https://nanyte.com/photoresists/kl-6000 · last updated 2026-07-10
- Manufacturer
- KemLab Inc.
- Tone
- positive
- Thickness
- 2.5–12 µm
- Developer
- 0.26N TMAH
- Applications
- Etch mask · General prototyping
Cross-checked — two independent extractions agree.
Spin coating
KemLab KL 6000 series is spin-coated to 2.5–12 µm. The curve below is redrawn from the manufacturer's published data — read your target thickness off the vertical axis and take the matching spin speed as a starting point.
Data points
| Series | rpm | µm |
|---|---|---|
| KL6008 | 1000 | 10 |
| 2000 | 7.0 | |
| 3000 | 5.7 | |
| 4000 | 5.0 | |
| 5000 | 4.4 | |
| KL6005 | 1000 | 7.3 |
| 2000 | 5.2 | |
| 3000 | 4.2 | |
| 4000 | 3.6 | |
| 5000 | 3.2 | |
| KL6003 | 1000 | 5.1 |
| 2000 | 3.6 | |
| 3000 | 2.9 | |
| 4000 | 2.5 | |
| 5000 | 2.2 |
Values are the manufacturer's starting points, not a guarantee; verify on your own tool. Characterize on-tool. Series digitized from a published figure were independently cross-checked by a second blind read; treat those values as approximate (±10 %).
KL6008: read from figure 'KL6000 Spin Curve', p.2 of KL 6000 series TDS — identified by legend marker/color (blue diamonds = KL6008) on the combined three-curve chart; topmost curve, consistent with KL6008 having the largest stated film-thickness range (5-12+ µm).
KL6005: read from figure 'KL6000 Spin Curve', p.2 of KL 6000 series TDS — identified by legend marker/color (red squares = KL6005) on the combined three-curve chart; middle curve, consistent with the stated 4-7 µm range.
KL6003: read from figure 'KL6000 Spin Curve', p.2 of KL 6000 series TDS — identified by legend marker/color (purple triangles = KL6003) on the combined three-curve chart; bottom curve, consistent with the stated 2.5-4.5 µm range.
Coat program includes a 5-10 second spread cycle (longer for thicker films); spin time at final speed is 45 seconds. Spin curves determined on 6-inch Si with static dispense of ~4 mL of KL6000 photoresist (TDS p.2, Spin Coat). The TDS also publishes a fine-tuning formula for thickness under 10 µm: New Spin Speed = Spin Speed x (measured film thickness / desired film thickness)^2. No explicit edge-bead-removal step is published.
- Adhesion
Soft bake
- Soft bake
- 105 °C · 2 min · hotplate
- Notes
SOURCE: Soft Bake section, p.2 of KL 6000 series TDS ('Typical bake time is 120 seconds'); per-thickness table values on p.1 Process Guide.
Exposure dose
The manufacturer does not publish a clearing dose for KemLab KL 6000 series. Determine it with a dose array on your own tool.
- As published
- Post-exposure bake
- 90 °C · 1.5 min
Not published for this resist: Dose at 365 nm, Dose at 405 nm — characterize on-tool.
Development
- Developer
- 0.26N TMAH
- Developer family
- TMAH-based
Not published for this resist: Dilution, Time, Method, Rinse — characterize on-tool.
SOURCE: Process Guide table, p.1, and Develop section, p.3 of KL 6000 series TDS
Hard bake, etch & strip
- Etch resistance
- Wet chemical etchants for Au, Cu, Cr, Al, etc. do not degrade patterns made with KL6000 (TDS p.3, Etch Resist).
- Stripper
- Storage
- Store upright in tightly closed containers at 40-70°F (4-21°C), away from oxidizers, acids, bases and ignition sources (TDS p.3, Storage).
Not published for this resist: Hard bake, Descum — characterize on-tool.
Where it's used
KL6000 is a series of three grades (KL6008, KL6005, KL6003) sharing one thick-film process family, with the Process Guide table demonstrating four representative thickness/process points: 11 µm and 8 µm on KL6008, 5 µm on KL6005, and 3 µm on KL6003 (softbake 90-150 s at 105°C, broadband dose 90-210 mJ/cm2, develop 45-90 s by spray puddle, scaling with thickness). PEB is explicitly optional and not required for most applications — a notable process simplification versus thinner i-line resists. As a thick single-coat resist, edge-bead buildup and softbake solvent retention are the process risks most worth re-verifying on-tool for the thickest (KL6008) grade; the datasheet itself flags that longer softbake helps drive solvent out of thicker films. Dill optical parameters at 365 nm (A=0.371 µm-1, B=0.075 µm-1, C=0.036 cm2/mJ) are published for lithography simulation. Etch resistance to common wet metal etchants (Au, Cu, Cr, Al) is explicitly claimed by the manufacturer. KemLab family SDS data (e.g. the sibling KL5300 MSDS) suggests a DNQ-novolak chemistry consistent with KL6000's product category, but no directly-verifiable KL6000-specific source could be opened during this pass, so the classification is withheld (chemistry review 2026-07-12).
Sources & disclaimer
- KemLab Inc. — KemLab KL 6000 series datasheet (not stated — no revision or copyright date is printed anywhere in this TDS; the only certification mark present is an ISO 9001:2015 seal on the final page.) · accessed 2026-07-10
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-07-10.