https://nanyte.com/photoresists/spr220-7 · last updated 2026-07-26
- Manufacturer
- Rohm and Haas Electronic Materials
- Tone
- Not photoimageable (underlayer)
- Chemistry
- DNQ-novolak
- Thickness
- 5.5–52 µm
- Developer
- MF-24A (0.24N MIF — metal-ion-free TMAH developer)
- Applications
- Etch mask · Electroplating / molding · MEMS structural
Spin coating
Data points
| Series | rpm | µm | Published dose |
|---|---|---|---|
| SPR220-7.0 (8" wafer, Figure 4) | 150 | 52 | — |
| 250 | 39 | — | |
| 500 | 22 | — | |
| 750 | 17 | — | |
| 1000 | 14 | — | |
| 1500 | 11 | — | |
| 2000 | 9.3 | — | |
| 2500 | 8.3 | — | |
| SPR220-7.0 (4" wafer, Figure 3) | 1500 | 10 | — |
| 2000 | 9.0 | — | |
| 3000 | 7.5 | — | |
| 4000 | 6.5 | — | |
| 5000 | 5.9 | — | |
| 6000 | 5.5 | — |
Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool. Series digitized from a published figure are approximate (±10 %).
Published dose is the datasheet’s own thickness bracket, quoted as printed — the full table and its citation are in the exposure section. A thickness the table does not cover shows nothing, and a thickness within 10 % of a bracket edge shows every bracket it could fall in.
SPR220-7.0 (8" wafer, Figure 4): read from figure 4 "Spin Speed Curve, SPR220-7.0 on 8"", p.2 of Rohm and Haas "MEGAPOSIT SPR220 Series Photoresists" datasheet (ME04N097, Rev. 2, Sept. 2004; UC Davis CNM2 mirror). This figure plots a single curve for SPR220-7.0 only, so there is no grade-identification ambiguity; all 8 published markers are reported. The datasheet's own text states "a 375 RPM spin will yield a film thickness of approximately 30 µm," which interpolates consistently between this curve's 250 rpm (39.3 µm) and 500 rpm (22 µm) points.
SPR220-7.0 (4" wafer, Figure 3): read from figure 3 "Spin Speed Curves on 4"", p.2 of the same datasheet. Chart plots five curves; SPR220-7.0 identified as the filled-circle series, the topmost (thickest-film) curve, consistent with legend position (listed first) and its numeric name being the highest-viscosity grade shown. 6 of the 10 available markers are reported (1500, 2000, 3000, 4000, 5000, 6000 rpm). Where this chart overlaps figure 4 the two published figures agree within ~4%: 1500 rpm reads 10.1 µm here vs. 10.5 µm on the 8-inch chart, and 2000 rpm reads 9.0 µm here vs. 9.3 µm on the 8-inch chart.
- Figure 3 (4-inch wafer) and Figure 4 (8-inch/200 mm wafer, SPR220-7.0 only) are separate empirical curves for the same grade; both are reported above rather than merged, since they come from different substrates/tool runs.
- Coat uniformity is reported at 7.31 µm: standard deviation 0.036 µm across 33 points (source figure/wafer size for this uniformity measurement is not stated).
- Nominal film thickness may vary slightly with process, equipment, and ambient conditions, per the datasheet's own caveat under "Coat", p.2.
- Adhesion
- HMDS recommended — "A hexamethyldisilizane (HMDS)-based MICROPOSIT primer is recommended to promote adhesion with substrates that require such treatment.1
- Rehydration
- "With thicker films (above 4 µm), a hold time is used between exposure and PEB to allow water (which is necessary to complete the photo-reaction) to diffuse back into the photoresist film.2
Soft bake
- Soft bake
- 115 °C · 1.5 min · hotplate
- Notes
- "For films greater than 4.0 µm, use a 30 second ramp in temperature (step-down to hotplate) to 115°C and hold for a minimum of 90 seconds." SPR220-7.0's 7.0 µm nominal thickness falls in this bin (a direct match, not a picked bin midpoint) — a 30-second temperature step-down ramp precedes the 90-second hold at 115°C. (Films >12 µm instead require a 300-second minimum hold — not applicable at the 7.0 µm nominal thickness.) Table 1 independently confirms for the 4.0-10.0 µm thickness class: "30 sec. step-down to 115°C/90 sec. Contact Hotplate."
