https://nanyte.com/photoresists/az-p4620 · last updated 2026-07-10
- Manufacturer
- AZ Electronic Materials
- Tone
- positive
- Chemistry
- DNQ-novolak
- Thickness
- 6.9–14.8 µm
- Developer
- AZ 400K
- Applications
- Electroplating / molding
Unverified — not yet human-checked; values transcribed from the datasheet, characterize on-tool.
Spin coating
AZ P4620 is spin-coated to 6.9–14.8 µm. The curve below is redrawn from the manufacturer's published data — read your target thickness off the vertical axis and take the matching spin speed as a starting point.
Data points
| Series | rpm | µm |
|---|---|---|
| AZ P4620 as supplied | 1000 | 15 |
| 1500 | 12 | |
| 2000 | 10 | |
| 2500 | 8.9 | |
| 3000 | 8.0 | |
| 3500 | 7.4 | |
| 4000 | 6.9 |
Values are the manufacturer's starting points, not a guarantee; verify on your own tool. Characterize on-tool. Series digitized from a published figure were independently cross-checked by a second blind read; treat those values as approximate (±10 %).
read from figure, "AZ® P4620 Spin Speed Curve", p.26 of AZ P4620 Photoresist Data Package — single-product chart with one plotted series (unambiguous), softbake 110°C/180 s hotplate on 150 mm Si
Curve conditions per p.26: 150 mm silicon substrate, softbake 110°C/180 s hotplate. A separate multi-grade comparison chart (p.27, a lower-resolution scanned image) plots P4620 alongside P4903, P4400, P4330-RS, P4210 and P4110; at matching speeds it reads noticeably higher (~16.5 µm at 1000 rpm vs. 14.8 µm on the dedicated p.26 chart, an ~11% disagreement between the two figures in the same document). The p.26 chart was used as the published curve because it is the higher-precision, single-product source with unambiguous curve identity; the p.27 chart is noted here only as an internal-consistency flag for QC. No dispense volume, spin ramp, or edge-bead detail is published anywhere in this document.
- Adhesion
- HMDS not required — No HMDS or other adhesion-promoter step is mentioned anywhere in this datasheet.
- Rehydration
Soft bake
- Soft bake
- 110 °C · 3 min · hotplate
- Notes
SOURCE: p.4-6 of AZ P4620 Photoresist Data Package (AZ P4620 Copper plating process conditions)
Exposure dose
The manufacturer does not publish a clearing dose for AZ P4620. Determine it with a dose array on your own tool.
- As published
Not published for this resist: Dose at 365 nm, Dose at 405 nm — characterize on-tool.
Development
- Developer
- AZ 400K
- Dilution
- 1:4
- Time
- 5 min
- Method
- immersion
- Rinse
- Not published — characterize on-tool
- Developer family
- Buffered alkaline
SOURCE: AZ P4620 Copper plating process conditions, p.4-6 of AZ P4620 Photoresist Data Package (AZ 400K 1:4, immersion 300 s, 23°C)
Hard bake, etch & strip
Not published for this resist: Hard bake, Descum, Etch resistance, Stripper, Storage — characterize on-tool.
Where it's used
AZ P4620 is a DNQ-novolak (diazonaphthoquinone/novolak) positive resist from AZ's thick-film P4000 series, positioned in this datasheet for copper and gold electroplating molds rather than lift-off or etch masking. It develops in AZ 400K (a buffered, metal-ion-containing alkaline developer — the datasheet's own preferred choice) or, for finer-pitch stepper lithography, in AZ 300 MIF (TMAH, metal-ion-free). Softbake, exposure dose and develop time all scale with film thickness rather than following one fixed recipe: a 12 µm coat baked at 110°C/80 s takes roughly 900 mJ/cm² on a gh-line stepper, while a 24 µm two-layer coat (110°C/80 s then 115°C/180 s) needs roughly 1650-1950 mJ/cm². The 28 µm single-coat gold-plating process is the process worth flagging for a first-time user: it uses a two-stage softbake (100°C/500 s hotplate, then 90°C/180 min oven) followed by a 60-minute rehydration wait before exposure — a classic thick-DNQ step that is easy to skip and, if skipped, tends to cause scumming or adhesion failure at develop. As a non-chemically-amplified DNQ resist it needs no post-exposure bake.
Sources & disclaimer
- AZ Electronic Materials — AZ P4620 datasheet · accessed 2026-07-10
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-07-10.