https://nanyte.com/photoresists/kl-ir · last updated 2026-07-26
- Manufacturer
- KemLab, Inc.
- Tone
- image reversal
- Chemistry
- DNQ-novolak
- Thickness
- 1.2–2.6 µm
- Developer
- 0.26N TMAH
- Applications
- Image reversal · General prototyping
- Substrate
- Resist
- Exposed
Spin coating
Data points
| Series | rpm | µm |
|---|---|---|
| KL IR 15 | 1000 | 2.6 |
| 2000 | 1.8 | |
| 3000 | 1.4 | |
| 4000 | 1.3 | |
| 5000 | 1.1 |
Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool. Series digitized from a published figure are approximate (±10 %).
read from figure captioned 'Spin Curve' (referenced in text as Figure 3), p.2 of KL IR 15 TDS. Single unambiguous curve — only one grade/SKU is plotted, no multi-curve legend to disambiguate. Axis range (1.00-2.80 µm, 0-6000 rpm) and curve shape are consistent with the stated 1.2-2.6 µm film-thickness range.
- Spin curve determined on 6-inch Si with static dispense of ~4 mL of KL IR 15 resist (TDS p.2, Coat).
- No spin ramp/accel profile or edge-bead-removal step is published.
- A closely related sibling SKU, KL IR LO 15 (lift-off variant, separate TDS, Rev 10-2023), publishes a similarly-shaped spin curve on the same axis scale but is a distinct product literature and was not used to source any value here.
- Adhesion
- HMDS recommended — HMDS primer is recommended with oxide-forming substrates (Si, etc.); KL IR adheres to silicon, copper, gold, glass, aluminum and chromium (TDS p.1, Substrate Preparation, in both the Negative and Positive Resist Mode tables).
Soft bake
- Soft bake
- 105 °C · 1.5 min · hotplate
- Notes
- Single softbake condition (105°C, 90 sec) is common to both positive-mode and negative-mode processing guidelines (TDS p.1-2).
SOURCE: Negative Resist Mode Processing Guidelines table, p.1, and…
Negative Resist Mode Processing Guidelines table, p.1, and Positive Resist Mode Processing Guidelines table, p.2 of KL IR 15 TDS
Exposure dose
In reversal (negative) mode the image exposure is 120 mJ/cm² broadband before the reversal bake; used as a straight positive resist the only published figure is an approximate 70 mJ/cm² on a 1.5 µm film. Run a dose array on your own tool to land the working dose.
- Post-exposure bake
- 115 °C · 60 s
Not published for this resist: Dose at 365 nm, Dose at 405 nm — characterize on-tool.
Development
- Developer
- 0.26N TMAH
- Time
- 45–60 s
- Method
- puddle
- Developer family
- TMAH-based
Not published for this resist: Dilution, Rinse — characterize on-tool.
SOURCE: Negative Resist Mode Processing Guidelines table, p.1, and…
Negative Resist Mode Processing Guidelines table, p.1, and Positive Resist Mode Processing Guidelines table, p.2 of KL IR 15 TDS
Hard bake, etch & strip
- Stripper
- KL Photoresist Remover, or industry-standard removers such as NMP or DMSO-based strippers, at 50-80°C (TDS p.1 spec box; p.3 Resist Removal); thicker films may benefit from a two-bath process — first bath removes bulk resist, second bath cleans thoroughly.
- Storage
- Avoid light; store in an upright airtight container at 4-21°C, away from oxidizers, acids, bases and ignition sources (TDS p.3, Storage — the document's own wording says 'Keep developer away from oxidizers...', apparently a boilerplate carryover referring to the resist itself).
Not published for this resist: Hard bake, Descum, Etch resistance — characterize on-tool.
SOURCE: Negative Resist Mode Processing Guidelines table, p.1, and…
Negative Resist Mode Processing Guidelines table, p.1, and Positive Resist Mode Processing Guidelines table, p.2 of KL IR 15 TDS
Where it's used
Practical notes from the datasheet
KL IR 15 is a dual-tone image-reversal resist: exposed through a mask, it can be processed as either a positive resist (softbake -> exposure -> PEB at 115°C/60s -> develop -> optional 115°C/60s hardbake) or, via an added reversal bake and flood exposure, as a negative resist with the opposite tone (softbake -> exposure -> reversal bake at 130°C/120s -> flood exposure -> develop -> optional 130°C/60s hardbake). The reversal-bake temperature is explicitly called out by the manufacturer as the single most process-sensitive parameter (±1°C tolerance), while the flood exposure is explicitly non-critical over a 150-300 mJ/cm2 window — the opposite of the usual intuition that exposure dose is the sensitive knob. KemLab also sells a separate, distinct SKU, KL IR LO 15, whose own TDS (same Rev 10-2023 date) markets it specifically for lift-off-profile negative processing and states it 'can replace AZ 5214E'; the plain KL IR 15 datasheet used here makes no equivalent lift-off-profile claim. Negative mode is described as having 'excellent thermal stability' and being 'optimized for metallization processes.' Chemistry classified as dnq-novolak from the KemLab KL IR TDS's classic DNQ image-reversal process (reversal bake + flood exposure) and family SDS composition data (mixed cresol novolak resin + diazo photoactive compound).
Sources & disclaimer
- KemLab, Inc. — KL IR 15 datasheet (Copyright 2023 © KemLab, Inc., Rev 10-2023) · accessed 2026-07-10
- https://www.kemlab.com/_files/ugd/5b8579_45ff748fc0894fa094a12c113747f6ef.pdf — KemLab KL IR TDS shows the classic DNQ image-reversal process (reversal bake + flood exposure); the family SDS lists mixed cresol novolak resin + diazo photoactive compound, the basis for classifying KL IR as dnq-novolak.
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-07-26.