https://nanyte.com/photoresists/ordyl-am-100di · last updated 2026-10-15
- Manufacturer
- Elga Europe
- Tone
- negative
- Thickness
- 20–60 µm
- Developer
- Na2CO3 0.8-1.2 % (optimum 0.9 %) or K2CO3 0.6-1.0 % (optimum 0.8 %)
- Applications
- Etch mask · Electroplating / molding
Cross-checked — the spin curve (where published) and the single-value figures were read twice, independently, from the datasheet, with any disagreement settled against it.
- Substrate
- Resist
- Exposed
Coating — dry-film lamination
Ordyl AM 100DI is supplied as a pre-cut dry-film sheet and applied by hot-roll lamination — it is not spin-coated. Thickness is fixed per sheet, 20–60 µm, selected by sheet rather than by spin speed.
- Hot-roll lamination onto dry panels, with no spin step.
- Hot roll 105-125 °C at 1-3 m/min (3-10 ft/min) on manual and automatic machines alike
- roll pressure 2.5-3.5 bar (36-50 psi) manual or 2.5-6.0 bar (36-87 psi) automatic; pre-heat optional.
- An automatic line also seals at 40-80 °C, 3.0-6.0 bar (44-87 psi) for 1-4 s.
- Board exit temperature is 50-70 °C on inner layers and 45-60 °C on outer layers.
- Hold panels at least 20 min after lamination (or as long as they need to cool to room temperature) and no longer than 48 h.
SOURCE: Lamination, 'Board exit temperature' and 'Post lamination Hold Time', p.2.
- Adhesion
- The film carries its own adhesion promoter; no separate primer is called for. Stated to hold on vendor copper, electroless and panel-plated copper (as received or pumice/brush scrubbed), direct-metallization surfaces and microetched copper, after a good cleaning (Surface preparation, p.2). For Cu-to-Cu adhesion in galvanic plating the sheet strongly recommends an acid cleaner followed by a microetch in H2SO4 at 5-10 vol % in the pre-plate line (Note, p.4).
Soft bake
- Soft bake
- Not published — characterize on-tool
- Notes
- There is no bake between lamination and exposure. The wait that is specified is the post-lamination hold of at least 20 min (maximum 48 h).
SOURCE: Process information, p.2 (Lamination / Post lamination Hold Time)
Exposure dose
Ordyl AM 100DI's dose is published per sheet thickness, not as a single number. Read the row for the sheet you laminate and run a dose array around it.
- As published
- Dose follows the sheet: 12-18 mJ/cm² for 20 µm, 20-25 for 40-50 µm and 25-30 for 60 µm, all held to 8 solid steps on a Stouffer 21 tablet.
| Sheet | Dose |
|---|---|
| 20 µm | 12–18 mJ/cm² |
| 30 µm | 15–20 mJ/cm² |
| 40 µm | 20–25 mJ/cm² |
| 50 µm | 20–25 mJ/cm² |
| 60 µm | 25–30 mJ/cm² |
SOURCE: Exposure table, p.3 ('Energy (mJ/cm2)': AM 120DI 12-18, AM…
Exposure table, p.3 ('Energy (mJ/cm2)': AM 120DI 12-18, AM 130DI 15-20, AM 140DI 20-25, AM 150DI 20-25, AM 160DI 25-30), read against the sheet thicknesses in the table's 'Resolution' row (20, 30, 40, 50, 60 µm). All referred to 8 solid steps of a Stouffer SST21. The table has no wavelength label; the section above it recommends UV lamps or laser sources peaking at 360-405 nm.
Development
- Developer
- Na2CO3 0.8-1.2 % (optimum 0.9 %) or K2CO3 0.6-1.0 % (optimum 0.8 %)
- Method
- spray
- Rinse
- Water rinse of 9-15 °dH hardness (150-250 ppm CaCO3, optimum 12 °dH), preferably at 15-25 °C (optimum 20 °C), in a rinse module at least two thirds the length of the developer module.
- Developer family
- Buffered alkaline
Not published for this resist: Dilution, Time — characterize on-tool.
SOURCE: Developing, p.4 (conditions table, 'Developing time (B.P. 60%)' table, dry-film load and antifoam notes)
Hard bake, etch & strip
- Etch resistance
- Listed for acid and alkaline etching and for tenting, which the sheet says works over large tooling holes from the 40 µm grade up. No etchant chemistry or etch-time figures are given.
- Stripper
- Strips in NaOH or KOH at 1.0-3.0 %, 40-60 °C, 1.5-4.0 bar (22-58 psi) spray, break point 40-60 %, with an antifoam. A laboratory dipping chart on p.5 plots strip time and chip size against NaOH concentration for each grade (read it there; no table of values is printed). A proprietary stripper (Ordyl Stripper 5600) is suggested for smaller flakes and less copper oxidation or tin/lead attack.1
Not published for this resist: Hard bake, Descum, Storage — characterize on-tool.
Where it's used
Practical notes from the datasheet
AM 100DI is the Ordyl grade written explicitly for LDI: the datasheet says it was designed for laser direct imaging, claims through-cure with LDI machines above 50 µm resist thickness, and still allows standard UV lamps. It adds a built-in adhesion promoter, a plating list that runs to nickel and gold as well as copper and tin or tin/lead, and alkaline as well as acid etching. The 20 µm grade, shown in a 20 µm line/space SEM on p.3, is the fine-line option. Doses run from 12-18 mJ/cm² at 20 µm to 25-30 at 60 µm, referred to 8 solid steps of a Stouffer 21 tablet (the 405 nm-first AM 900 sheet uses 6-7 steps), so tables from the two datasheets are not interchangeable. No storage life, spin, bake or non-PCB substrate data are given; the sheet defers storage to a separate Ordyl Specification form.
Troubleshooting
Common failure modes for Ordyl AM 100DI, answered from the manufacturer's datasheet and application notes. These are starting points — your substrate, tooling and environment shift the specifics, so calibrate on-tool.
Copper-to-copper adhesion is poor after plating. What does the datasheet change?
For the galvanic step the sheet strongly recommends putting an acid cleaner and a microetch in the pre-plate line, the microetch being sulphuric acid at 5-10 % by volume. It also asks for a well-cleaned surface before lamination, and notes the film already contains an adhesion promoter, so a separate primer is not the route it suggests.
SOURCE: AM 100DI Product Data Sheet
Elga Europe, Ordyl AM 100DI Product Data Sheet, Ed. 09 (28 August 2019) - Note, p.4; Surface preparation, p.2; Product Description, p.1
Sources & disclaimer
- Elga Europe — Ordyl AM 100DI datasheet (Edition 09 - 28 August 2019 (form EE.P32.AT.01-02, 6 pages)) · accessed 2026-10-15
- Stripping, p.5.
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-10-15.