https://nanyte.com/photoresists/az-eci-3007 · last updated 2026-07-26
- Manufacturer
- Merck
- Tone
- positive
- Chemistry
- DNQ-novolak
- Thickness
- 0.6–1.1 µm
- Applications
- Etch mask · Electroplating / molding
Cross-checked — two independent extractions agree on the spin curve and the single-value figures.
- Substrate
- Resist
- Exposed
Spin coating
Data points
| Series | rpm | µm |
|---|---|---|
| AZ ECI 3007 | 1500 | 1.1 |
| 2000 | 0.95 | |
| 3000 | 0.75 | |
| 4000 | 0.65 | |
| 5000 | 0.60 |
Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool. Series digitized from a published figure are approximate (±10 %).
read from figure ("SPIN CURVES (150mm Wafers)"), p.1 of AZ ECI 3000 Series datasheet — legend-labeled "ECI 3007" (blue circle marker), clearly separated (~2x factor) from the ECI 3012 and ECI 3027 traces across the full 1500-5000 rpm plotted range.
- Multi-grade chart plots ECI 3007 / ECI 3012 / ECI 3027 together (legend, distinct colors, p.1); unlike some other multi-grade AZ charts, the three traces stay well-separated (roughly 2x factor between adjacent grades) across the whole 1500-5000 rpm range, so the ECI 3007 trace could be identified with reasonable confidence — but the reading is still a visual estimate from a plotted curve, not a printed numeric table, and no point is extrapolated past the 1500-5000 rpm plotted range.
- No spin accel/dispense parameters, no edge-bead removal procedure, and no rehydration hold are published for this grade; AZ EBR Solvent/AZ EBR 70/30 are listed only as companion thinning/edge-bead products (COMPANION PRODUCTS, p.2) with no protocol given.
- Rehydration is not applicable — this is a thin film (<1.2 µm), not a thick-DNQ resist.
- Adhesion
- HMDS recommended — "Oxide forming substrates (Si, etc.) should be primed with HMDS (hexamethyl disilazane) or other suitable primer prior to coating AZ ECI 3000." (SUBSTRATE PREPARATION, p.10).
Soft bake
- Soft bake
- 90–110 °C · 60 s
- Notes
- Soft bake is 90-110°C for 60 s; the higher end of the range improves adhesion to metals.
SOURCE: TYPICAL PROCESS, p.1; SOFT BAKE, p.10 of AZ ECI 3000 Series datasheet.
Exposure dose
The only exposure data for ECI 3007 is an i-line dose-to-clear curve that swings between roughly 40 and 70 mJ/cm² as film thickness changes — a thin-film interference effect, and a clearing dose rather than a process dose. Run a dose array on your own tool to land the working dose.
- Post-exposure bake
- 110 °C · 60 s–1.5 min
Not published for this resist: Dose at 365 nm, Dose at 405 nm — characterize on-tool.
Development
- Time
- 60 s
- Developer family
- TMAH or buffered alkaline
Not published for this resist: Developer, Dilution, Method, Rinse — characterize on-tool.
SOURCE: TYPICAL PROCESS, p.1; DEVELOPERS list, COMPANION PRODUCTS, p.2 of AZ ECI 3000 Series datasheet.
Hard bake, etch & strip
- Hard bake
- 100–115 °C
- Stripper
- AZ 100 Remover, AZ 300T, AZ 400T, or AZ Kwik Strip™ (STRIPPING, p.10): "AZ ECI 3000 strips readily in removers designed for DNQ/novolac type photoresists." Patterns baked above 140°C may cross-link and become harder to strip.
Not published for this resist: Descum, Etch resistance, Storage — characterize on-tool.
SOURCE: HARD BAKE, p.10 of AZ ECI 3000 Series datasheet.
Where it's used
Practical notes from the datasheet
AZ ECI 3007 is a general-purpose, i-line/g-line cross-over positive resist for thin (0.6-1.15 µm), high-throughput plasma/RIE and wet-etch masking — the thinnest of three grades (3007/3012/3027) in Merck's AZ ECI 3000 series, sharing chemistry, developer compatibility, and process temperature windows with its siblings. The datasheet resolves no grade-specific reference process for ECI 3007 itself — every worked exposure/PEB/develop example is built around ECI 3012 or ECI 3027 instead — so soft bake, PEB, and develop here fall back to the series-wide Typical Process line rather than a grade-specific table. The only ECI 3007-specific exposure data is a thin-film-interference (dose-to-clear swing) curve (p.6), which is a physical clearing-dose artifact, not a stated process dose; treat the series' 365-436 nm exposure window as a starting point and run a dose array rather than expect a single vendor number. Like the rest of the series it is a DNQ/novolac positive resist compatible with both TMAH (MIF) and inorganic developers, stripping in standard DNQ/novolac removers, with wet-etch and plating adhesion called out as target applications.
Grades in this family
Other grades in the AZ ECI 3000 series line differ mainly in coating thickness:
| Grade | Thickness | Exposure dose |
|---|---|---|
| AZ ECI 3007 (this page) | 0.6–1.1 µm | — |
| AZ ECI 3012 | 1.1–1.9 µm | 220 mJ/cm² @ 436 nm |
| AZ ECI 3027 | 2.4–4.4 µm | 262 mJ/cm² @ 365 nm |
Sources & disclaimer
- Merck — AZ ECI 3007 datasheet (Rev. (03/21)) · accessed 2026-07-10
- Lipp et al.. Aperture-Controlled Fabrication of All-Dielectric Structural Color Pixels. ACS Applied Materials & Interfaces (2023). doi:10.1021/acsami.3c03353750 nm ECI 3007 patterned on a maskless writer to tune structural color
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-07-26.