SOURCE: "Softbake" section, p.2, and Table 1 "Recommended Process Conditions" (4.0-10.0 µm column), p.1
Exposure dose
Megaposit SPR 220-7.0's dose is published against film thickness, not as a single number. Read the row for the film you coat and run a dose array around it.
- As published
- A 7.0 µm film sizes at 470 mJ/cm², but that is a g-line number; the published i-line photospeeds stop at 5.0 µm and 380 mJ/cm², so no i-line figure exists at this grade's full thickness.
- Post-exposure bake
- 115 °C · 1.5 min
Not published for this resist: Dose at 365 nm, Dose at 405 nm — characterize on-tool.
| Film thickness | Dose |
|---|---|
| 7 µm | 470 mJ/cm² |
SOURCE: Table 2 "Photospeed and Linearity of Dense Lines/Spaces at…
Table 2 "Photospeed and Linearity of Dense Lines/Spaces at Various Thicknesses", p.1 — the g-Line (436 nm) row at a 7.0 µm film thickness, which is this grade's nominal reference thickness (the same thickness label Table 6 uses for it).
Development
- Developer
- MF-24A (0.24N MIF — metal-ion-free TMAH developer)
- Dilution
- 0.24N (MF-24A is the 0.24N-normality developer in Rohm and Haas's MF line; SPR220 is "optimized for 0.24N developers", with 0.26N (MF-26A) offered as an alternative for thicker films or high-throughput processes)
- Time
- 2 min
- Method
- puddle
- Rinse
- Not published — characterize on-tool
- Developer family
- TMAH or buffered alkaline
SOURCE: Table 6 "Recommended Develop Conditions" (7.0 µm FT column), p.3
Hard bake, etch & strip
- Etch resistance
- "Excellent wet and dry etch adhesion" (Advantages, p.1).
- Stripper
- MICROPOSIT REMOVER 1165, two-bath process, each bath at 80°C (176°F): the first bath removes the bulk of the photoresist, the second removes residual traces.3
- Storage
- "Recommended storage for SPR220 is in an upright position in a dry area at 40-60°F (4-15°F). Keep away from oxidizers, acids, and bases.4
Not published for this resist: Hard bake, Descum — characterize on-tool.
Where it's used
Practical notes from the datasheet
SPR220-7.0 is the thickest-nominal grade in the MEGAPOSIT SPR 220 line pictured in this datasheet, spin-coating from roughly 5 µm up to 50+ µm depending on speed and wafer size (two separately measured curves, on 4-inch and 8-inch wafers, are both captured above and agree within a few percent where they overlap). Its most easily-missed processing step is the mandatory minimum 35-minute ambient hold between exposure and PEB — water must diffuse back into the film to complete the photoreaction, and skipping this wait is a well-known way to get an incomplete or inconsistent PEB result with this resist family. The exposure-dose table only publishes i-Line numbers up to a 5.0 µm reference thickness, so there is no clean i-Line dose match at this grade's 7.0 µm nominal thickness; the nearest published numbers (g-Line 470 mJ/cm² at exactly 7.0 µm, or i-Line 380 mJ/cm² at 5.0 µm) each mismatch on either wavelength or thickness, and are quoted only as context. The lineage of this resist family is worth noting for provenance purposes: Shipley Company originated the SPR line, was acquired into Rohm and Haas Electronic Materials (the entity printed on this 2004 datasheet), which was in turn acquired by Dow Chemical (2009), then spun into DuPont Electronics & Imaging, and the MEGAPOSIT/MICROPOSIT/MF brand family is now sold by Kayaku Advanced Materials — the same corporate family that owns MicroChem/KMPR and SU-8. Tone and base chemistry are not stated anywhere in this particular datasheet. Chemistry classified as dnq-novolak from the Dow MEGAPOSIT SPR220-3.0 MSDS composition table (same MEGAPOSIT SPR220 line: cresol novolak resin + diazo photoactive compound).
Grades in this family
Other grades in the MEGAPOSIT SPR 220 series line differ mainly in coating thickness:
| Grade | Thickness | Exposure dose |
|---|---|---|
| Megaposit SPR 220-3.0 | 2.3–4.6 µm | 310 mJ/cm² @ 365 nm |
| Megaposit SPR 220-7.0 (this page) | 5.5–52 µm | — |
Troubleshooting
Common failure modes for Megaposit SPR 220-7.0, answered from the manufacturer's datasheet and application notes. These are starting points — your substrate, tooling and environment shift the specifics, so calibrate on-tool.
