https://nanyte.com/photoresists/apol-lo-3200 · last updated 2026-07-10
- Manufacturer
- KemLab
- Tone
- negative
- Thickness
- 2–10 µm
- Developer
- 0.26N TMAH
- Applications
- Lift-off · General prototyping
Human-verified — checked against the manufacturer's datasheet by a person.
Spin coating
KemLab APOL-LO 3200 is spin-coated to 2–10 µm. The curve below is redrawn from the manufacturer's published data — read your target thickness off the vertical axis and take the matching spin speed as a starting point.
Data points
| Series | rpm | µm |
|---|---|---|
| APOL-LO 3202 | 1000 | 3.8 |
| 2000 | 2.7 | |
| 3000 | 2.3 | |
| 4000 | 1.9 | |
| APOL-LO 3204 | 1000 | 6.2 |
| 2000 | 4.5 | |
| 3000 | 3.7 | |
| 4000 | 3.2 | |
| APOL-LO 3207 | 1000 | 10 |
| 2000 | 7.2 | |
| 3000 | 5.7 | |
| 4000 | 5.0 |
Values are the manufacturer's starting points, not a guarantee; verify on your own tool. Characterize on-tool. Series digitized from a published figure were independently cross-checked by a second blind read; treat those values as approximate (±10 %).
APOL-LO 3202: read from figure 'Spin Curve: APOL-LO 3200 Series', p.2 of APOL-LO 3200 TDS — identified by legend marker/color (blue diamonds = APOL-LO 3202) on the combined three-curve chart; bottom curve, consistent with the stated 2-4 µm range. The chart itself only plots 1000-4000 rpm (4 marked points per curve) — no 5000/6000 rpm points exist in the source to report.
APOL-LO 3204: read from figure 'Spin Curve: APOL-LO 3200 Series', p.2 of APOL-LO 3200 TDS — identified by legend marker/color (red squares = APOL-LO 3204) on the combined three-curve chart; middle curve, consistent with the stated 3-6 µm range. Chart plots only 1000-4000 rpm.
APOL-LO 3207: read from figure 'Spin Curve: APOL-LO 3200 Series', p.2 of APOL-LO 3200 TDS — identified by legend marker/color (purple triangles = APOL-LO 3207) on the combined three-curve chart; top curve, consistent with the stated 5-10+ µm range. Chart plots only 1000-4000 rpm.
Coat program includes a 5-10 second spread cycle; spin time at final speed is 45 seconds. Spin curves determined on 6-inch Si with static dispense of ~3 mL of photoresist (TDS p.2, Spin Coat) — note this is a smaller dispense volume than the ~4 mL used for KemLab's other series datasheets. No edge-bead-removal step is published.
- Adhesion
Soft bake
- Soft bake
- 110 °C · 60 s · hotplate
- Notes
SOURCE: Lift-Off Process Guide table and Soft Bake section, p.2 of APOL-LO 3200 TDS
Exposure dose
The manufacturer does not publish a clearing dose for KemLab APOL-LO 3200. Determine it with a dose array on your own tool.
- As published
- Post-exposure bake
- 110 °C · 60 s
Not published for this resist: Dose at 365 nm, Dose at 405 nm — characterize on-tool.
Development
- Developer
- 0.26N TMAH
- Developer family
- TMAH-based
Not published for this resist: Dilution, Time, Method, Rinse — characterize on-tool.
SOURCE: Lift-Off Process Guide table, p.2, and Develop section, p.3 of APOL-LO 3200 TDS
Hard bake, etch & strip
- Stripper
- Storage
- Store upright in tightly closed containers at 40-70°F (4-21°C), away from oxidizers, acids, bases and ignition sources (TDS p.3, Storage).
Not published for this resist: Hard bake, Descum, Etch resistance — characterize on-tool.
Where it's used
APOL-LO 3200 is a series of three grades (APOL-LO 3202, 3204, 3207) explicitly engineered for a lift-off undercut profile, with customization offered to adjust the lift-off angle or photospeed. Unlike most conventional positive resists, PEB here is a required crosslinking step, not an optional one — the datasheet flags that PEB conditions 'can be changed to modify performance,' making it a tunable process lever rather than a fixed step. Softbake and PEB share one explicit thickness break point: films over 7 µm (i.e. the APOL-LO 3207 10 µm process point) get 90 s instead of 60 s at the same 110°C, while exposure dose and develop time scale continuously with thickness across all four demonstrated process points (2/4/6/10 µm). An n,k optical-dispersion curve (200-500 nm) is published for lithography simulation. As with any lift-off resist, the achieved undercut profile — not just critical dimension — should be verified on-tool, since it is the property this product is specifically sold on.
Sources & disclaimer
- KemLab — KemLab APOL-LO 3200 datasheet (not stated — no revision or copyright date is printed anywhere in this TDS; the only certification mark present is an ISO 9001:2015 seal on the final page.) · accessed 2026-07-10
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-07-10.