https://nanyte.com/photoresists/nr9-8000 · last updated 2026-10-15
- Manufacturer
- Futurrex, Inc.
- Tone
- negative
- Thickness
- 6.7–100 µm
- Exposure dose
- 21 mJ/cm² at 365 nm (per µm of film thickness)
- Developer
- Resist Developer RD6
- Applications
- Etch mask
Cross-checked — the spin curve (where published) and the single-value figures were read twice, independently, from the datasheet, with any disagreement settled against it.
- Substrate
- Resist
- Exposed
Spin coating
Data points
| Series | rpm | µm |
|---|---|---|
| NR9-8000 | 210 | 100 |
| 320 | 60 | |
| 750 | 33 | |
| 1000 | 17 | |
| 2000 | 9.5 | |
| 3000 | 8.2 | |
| 4000 | 6.7 |
Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool.
numeric table 'Film thickness' with spin speed, spin time, soft-bake and post-exposure bake columns, p.1 of Futurrex NR9-8000 Technical Information. Each point is the midpoint of the printed nm range, converted to µm. Printed ranges: 210 rpm = 95000-105000 nm, 320 rpm = 55000-65000 nm, 750 rpm = 30000-35000 nm, 1000 rpm = 16500-17500 nm, 2000 rpm = 9000-10000 nm, 3000 rpm = 8000-8300 nm, 4000 rpm = 6500-6800 nm. The rows differ in spin time (30 s at 210 and 320 rpm, 40 s above) and soft-bake schedule, so this is a process table rather than one fixed-condition curve.
- Spin time is 30 s at 210 and 320 rpm and 40 s from 750 rpm up.
- The soft bake changes with thickness: the 210 rpm coat gets 360 s at 70 °C then 180 s at 150 °C, the 320 rpm coat 360 s at 70 °C then 120 s at 150 °C, the 750 rpm coat 180 s at 70 °C then 120 s at 150 °C, and the 1000–4000 rpm coats a single 120 s at 150 °C. Edge Bead Remover EBR2 is dispensed on both faces of the spinning substrate through nozzles 0.5–1.0 cm from the edge as soon as the bead forms, 3–5 s after the resist dispense stops.
- The bake times assume substrates that conduct heat well (Si, GaAs, InP); multiply them by 3.5 for poor conductors such as glass.
- Adhesion
- Not addressed in this datasheet.
Soft bake
- Soft bake
- 150 °C · 2 min · hotplate
- Notes
- Single 120 s bake at 150 °C for the 1000–4000 rpm coats (about 6.7–17 µm). Thicker coats use a two-step bake, 70 °C first and then 150 °C: 360 s + 180 s at 210 rpm, 360 s + 120 s at 320 rpm, 180 s + 120 s at 750 rpm. For poor thermal conductors such as glass, multiply bake times by 3.5.
SOURCE: Properties table (soft-bake columns), p.1, and Processing step 3, p.2 of Futurrex NR9-8000 Technical Information
Exposure dose
The manufacturer publishes 21 mJ/cm² at 365 nm (per µm of film thickness). Dose scales with film thickness and depends on your optics, so treat it as a starting point and run a dose array.
- Dose at 365 nm
- 21 mJ/cm² (per µm of film thickness)
- Dose at 405 nm
- Not published — characterize on-tool
- As published
- Dose scales with thickness at 21 mJ/cm² per µm of film at 365 nm, so an 8 µm coat works out to 168 mJ/cm² and a 100 µm coat to 2100 mJ/cm². No h-line figure is given.
- Post-exposure bake
- 100 °C · 60 s
SOURCE: NR9-8000 Technical Information
Properties, p.1 of Futurrex NR9-8000 Technical Information: 'Sensitivity at 365 nm exposure wavelength (mJ/cm² for 1 µm thick film) 21'; Processing step 4, p.2: multiply resist thickness (µm) by 21 mJ/cm²
Development
- Developer
- Resist Developer RD6
- Method
- spray or immersion at 20-25 °C
- Rinse
- Deionized water rinse until water resistivity reaches the prescribed limit (Processing step 7).
- Developer family
- TMAH-based
Not published for this resist: Dilution, Time — characterize on-tool.
SOURCE: Processing steps 6-7, p.2 of Futurrex NR9-8000 Technical Information
Hard bake, etch & strip
- Etch resistance
- "Superior selectivity in RIE process" (Description, p.1); no etch rates are published.
- Stripper
- Resist Remover RR4 or acetone (Processing step 9, p.2).
- Storage
- "Guaranteed shelf life at 25°C storage (years) 3" (Properties, p.1); "shelf life exceeding 3 years at room temperature storage" (Description, p.1).
Not published for this resist: Hard bake, Descum — characterize on-tool.
Where it's used
Practical notes from the datasheet
NR9-8000 is the thick-film grade of Futurrex's NR9 negative family, 39–43 % solids in cyclohexanone, and the sheet pairs each coat with its own bake schedule: a single 150 °C softbake from about 17 µm down, a two-step 70 °C then 150 °C softbake for 30 µm and thicker, and a PEB at 100 °C that stretches to 120 s for the thickest 100 µm coat. Exposure is a straight rule of 21 mJ/cm² per micrometre at 365 nm, which is low for a thick resist; the sheet quotes high photospeed and superior RIE selectivity as selling points. Develop time grows with thickness, 40 s at 8 µm to 330 s at 100 µm in RD6. Temperature resistance is quoted up to 100 °C. Note that spin time changes within the table (30 s for the two thickest coats, 40 s elsewhere), so rpm alone does not reproduce a row.
Troubleshooting
Common failure modes for NR9-8000, answered from the manufacturer's datasheet and application notes. These are starting points — your substrate, tooling and environment shift the specifics, so calibrate on-tool.
How do I work out the exposure time for NR9-8000?
Multiply the resist thickness in µm by 21 mJ/cm² to get the dose, then divide by the 365 nm intensity in mW/cm², measured with a proper gauge, to get seconds. The sheet asks for the intensity to be measured at 365 nm specifically.
SOURCE: Futurrex NR9-8000 Technical Information — Processing step 4, p.2
How long does NR9-8000 take to develop?
In RD6 by spray or immersion at 20-25 °C the sheet gives 40 s for an 8 µm film and 330 s for a 100 µm film, followed by a deionized water rinse. It prints no other thicknesses, so plan on checking intermediate films yourself.
SOURCE: Futurrex NR9-8000 Technical Information — Processing steps 6-7, p.2
Do the bakes change for thick NR9-8000 coats or on glass?
Yes on both counts. The soft bake switches to a 70 °C step followed by 150 °C below about 1000 rpm (thicker than roughly 17 µm), and the PEB runs 120 s on the thickest coat. For poor thermal conductors such as glass, multiply every bake time by 3.5.
SOURCE: Futurrex NR9-8000 Technical Information — Properties table, p.1, and Processing note, p.2
Sources & disclaimer
- Futurrex, Inc. — NR9-8000 datasheet · accessed 2026-10-15
- https://nrf.aux.eng.ufl.edu/_files/msds/2/Resist%20Developer%20RD6.pdf — Futurrex's material safety data sheet for Resist Developer RD6 (dated 2009, hosted by the University of Florida Nanoscale Research Facility): gives the composition as 97-98 % water and 2-3 % tetramethylammonium hydroxide. The resist datasheet names RD6 but never states its chemistry.
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-10-15.