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ma-N 440 process recipe

The 4 µm grade of micro resist technology's ma-N 400 negative-tone series: 4.1 µm at 3000 rpm for 30 s, falling from about 7 µm at 1000 rpm to under 3 µm at 6000 rpm, rated for 300–380 nm exposure and for etch masks and lift-off, with aqueous alkaline development.

https://nanyte.com/photoresists/ma-n-440 · last updated 2026-10-15

At a glance
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Manufacturer
micro resist technology
Tone
negative
Thickness
2.9–7.1 µm
Applications
Etch mask · Lift-off

Cross-checked — the spin curve (where published) and the single-value figures were read twice, independently, from the datasheet, with any disagreement settled against it.

  1. Coat
    2.9–7.1 µm
  2. Expose
  3. Develop
  • Substrate
  • Resist
  • Exposed
The exposed resist stays after development with an undercut sidewall — the overhang a lift-off needs; the unexposed film dissolves. Schematic cross-sections for ma-N 440 — feature width, film aspect ratio and sidewall angle are illustrative, not to scale.
—01 / Coating

Spin coating

Spin curve for ma-N 440: film thickness in µm against spin speed in rpm.23456781k2k3k4k5k6kSPIN SPEED (rpm)THICKNESS (µm)
Data points
ma-N 440 — film thickness (µm) by spin speed (rpm)
Seriesrpmµm
ma-N 44010007.1
20005.0
30004.1
40003.5
50003.1
60002.9

Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool. Series digitized from a published figure are approximate (±10 %).

read from figure — the ma-N 400 spin-speed chart on p.1 of micro resist technology's 'ma-N 400 and ma-N 1400 - Negative Tone Photoresists' sheet (film thickness 0–14 µm vs spin speed in min⁻¹, 1000–6000, linear axes), trace identified by legend as the red line 'ma-N 440', second from the top below ma-N 490. The chart is drawn as vector lines with no point markers, so the trace can be read exactly where it crosses each 1000 rpm gridline; nothing is read beyond the plotted 1000–6000 rpm. The thickness axis was checked against the sheet's own table: the same chart reads 4.07 µm for ma-N 440 at 3000 rpm against the table's 4.1 µm, and 7.4 µm for ma-N 490 against 7.5 µm. The chart does not print a spin time; the table's 4.1 µm is for 30 s.

Redrawn from the manufacturer's published data — hover to read between points, click to pin.
  • The sheet's only coating condition is the reference spin of 3000 rpm for 30 s, which gives 4.1 µm for this grade; the chart beside it plots 1000–6000 rpm without stating a spin time.
  • There is no dispense volume, acceleration, edge-bead step or substrate preparation on the sheet.
  • At the 4.1 µm reference the film is thicker than the 2 µm films shown in the sheet's profile photographs, so use the curve as a starting point and measure on your own coater.
Adhesion
Not addressed on the sheet.
—02 / Bake

Soft bake

Soft bake
Not published — characterize on-tool
—03 / Exposure

Exposure dose

No dose is published for ma-N 440 or any ma-N 400 grade. The sheet gives a sensitivity window of 300–380 nm, which covers the i-line but ends below 405 nm. Run a dose array on your own tool to land the working dose.

Not published for this resist: Dose at 365 nm, Dose at 405 nm — characterize on-tool.

—04 / Development

Development

Not published for this resist: Developer, Dilution, Time, Method, Rinse — characterize on-tool.

SOURCE: Unique features, p.1: 'Aqueous alkaline development'

—05 / Post-processing

Hard bake, etch & strip

Etch resistance
The sheet lists high wet and dry etch resistance and names use as an etch mask for semiconductors and metals. No etch rates are published.

Not published for this resist: Hard bake, Descum, Stripper, Storage — characterize on-tool.

—06 / Applications

Where it's used

Practical notes from the datasheet

ma-N 440 is the second-thickest of the five ma-N 400 grades on the sheet (ma-N 405, 415, 420, 440, 490: 0.5, 1.5, 2.0, 4.1 and 7.5 µm at 3000 rpm for 30 s). The series is a negative-tone resist with aqueous alkaline development, good thermal stability of the pattern and a tunable profile from vertical to undercut. The sheet rates the ma-N 400 pattern stable up to 110 °C, enough for metal evaporation; the sturdier 160 °C figure that adds sputtering belongs to the ma-N 1400 series, not this one. Listed uses are microelectronics and microsystems, a mask for lift-off, an etch mask for semiconductors and metals, and implantation. The only profile data are photographs of a 2 µm ma-N 400 film: after 90 s of development there is no undercut, after 100 s about 0.5 µm and after 140 s about 1.5 µm. Those are for a thinner grade, with the developer and bakes unstated, so they show the trend, not a recipe for a 4.1 µm film. Soft bake, exposure dose, post-exposure bake and developer are not on the sheet.

—07 / Troubleshooting

Troubleshooting

Common failure modes for ma-N 440, answered from the manufacturer's datasheet and application notes. These are starting points — your substrate, tooling and environment shift the specifics, so calibrate on-tool.

Can I write ma-N 440 with a 405 nm source?

The sheet does not support it. It rates ma-N 400 for 300–380 nm, which is below 405 nm, and gives no dose at any wavelength. The 300–410 nm window on the same table belongs to the ma-N 1400 series. If your tool is 405 nm only, treat ma-N 440 as unrated there and run a dose test, or look at a grade whose sheet covers it.

SOURCE: ma-N 400 and ma-N 1400 sheet (micro resist technology GmbH…

ma-N 400 and ma-N 1400 sheet (micro resist technology GmbH, document code ls.15.06.18) — Technical data table, 'Spectral sensitivity' row, p.1

How do I get an undercut for lift-off with ma-N 440?

The sheet says the profile can be tuned from vertical to undercut and shows the trend on a 2 µm ma-N 400 film: 90 s of development gives no undercut, 100 s about 0.5 µm and 140 s about 1.5 µm. It does not say which developer or bakes produced those, and ma-N 440 is about twice as thick, so expect to find the develop time on test pieces and check the profile in section.

SOURCE: ma-N 400 and ma-N 1400 sheet (micro resist technology GmbH…

ma-N 400 and ma-N 1400 sheet (micro resist technology GmbH, document code ls.15.06.18) — profile photographs 'ma-N 400, 2 µm thick' and Unique features, p.1

—08 / Sources

Sources & disclaimer

Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-10-15.

Cite this recipe

NANYTE. "ma-N 440 process recipe." NANYTE Photoresist Library. https://nanyte.com/photoresists/ma-n-440. Accessed 2026-10-15.

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