https://nanyte.com/photoresists/eternal-laminar-udf2000 · last updated 2026-10-15
- Manufacturer
- Eternal Materials
- Grades
- UDF2040 · UDF20301
- Tone
- negative
- Thickness
- 29–38 µm
- Developer
- Na2CO3 0.85 % (range 0.7-1.0 %) or K2CO3 1.0 % (range 0.8-1.2 %)
- Applications
- Etch mask · Electroplating / molding
Cross-checked — the spin curve (where published) and the single-value figures were read twice, independently, from the datasheet, with any disagreement settled against it.
- Substrate
- Resist
- Exposed
Coating — dry-film lamination
LAMINAR UDF2000 is supplied as a pre-cut dry-film sheet and applied by hot-roll lamination — it is not spin-coated. Thickness is fixed per sheet, 29–38 µm, selected by sheet rather than by spin speed.
- These films are laminated, not spun, so thickness is set by the sheet.
- The datasheet gives two laminator setups (Table 1, p.2).
- Manual laminator: roll 90-120 °C, 1.0-3.0 m/min (3-10 ft/min), air-assist 35-50 psi, exit temperature 40-65 °C. Automatic cut-sheet laminator: roll 90-130 °C, 1.0-3.0 m/min, 35-50 psi, exit 40-65 °C, plus a seal step at 60-80 °C, 3.0-5.0 kg/cm² for 1-4 s.
- Fine-line work may call for preheating, slower speed and more pressure; too much of any of them pushes film into through-holes and thins the tent at the rim.
- After lamination, rack the panels apart and let them cool to room temperature before exposure; never stack them.
- Work under yellow light from lamination through development.
- Adhesion
- No adhesion promoter is discussed. The datasheet asks for a clean, dry, contaminant-free copper surface and lists jet pumice, Scotch-Brite, aluminium oxide spray, pumice brushing and chemical cleaning as workable (Surface preparation, p.1). Fine-line adhesion is plotted against step-tablet exposure in Figures 3 and 4 (pp.5-6).
Soft bake
- Soft bake
- Not published — characterize on-tool
- Notes
- No bake between lamination and exposure; the datasheet only asks for the laminated panel to cool to room temperature first (Handling and Hold Times, pp.2-3).
SOURCE: Lamination and Handling and Hold Times, pp.2-3, DFR0192-3
Exposure dose
LAMINAR UDF2000's dose is published per sheet thickness, not as a single number. Read the row for the sheet you laminate and run a dose array around it.
- As published
- Doses are set by the exposure tool: 12-35 mJ/cm² for the 38 µm sheet on a 375 nm laser setting, 22-58 on 405 nm, and 6-30 on a collimated lamp, each held to Stouffer 41 steps 16-25.
| Sheet | Dose |
|---|---|
| 29 µm | 9–30 mJ/cm² |
| 38 µm | 12–35 mJ/cm² |
SOURCE: Exposure parameters tables, pp.3-4: column 'Exposure energy…
Exposure parameters tables, pp.3-4: column 'Exposure energy set mode 375nm/405nm: 100/0'. UDF2030 9~30 mJ/cm² and UDF2040 12~35 mJ/cm². Both ranges span Stouffer 41 steps 16-25 on the resist, as confirmed by Figure 1 (p.4, printer Nuvogo800). No wavelength is given here because the table names a laser-mix setting of the printer, not a 365 nm line.
| Sheet | Dose |
|---|---|
| 29 µm | 20–50 mJ/cm² |
| 38 µm | 22–58 mJ/cm² |
SOURCE: Exposure parameters tables, pp.3-4: column 'Exposure energy…
Exposure parameters tables, pp.3-4: column 'Exposure energy set mode 375nm/405nm: 0/100' (all-405 nm laser setting). UDF2030 20~50 mJ/cm² and UDF2040 22~58 mJ/cm². Both ranges span Stouffer 41 steps 16-25 on the resist, as confirmed by Figure 1 (p.4, printer Nuvogo800).
| Sheet | Dose |
|---|---|
| 29 µm | 6–28 mJ/cm² |
| 38 µm | 6–30 mJ/cm² |
SOURCE: Exposure parameters tables, pp.3-4: column 'Collimated light'…
Exposure parameters tables, pp.3-4: column 'Collimated light'. UDF2030 6~28 mJ/cm² and UDF2040 6~30 mJ/cm². Figure 2 (p.5, printer ORC EXM-1201F 5KW) plots the same ranges. No wavelength or lamp spectrum is stated for this column.
