https://nanyte.com/photoresists/ordyl-am-900 · last updated 2026-10-15
- Manufacturer
- Elga Europe
- Tone
- negative
- Thickness
- 30–75 µm
- Developer
- Na2CO3 0.8-1.2 % (optimum 0.9 %) or K2CO3 0.6-1.0 % (optimum 0.8 %)
- Applications
- Etch mask · Electroplating / molding
Cross-checked — the spin curve (where published) and the single-value figures were read twice, independently, from the datasheet, with any disagreement settled against it.
- Substrate
- Resist
- Exposed
Coating — dry-film lamination
Ordyl AM 900 is supplied as a pre-cut dry-film sheet and applied by hot-roll lamination — it is not spin-coated. Thickness is fixed per sheet, 30–75 µm, selected by sheet rather than by spin speed.
- A hot-roll laminated sheet, so there is no spin step and thickness is whatever grade you buy.
- Panels go in completely dry.
- Hot roll 105-125 °C at 1-3 m/min (3-10 ft/min) on both manual and automatic machines
- roll pressure 2.5-3.5 bar (35-50 psi) manual, 2.5-6.0 bar (35-85 psi) automatic; pre-heat is optional.
- Automatic lines add a seal stage: 40-80 °C, 3.0-6.0 bar, 1-4 s.
- Board exit temperature is 50-70 °C on inner layers and 45-60 °C on outer layers.
- Leave the panels at least 20 min after lamination, or at least as long as they need to cool to room temperature.
SOURCE: 'Lamination', 'Board exit temperature' and 'Post lamination Hold Time', p.2.
- Adhesion
- No adhesion promoter is called for. The sheet is stated to hold on vendor copper, electroless and panel-plated copper (as received or pumice/brush scrubbed) and on microetched copper, with a general instruction to clean the surface well first (Surface preparation, p.2). Nothing is said about silicon, glass or other non-PCB substrates.
Soft bake
- Soft bake
- Not published — characterize on-tool
- Notes
- No bake between lamination and exposure. The only wait specified is the post-lamination hold (at least 20 min, or the time panels need to reach room temperature).
SOURCE: Process information, p.2 (Lamination / Post lamination Hold Time)
Exposure dose
Ordyl AM 900's dose is published per sheet thickness, not as a single number. Read the row for the sheet you laminate and run a dose array around it.
- Dose at 365 nm
- Not published — characterize on-tool
- As published
- Dose follows the sheet, with a 405 nm source: 14-20 mJ/cm² for the 30 µm grade, 18-24 for 50 µm and 35-45 for 75 µm, each set to 6-7 solid steps on a Stouffer 21 tablet.
| Sheet | Dose |
|---|---|
| 30 µm | 14–20 mJ/cm² |
| 40 µm | 16–22 mJ/cm² |
| 50 µm | 18–24 mJ/cm² |
| 60 µm | 22–28 mJ/cm² |
| 75 µm | 35–45 mJ/cm² |
SOURCE: Exposure table, p.3 ('Energy (mJ/cm2)': AM 930 14-20, AM 940…
Exposure table, p.3 ('Energy (mJ/cm2)': AM 930 14-20, AM 940 16-22, AM 950 18-24, AM 960 22-28, AM 975 35-45), read against the sheet thicknesses in the table's 'Resolution' row (30, 40, 50, 60, 75 µm). The table sits directly under the Exposure section's recommendation of sources with a 405 nm emission peak (or dual-wavelength systems that include 405 nm), so it is attributed to 405 nm.
Development
- Developer
- Na2CO3 0.8-1.2 % (optimum 0.9 %) or K2CO3 0.6-1.0 % (optimum 0.8 %)
- Method
- spray
- Rinse
- Water rinse of 9-15 °dH hardness (150-250 ppm CaCO3, optimum 12 °dH), preferably at 15-25 °C (optimum 20 °C), in a rinse module at least two thirds as long as the developer module.
- Developer family
- Buffered alkaline
Not published for this resist: Dilution, Time — characterize on-tool.
SOURCE: Developing, p.3 (conditions table, 'Developing time (B.P. 60%)' table, dry-film load and antifoam notes)
Hard bake, etch & strip
- Etch resistance
- Named uses are acid etching and tenting, including tenting over large tooling holes from the 40 µm grade up. No etchant chemistry or etch-time figures are given.
- Stripper
- Strips in NaOH or KOH at 1.0-3.0 %, 40-60 °C, 1.5-4.0 bar (22-58 psi) spray, break point 40-60 %, with an antifoam. A proprietary stripper (Ordyl Stripper 5600) is suggested where smaller flakes, faster stripping or less copper oxidation and tin or tin/lead attack matter.1
Not published for this resist: Hard bake, Descum, Storage — characterize on-tool.
Where it's used
Practical notes from the datasheet
AM 900 is the 405 nm-first member of the Ordyl PCB film range: the datasheet names 405 nm sources and dual-wavelength tools (when one line is 405 nm) as the recommended exposure, while still allowing ordinary UV lamps. It is a copper-board resist, not a general-purpose one. The surface list is all copper variants, the applications are acid etching, tenting and copper, tin and tin/lead plating, and doses are pinned to step tablets (Stouffer 21 at 6-7 steps) rather than to a measured film response. Dose rises with sheet thickness, from 14-20 mJ/cm² at 30 µm to 35-45 mJ/cm² at 75 µm, and develop time stretches from 25 s to 90 s over the same grades. No spin, bake, storage-life or non-copper substrate data are published, and the sheet refers to a separate Ordyl Specification form for storage and packaging. The lamination table is for panel lines (hot-roll, seal, exit temperature), not for a wafer-format laminator.
Sources & disclaimer
- Elga Europe — Ordyl AM 900 datasheet (Edition 05 - 28 August 2019 (form EE.P32.AT.01-02, 5 pages)) · accessed 2026-10-15
- Stripping, p.4.
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-10-15.