https://nanyte.com/photoresists/az-p4620 · last updated 2026-07-26
- Manufacturer
- AZ Electronic Materials
- Tone
- positive
- Chemistry
- DNQ-novolak
- Thickness
- 6.9–14.8 µm
- Developer
- AZ 400K
- Applications
- Electroplating / molding
- Substrate
- Resist
- Exposed
Spin coating
Data points
| Series | rpm | µm | Published dose |
|---|---|---|---|
| AZ P4620 as supplied | 1000 | 15 | — |
| 1500 | 12 | — | |
| 2000 | 10 | — | |
| 2500 | 8.9 | — | |
| 3000 | 8.0 | — | |
| 3500 | 7.4 | — | |
| 4000 | 6.9 | — |
Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool. Series digitized from a published figure are approximate (±10 %).
Published dose is the datasheet’s own thickness bracket, quoted as printed — the full table and its citation are in the exposure section. A thickness the table does not cover shows nothing, and a thickness within 10 % of a bracket edge shows every bracket it could fall in.
read from figure, "AZ® P4620 Spin Speed Curve", p.26 of AZ P4620 Photoresist Data Package — single-product chart with one plotted series (unambiguous), softbake 110°C/180 s hotplate on 150 mm Si
- Curve conditions per p.26: 150 mm silicon substrate, softbake 110°C/180 s hotplate.
- A separate multi-grade comparison chart (p.27, a lower-resolution scanned image) plots P4620 alongside P4903, P4400, P4330-RS, P4210 and P4110; at matching speeds it reads noticeably higher (~16.5 µm at 1000 rpm vs. 14.8 µm on the dedicated p.26 chart, an ~11% disagreement between the two figures in the same document).
- The p.26 chart was used as the published curve because it is the higher-precision, single-product source with unambiguous curve identity; the p.27 chart is noted here only as an internal-consistency flag for QC.
- No dispense volume, spin ramp, or edge-bead detail is published anywhere in this document.
- Adhesion
- HMDS not required — No HMDS or other adhesion-promoter step is mentioned anywhere in this datasheet.
- Rehydration
- A 60-minute rehydration wait is specified after the two-stage softbake (100°C/500 s hotplate, then 90°C/180 min oven) in the 28 µm single-coat gold-plating process, before exposure.1
Soft bake
- Soft bake
- 110 °C · 3 min · hotplate
- Notes
- This is the most consistently repeated single-recipe softbake in the document (15 µm copper-plating process, p.4-6, and matches the spin-curve conditions on p.26).
SOURCE: p.4-6 of AZ P4620 Photoresist Data Package (AZ P4620 Copper plating process conditions)
Exposure dose
AZ P4620's dose is published against film thickness, not as a single number. Read the row for the film you coat and run a dose array around it.
- As published
- Every P4620 dose is tied to one film and one tool: 893 to 927 mJ/cm² for a 12 µm coat on a gh-line stepper, 630 mJ/cm² at 17 µm on a ghi-line contact aligner, 1574 to 1742 mJ/cm² for a 24 µm two-layer stack.
| Film thickness | Dose |
|---|---|
| 12 µm | 893–927 mJ/cm² |
| 24 µm | 1574–1742 mJ/cm² |
SOURCE: AZ P4620 Photoresist Data Package — Ultratech 1500 gh-line…
AZ P4620 Photoresist Data Package — Ultratech 1500 gh-line stepper: dense lines / contact holes in a 12 µm film (p.11) and in a 24 µm two-layer coat (p.19). Broadband gh-line, so no single exposure wavelength is claimed.
| Film thickness | Dose |
|---|---|
| 17 µm | 630 mJ/cm² |
SOURCE: AZ P4620 Photoresist Data Package — Canon PLA-501F ghi-line…
AZ P4620 Photoresist Data Package — Canon PLA-501F ghi-line contact aligner, 17 µm film (p.22). Broadband ghi-line, so no single exposure wavelength is claimed.
Development
- Developer
- AZ 400K
- Dilution
- 1:4
- Time
- 5 min
- Method
- immersion
- Rinse
- Not published — characterize on-tool
- Developer family
- Buffered alkaline
SOURCE: AZ P4620 Copper plating process conditions, p.4-6 of AZ P4620…
AZ P4620 Copper plating process conditions, p.4-6 of AZ P4620 Photoresist Data Package (AZ 400K 1:4, immersion 300 s, 23°C)
Hard bake, etch & strip
Not published for this resist: Hard bake, Descum, Etch resistance, Stripper, Storage — characterize on-tool.
Where it's used
Practical notes from the datasheet
AZ P4620 is a DNQ-novolak (diazonaphthoquinone/novolak) positive resist from AZ's thick-film P4000 series, positioned in this datasheet for copper and gold electroplating molds rather than lift-off or etch masking. It develops in AZ 400K (a buffered, metal-ion-containing alkaline developer — the datasheet's own preferred choice) or, for finer-pitch stepper lithography, in AZ 300 MIF (TMAH, metal-ion-free). Softbake, exposure dose and develop time all scale with film thickness rather than following one fixed recipe: a 12 µm coat baked at 110°C/80 s takes roughly 900 mJ/cm² on a gh-line stepper, while a 24 µm two-layer coat (110°C/80 s then 115°C/180 s) takes 1742 mJ/cm² for dense lines and 1574 mJ/cm² for contact holes (p.19). The 28 µm single-coat gold-plating process is the process worth flagging for a first-time user: it uses a two-stage softbake (100°C/500 s hotplate, then 90°C/180 min oven) followed by a 60-minute rehydration wait before exposure — a classic thick-DNQ step that is easy to skip and, if skipped, tends to cause scumming or adhesion failure at develop. As a non-chemically-amplified DNQ resist it needs no post-exposure bake.
Sources & disclaimer
- AZ Electronic Materials — AZ P4620 datasheet · accessed 2026-07-10
- AZ® P4620 Gold Plating Process, p.7 of AZ P4620 Photoresist Data Package
- Cheng et al.. Thick-film lithography using laser write. Microsystem Technologies (2002). doi:10.1007/s00542-002-0201-yAZ P4620 at 30 um thickness, over an AZ BARLi II anti-reflective coating, was patterned on a Heidelberg DWL 66 laser writer for LIGA x-ray masks. Multiple-writing schemes and defocus control were used to straighten sidewalls and suppress intensity fluctuation in the thick film.
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-07-26.