Why does SPR 220-7.0 need a wait between exposure and PEB?
Because it is a thick film: water must diffuse back into the resist to complete the photoreaction, so films above 4 µm need a minimum 35-minute ambient hold between exposure and PEB. SPR 220-7.0's 7.0 µm nominal thickness is above that threshold, so the 35-minute hold applies (a thicker low-rpm coat past 12 µm would need 120 minutes). It sits between two steps rather than being a bake, so it is easy to skip — don't.
SOURCE: Rohm and Haas MEGAPOSIT SPR220 Series datasheet (ME04N097, Rev. 2, Sept. 2004) — Post-Exposure Bake section, p.3
What softbake and PEB does SPR 220-7.0 use?
For films over 4.0 µm — which includes the 7.0 µm nominal grade — soft bake with a 30-second temperature step-down ramp to 115°C, then hold at least 90 seconds on a contact hotplate. PEB runs at the same temperature: 115°C for 90 seconds. The PEB bake is separate from, and follows, the mandatory 35-minute exposure-to-PEB moisture-diffusion hold.
SOURCE: Rohm and Haas MEGAPOSIT SPR220 Series datasheet (ME04N097…
Rohm and Haas MEGAPOSIT SPR220 Series datasheet (ME04N097, Rev. 2, Sept. 2004) — Softbake and Post-Exposure Bake sections + Table 1, p.1–3
Which developer and develop time does SPR 220-7.0 use?
MF-24A, a 0.24N metal-ion-free TMAH developer, applied as a 60/60-second double spray puddle — two sequential 60-second puddles, 120 seconds total. SPR 220 is optimized for 0.24N developers; MF-26A (0.26N) is offered as an alternative for thicker films or high-throughput processes. No rinse chemistry is specified in the datasheet.
SOURCE: Rohm and Haas MEGAPOSIT SPR220 Series datasheet (ME04N097…
Rohm and Haas MEGAPOSIT SPR220 Series datasheet (ME04N097, Rev. 2, Sept. 2004) — Table 6 Recommended Develop Conditions (7.0 µm FT), p.3
What exposure dose should I use for SPR 220-7.0?
The datasheet publishes no clean i-line dose at 7.0 µm — its i-line rows stop at 5.0 µm (380 mJ/cm²), and the nearest exact-thickness figure is g-line 470 mJ/cm² at 7.0 µm. Neither matches on both wavelength and thickness, so treat them as context and calibrate on-tool. For films thicker than 12 µm the datasheet gives 700–1,300 mJ/cm² measured at 365 nm.
SOURCE: Rohm and Haas MEGAPOSIT SPR220 Series datasheet (ME04N097…
Rohm and Haas MEGAPOSIT SPR220 Series datasheet (ME04N097, Rev. 2, Sept. 2004) — Table 2 photospeed + thick-film exposure guidance, p.1–2
Sources & disclaimer
- Rohm and Haas Electronic Materials — Megaposit SPR 220-7.0 datasheet (ME04N097, Rev. 2, September 2004 (printed on p.1 and in the footer)) · accessed 2026-07-10
- https://asrc.gc.cuny.edu/wp-content/uploads/media/global-assets/Megaposit-SPR-220-3.0-Positive-Photoresist-MSDS.pdf — Dow MEGAPOSIT SPR220-3.0 MSDS (same MEGAPOSIT SPR220 line) states 'Cresol novolak resin 25.0-35.0%, Diazo Photoactive Compound 1.0-10.0%'; the basis for classifying SPR220-7.0 as dnq-novolak.
- "Substrate", p.2.
- "Post-Exposure Bake" section, p.3
- "Photoresist Removal", p.4.
- "Storage", p.4.
- Kukharenka et al.. Realization of electroplating molds with thick positive SPR 220-7 photoresist. Journal of Materials Science: Materials in Electronics (2003). doi:10.1023/A:1023923911921Realizes 34-54 um multi-coat SPR 220-7 films as electroplating molds for MEMS metal structures.
- Koukharenko et al.. A comparative study of different thick photoresists for MEMS applications. Journal of Materials Science: Materials in Electronics (2005). doi:10.1007/s10854-005-4977-2Benchmarks thick MEMS resists (SPR 220-7, SU-8, Ordyl P-50100 dry film, Diaplate 132) as electroplating molds; SPR 220-7 gives about 50 um molds for alkaline electroplating as an easier-to-strip alternative to SU-8.
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-07-26.