Development
- Developer
- Na2CO3 0.85 % (range 0.7-1.0 %) or K2CO3 1.0 % (range 0.8-1.2 %)
- Method
- Conveyorized spray at 28-30 °C (range 25-34 °C), 1.5-1.7 kg/cm² (range 1.5-2.0 kg/cm², 22-30 psi) through high-impact direct-fan or cone nozzles, with the breakpoint at 55 % of the chamber length (range 50-70 %).
- Rinse
- Hard-water spray rinse (150-300 ppm CaCO3 equivalent) at 20-25 °C (range 15-30 °C) and 2.0 kg/cm² (range 1.2-2.5 kg/cm²), then hot-air dry.
- Developer family
- Buffered alkaline
Not published for this resist: Dilution, Time — characterize on-tool.
SOURCE: Development, 'Developing operation conditions' table, p.7, DFR0192-3
Hard bake, etch & strip
- Etch resistance
- Stated resistant to acidic etchants and described as performing well in acid etching (Features, p.1; Etching, p.9). Alkaline etchants are not mentioned for this series.
- Stripper
- 2.0-5.0 % NaOH or KOH, or a proprietary stripper, in an immersion or conveyorized process at 40-60 °C and 1.0-3.0 kg/cm² (15-45 psi) spray. Strip time at 2-5 % NaOH: UDF2040 39-84 s, UDF2030 24-41 s. The datasheet lists caustic concentration, temperature, plating overhang height, spray pressure, exposure level and hold time before stripping as the things that move the time. Stripping parameters table, p.9; Figure 11, p.10.
- Storage
- Store at 5-20 °C (41-68 °F) and 50 % relative humidity ± 10 % for the longest shelf life (Storage, p.10). No shelf-life duration is printed. Open the film only under controlled yellow light, do not reuse release or cover sheets, and avoid skin contact with unexposed resist (Safety and Handling, p.10).
Not published for this resist: Hard bake, Descum — characterize on-tool.
Where it's used
Practical notes from the datasheet
UDF2000 comes as two green sheets, 29 µm and 38 µm, that turn blue on exposure, and the datasheet recommends them for tent-and-etch and print-and-etch on both, with pattern plating listed for the 38 µm sheet. Because the datasheet prints doses for laser direct imaging and for a collimated lamp, the same film can go through either kind of printer. Resolution and fine-line adhesion are published as plots against the step-tablet step held, not as single numbers: on a Nuvogo800 laser printer, the 38 µm sheet resolves 30-44 µm lines-and-spaces across steps 16-25 and the 29 µm sheet 28-42 µm (Figures 5 and 6); fine-line adhesion improves with exposure, from about 36 µm lines at step 16 to 20 µm at step 25 for the 38 µm sheet (Figure 3, 400 µm spaces). Tune the exposure to a step-tablet target on your own copper and printer rather than carrying a dose across tools.
Troubleshooting
Common failure modes for LAMINAR UDF2000, answered from the manufacturer's datasheet and application notes. These are starting points — your substrate, tooling and environment shift the specifics, so calibrate on-tool.
Tents break over large holes after lamination. What does the datasheet say to change?
The tent is thinned when too much lamination pressure, too high a roll temperature or preheating pushes the film into the hole. Eternal's advice is to evaluate those settings with care on panels that have large tent holes, rather than turning all three up for conformation.
SOURCE: Eternal Materials, LAMINAR UDF2000 series datasheet DFR0192-3 (rev 2020/11/16) — Conformation, p.3
Resist scum and poor resolution after the developer has been running a while. Why?
As resist dissolves into the bath its pH drops and the breakpoint moves further down the chamber, so development becomes incomplete. The datasheet puts a batch bath due for replacement at 3.2-4.0 mil·ft²/L of loading (pH about 10.3, develop time 30 % longer than fresh); a feed-and-bleed line is kept at 1-2 mil·ft²/L and pH 10.8-10.6.
SOURCE: Eternal Materials, LAMINAR UDF2000 series datasheet DFR0192-3 (rev 2020/11/16) — Development, Resist Loading, p.8
Sources & disclaimer
- Eternal Materials — LAMINAR UDF2000 datasheet (Document DFR0192-3, 'Revised Date: 2020/11/16', printed on every page.) · accessed 2026-10-15
- LAMINAR UDF2000 series datasheet DFR0192-3 (revised 2020/11/16), Specification table, p.1: UDF2040 (38 ± 2 µm) and UDF2030 (29 ± 2 µm).
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-10-15.