https://nanyte.com/photoresists/kl-5300 · last updated 2026-07-26
- Manufacturer
- KemLab Inc.
- Grades
- KL5315 · KL5310 · KL5305 · KL5302-HiRes1
- Tone
- positive
- Chemistry
- DNQ-novolak
- Thickness
- 0.1–2.5 µm
- Developer
- 0.26N TMAH
- Applications
- General prototyping · Etch mask
Cross-checked — two independent extractions agree on the spin curve and the single-value figures.
- Substrate
- Resist
- Exposed
Spin coating
Data points
| Series | rpm | µm |
|---|---|---|
| KL5315 | 1000 | 2.4 |
| 2000 | 1.7 | |
| 3000 | 1.4 | |
| 4000 | 1.2 | |
| 5000 | 1.1 | |
| KL5310 | 1000 | 1.4 |
| 2000 | 0.98 | |
| 3000 | 0.80 | |
| 4000 | 0.70 | |
| 5000 | 0.63 | |
| KL5305 | 1000 | 0.92 |
| 2000 | 0.62 | |
| 3000 | 0.53 | |
| 4000 | 0.47 | |
| 5000 | 0.43 | |
| KL5302-HiRes | 1000 | 0.27 |
| 2000 | 0.19 | |
| 3000 | 0.16 | |
| 4000 | 0.14 | |
| 5000 | 0.13 |
Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool. Series digitized from a published figure are approximate (±10 %).
KL5315: read from figure 3, p.2 of KL 5300 series TDS — identified by legend color (blue = KL5315) on the combined 'KL5300 Spin Curve' chart; the topmost curve, consistent with KL5315 having the largest stated film-thickness range (1.2-2.5 µm).
KL5310: read from figure 3, p.2 of KL 5300 series TDS — identified by legend color (red = KL5310) on the combined 'KL5300 Spin Curve' chart; second curve from top, consistent with the stated 0.7-1.5 µm range.
KL5305: read from figure 3, p.2 of KL 5300 series TDS — identified by legend color (green = KL5305) on the combined 'KL5300 Spin Curve' chart; third curve from top, consistent with the stated 0.4-1.0 µm range.
KL5302-HiRes: read from figure 4, p.2 of KL 5300 series TDS — a dedicated single-curve 'KL5302 HI-RES Spin Curve' chart (purple, unambiguous, no other grade plotted), consistent with the stated 0.15-0.3 µm range.
- Spin curves determined on 6-inch Si with static dispense of ~4 mL of KL5300 photoresist (TDS p.2).
- No spin ramp/accel profile or edge-bead-removal step is published for KL5300.
- Adhesion
- HMDS recommended — HMDS primer recommended with oxide-forming substrates (Si, etc.) for maximum adhesion; KL5300 also adheres to copper, gold, glass, aluminum and chromium (TDS p.1, Substrate Preparation).
Soft bake
- Soft bake
- 105 °C · 60 s · hotplate
- Notes
- Processing-guidelines table (p.1) gives a single softbake condition, 105°C for 60 seconds, applied uniformly across all four grades.
SOURCE: Processing Guidelines table, p.1 of KL 5300 series TDS; corroborated by Softbake section, p.3.
Exposure dose
Each grade in the family carries its own broadband dose: 30 mJ/cm² for KL5305, 35 for KL5310, 40 for KL5315 and 60 for KL5302-HiRes. No single number covers the family. Run a dose array on your own tool to land the working dose.
- Post-exposure bake
- 115 °C · 60 s
Not published for this resist: Dose at 365 nm, Dose at 405 nm — characterize on-tool.
Development
- Developer
- 0.26N TMAH
- Developer family
- TMAH-based
Not published for this resist: Dilution, Time, Method, Rinse — characterize on-tool.
SOURCE: Processing Guidelines table, p.1, and Development section, p.4 of KL 5300 series TDS
Hard bake, etch & strip
- Stripper
- NMP, DMSO or similar solvent-based removers at 50-80°C (TDS p.1/p.4, Resist Removal); thicker films may benefit from a two-bath process — first bath removes bulk resist, second bath cleans thoroughly.
- Storage
- Avoid light; store in an upright airtight container at 4-21°C, away from oxidizers, acids, bases and ignition sources (TDS p.4, Storage).
Not published for this resist: Hard bake, Descum, Etch resistance — characterize on-tool.
SOURCE: Processing Guidelines table, p.1 of KL 5300 series TDS
Where it's used
Practical notes from the datasheet
KL5300 is a series of four grades (KL5315, KL5310, KL5305, KL5302-HiRes) sharing one process family but with distinct spin curves, doses and develop times scaled to their target thickness band, from ~0.15 µm (KL5302-HiRes, high-resolution thin coat) up to 2.5 µm (KL5315). The datasheet's optical characterization (refractive index vs. wavelength, absorbance, i-line/g-line swing curves) is series-wide rather than grade-specific. As with any DNQ-class positive resist family, softbake and PEB times should be re-verified on-tool since the datasheet's single softbake/PEB condition is applied uniformly across grades of very different viscosity and coat thickness. HMDS priming is recommended on oxide-forming substrates; no adhesion promoter step beyond that is specified. Chemistry classified as dnq-novolak from the KemLab KL5300 MSDS composition table (mixed cresol novolak resin + diazo photoactive compound).
Sources & disclaimer
- KemLab Inc. — KL 5300 series datasheet (Copyright 2022 © KemLab Inc., Rev 1-2022) · accessed 2026-07-10
- https://www.nanofab.utah.edu/wp-content/uploads/2018/08/Positive-PhotoResist-%E2%80%93-KL5300-KemLab-27Feb15_v1.pdf — KemLab KL5300 MSDS states 'Mixed cresol novolak resin <25.0%, Diazo Photoactive Compound <4.0%'; the basis for classifying KL5300 as dnq-novolak.
- KL5300 Positive Photoresist TDS, 'PROCESSING GUIDELINES' table (p.1), column headers: KL5315, KL5310, KL5305, KL5302-HiRes, each with its own film-thickness range.
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-07-26.