 120 s, FP 440 about 240 s, FP 450 about 360 s. A proprietary stripper (Ordyl Stripper 5600) is offered for smaller flakes, faster stripping and less copper oxidation or tin / tin-lead attack. (Stripping, p.6.)
Not published for this resist: Hard bake, Descum, Etch resistance, Storage — characterize on-tool.
SOURCE: Whole data sheet -- no hardbake or post-develop bake appears
Where it's used
Practical notes from the datasheet
FP 400 is the fine-line member of Elga's Ordyl dry-film range. Elga says it resolves down to a 1:2 ratio, meaning a 40 µm film holds 20 µm lines, and gives resolution per sheet: below 10 µm on FP 415, 15 µm on FP 425, 20 µm on FP 440 and 25 µm on FP 450 (Exposure table, p.5). The same sheet notes that tenting over large tooling holes works from 40 µm film upward. Listed uses are acid etching, tenting and copper, tin and tin/lead plating, and the film is described as resisting leaching in the plating baths common in PCB shops. Development and stripping both use mild alkali, so there are no solvents to handle. Everything here was written for copper-clad panels on production lamination, spray develop and spray strip lines; a bench user will need to translate the spray-pressure and break-point figures to whatever develop setup they have. Storage conditions are not in this sheet, which points to a separate Ordyl specification form.
Troubleshooting
Common failure modes for Ordyl FP 400, answered from the manufacturer's datasheet and application notes. These are starting points — your substrate, tooling and environment shift the specifics, so calibrate on-tool.
Can I leave laminated or exposed FP 400 panels sitting before the next step?
Yes, within limits. After lamination, hold the panel at least 20 minutes (long enough to reach room temperature) and no more than a week. After exposure, hold at least 15 minutes before developing. The sheet gives no upper limit for the post-exposure hold.
SOURCE: FP 400 Product Data Sheet
Elga Europe, Ordyl FP 400 Product Data Sheet Ed. 05 (28 August 2019) -- Post lamination Hold Time, p.4; Hold Time after exposure, p.5
Sources & disclaimer
- Elga Europe — Ordyl FP 400 datasheet (Edition 05 -- 28 August 2019 (printed on every page of the PDF)) · accessed 2026-10-15
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-10-15.